Resources Contact Us Home
Apparatus for treating plastic loads

Image Number 3 for United States Patent #3993529.

A die assembly incorporating a resilient die face and/or backing for sealing and/or patterning or texturing plastic and other like material through the use of RF heating. The die face contains all of the texturing, embossing, printing and the like of the surface of the material or object being simulated. The die face and/or the resilient backing material are imbedded or otherwise provided or formed with conductive and/or resistive material to enhance the dielectric heating operation, as well as to provide heat flow toward the plastic load immediately upon the institution of the RF heating operation.The resilient die faces may be integrated with the cutting edges forming fixed or compound die assemblies for cutting and/or sealing operations which may be performed substantially contemporaneously with the patterning or texturing operations.

  Recently Added Patents
Semiconductor device having trapezoidal shaped trenches
Vehicle running control system
Light-emitting element, light-emitting device, and electronic device
Computer system and volume migration control method using the same
Method and a channel estimating arrangement for performing channel estimation
  Randomly Featured Patents
Catheter introducer and introducer slitter
Embedded logic analyzer for a programmable logic device
Punch for production decorative cutouts
Mirror assembly including foam encompassed within a polymer matrix
Method and apparatus for fast WCDMA acquisition
Composites of sulfur and crystalline phosphate fibers
Marine hulls and drives
Proteins closely related to opioid receptors
Automatic mounting system for positioning a plate on a carrier
Photographic shutter