Resources Contact Us Home
Apparatus for treating plastic loads

Image Number 3 for United States Patent #3993529.

A die assembly incorporating a resilient die face and/or backing for sealing and/or patterning or texturing plastic and other like material through the use of RF heating. The die face contains all of the texturing, embossing, printing and the like of the surface of the material or object being simulated. The die face and/or the resilient backing material are imbedded or otherwise provided or formed with conductive and/or resistive material to enhance the dielectric heating operation, as well as to provide heat flow toward the plastic load immediately upon the institution of the RF heating operation.The resilient die faces may be integrated with the cutting edges forming fixed or compound die assemblies for cutting and/or sealing operations which may be performed substantially contemporaneously with the patterning or texturing operations.

  Recently Added Patents
Discharge circuit and method
Method for decoding a spatially multiplexed data signal using a maximum likelihood detection
Arbitration circuit to arbitrate conflict between read/write command and scan command and display driver integrated circuit having the same
Image forming apparatus and control method therefor
Touch panel structure and manufacturing method thereof
Adding value to a rendered document
Method and apparatus for visual neural stimulation
  Randomly Featured Patents
Dehydrocyclization with an acidic multimetallic catalytic composite
Track system to be fastened to a groove in a spar
Broadcast reception device and contract management device using common master key in conditional access broadcast system
Paper articles exhibiting water resistance and method for making same
Portable ball batting practice apparatus
Printing apparatus
Motor vehicle gearbox with one-way clutch in first gear
Method of fabricating semiconductor device
Device for treating a web
Pulse width rotary inverter