 |
|
 |
| |
Image Number 3 for United States Patent #3993529.
A die assembly incorporating a resilient die face and/or backing for sealing and/or patterning or texturing plastic and other like material through the use of RF heating. The die face contains all of the texturing, embossing, printing and the like of the surface of the material or object being simulated. The die face and/or the resilient backing material are imbedded or otherwise provided or formed with conductive and/or resistive material to enhance the dielectric heating operation, as well as to provide heat flow toward the plastic load immediately upon the institution of the RF heating operation.The resilient die faces may be integrated with the cutting edges forming fixed or compound die assemblies for cutting and/or sealing operations which may be performed substantially contemporaneously with the patterning or texturing operations.
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
