Resources Contact Us Home
Apparatus for treating plastic loads

Image Number 3 for United States Patent #3993529.

A die assembly incorporating a resilient die face and/or backing for sealing and/or patterning or texturing plastic and other like material through the use of RF heating. The die face contains all of the texturing, embossing, printing and the like of the surface of the material or object being simulated. The die face and/or the resilient backing material are imbedded or otherwise provided or formed with conductive and/or resistive material to enhance the dielectric heating operation, as well as to provide heat flow toward the plastic load immediately upon the institution of the RF heating operation.The resilient die faces may be integrated with the cutting edges forming fixed or compound die assemblies for cutting and/or sealing operations which may be performed substantially contemporaneously with the patterning or texturing operations.

  Recently Added Patents
System for collecting computer application usage data of targeted application programs executed on a plurality of client devices
Method for combining images and magnetic resonance scanner
LO generation with deskewed input oscillator signal
Configurable caged ball insert for a downhole tool
Stroboscopic light source for a transmitter of a large scale metrology system
Methods of synthesizing heteromultimeric polypeptides in yeast using a haploid mating strategy
Vehicle control system
  Randomly Featured Patents
Nozzle particularly suited to direct metal deposition
Oversized motor scooter
High-voltage battery unit mounting structure for vehicle
Game board
Radar-and infrared detectable structural simulation decoy
Functional film and method for manufacturing the functional film
Ladder roof brace
Method for forming trench capacitor and memory cell
High pressure cavitation system
Heat exchanger tube and method for manufacturing the same