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Class Information
Number: D13/182
Name: Equipment for production, distribution, or transformation of energy > Distribution, modification or control > Semiconductor, transistor or integrated circuit (24)
Description:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| D574792 |
Lower heat insulating cylinder for manufacturing semiconductor wafers |
Aug. 12, 2008 |
| D574338 |
LED assembly |
Aug. 5, 2008 |
| D574339 |
Pattern formed on the ground layer of a multilayer printed circuit board |
Aug. 5, 2008 |
| D573115 |
Circuit module |
Jul. 15, 2008 |
| D573116 |
Bridge rectifier package with heat sink |
Jul. 15, 2008 |
| D571739 |
Semiconductor wafer delivery apparatus |
Jun. 24, 2008 |
| D571740 |
Semiconductor wafer delivery apparatus |
Jun. 24, 2008 |
| D570800 |
ISM-band printed antenna for a portion of a circuit board |
Jun. 10, 2008 |
| D570309 |
Wafer boat |
Jun. 3, 2008 |
| D570310 |
Attracting plate of an electrostatic chuck for semiconductor manufacturing |
Jun. 3, 2008 |
| D570308 |
Wafer boat |
Jun. 3, 2008 |
| D568839 |
Photomask blank |
May. 13, 2008 |
| D568838 |
Grooves formed around a semiconductor device on a circuit board |
May. 13, 2008 |
| D568836 |
Groove formed around a semiconductor device on a circuit board |
May. 13, 2008 |
| D568837 |
Semiconductor wafer delivery apparatus |
May. 13, 2008 |
| D567774 |
Groove formed around a semiconductor device on a circuit board |
Apr. 29, 2008 |
| D566060 |
Grooves formed around a semiconductor device on a circuit board |
Apr. 8, 2008 |
| D564462 |
RF electrode for a process tube of semiconductor manufacturing apparatus |
Mar. 18, 2008 |
| D560623 |
Quad-24JW surface mount package |
Jan. 29, 2008 |
| D559806 |
Pair of stage arms for a semiconductor wafer delivery apparatus |
Jan. 15, 2008 |
| D559805 |
Stage arm for a semiconductor wafer delivery apparatus |
Jan. 15, 2008 |
| D558694 |
Quad-28JW surface mount package |
Jan. 1, 2008 |
| D557668 |
Funnel plate |
Dec. 18, 2007 |
| D557226 |
Electrode cover for a plasma processing apparatus |
Dec. 11, 2007 |
| D557225 |
Funnel plate |
Dec. 11, 2007 |
| D556704 |
Grounded electrode for a plasma processing apparatus |
Dec. 4, 2007 |
| D556158 |
Printed circuit board |
Nov. 27, 2007 |
| D556157 |
Load-lock chamber |
Nov. 27, 2007 |
| D555608 |
Dot matrix for liquid crystal display |
Nov. 20, 2007 |
| D554084 |
Portion of a semiconductor apparatus mounting-position accuracy measurement jig |
Oct. 30, 2007 |
| D553104 |
Absorption board for an electric chuck used in semiconductor manufacture |
Oct. 16, 2007 |
| D552565 |
Supporting plate |
Oct. 9, 2007 |
| D552566 |
Light emitting diode module |
Oct. 9, 2007 |
| D552047 |
Process tube for manufacturing semiconductor wafers |
Oct. 2, 2007 |
| D552048 |
Printed circuit board |
Oct. 2, 2007 |
| D551634 |
Wafer-boat for heat-processing of semiconductor wafers |
Sep. 25, 2007 |
| D549189 |
Dicing die-bonding film |
Aug. 21, 2007 |
| D548705 |
Attracting disc for an electrostatic chuck for semiconductor production |
Aug. 14, 2007 |
| D548200 |
Attracting disc for an electrostatic chuck for semiconductor production |
Aug. 7, 2007 |
| D548201 |
Ion solenoid circuit board |
Aug. 7, 2007 |
| D548202 |
Semiconductor |
Aug. 7, 2007 |
| D548199 |
Flip chip on glass (FCOG) image sensor |
Aug. 7, 2007 |
| D548203 |
Semiconductor |
Aug. 7, 2007 |
| D546784 |
Attracting disc for an electrostatic chuck for semiconductor production |
Jul. 17, 2007 |
| D546297 |
Ion eye circuit board |
Jul. 10, 2007 |
| D544452 |
Supporting plate |
Jun. 12, 2007 |
| D543160 |
Photomask blank |
May. 22, 2007 |
| D540273 |
Semiconductor module |
Apr. 10, 2007 |
| D540272 |
Semiconductor module |
Apr. 10, 2007 |
| D539761 |
Semiconductor |
Apr. 3, 2007 |
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