Resources Contact Us Home
Browse by Category: Main > Material Science
Class Information
Number: 75/123N
Name: Specialized metallurgical processes, compositions for use therein, consolidated metal powder compositions, and loose metal particulate mixtures >

Sub-classes under this class:

Class Number Class Name Patents
75/300 Compositions 29
75/330 Processes 46
75/950 Consolidated metal powder compositions of >95% theoretical density (e.g., wrought, etc.) 48
75/952 Producing fibers, filaments, or whiskers 19
75/953 Producing spheres 31
75/954 Producing flakes or crystals 30
75/955 Producing dental product 23
75/956 Producing particles containing a dispersed phase 39
75/957 Continuous refining of molten iron(fe) 18
75/958 With concurrent production of iron(fe) and other desired nonmetallic product (e.g., energy, fertilizer, etc.) 84
75/959 Thermit-type reaction of solid materials only to yield molten metal 25
75/960 In zero gravity environment 8
75/961 Treating flue dust to obtain metal (other than by consolidation) 172
75/962 Treating or using mill scale 43

Patents under this class:

Patent Number Title Of Patent Date Issued

  Recently Added Patents
Virtual image display device and manufacturing method of virtual image display device
Interlock apparatus for vacuum circuit breaker
PEGylated, extended insulins
Liquid crystal display device
Registration and network access control
Stroboscopic light source for a transmitter of a large scale metrology system
Method for using directing cells for specific stem/progenitor cell activation and differentiation
  Randomly Featured Patents
Flashlight bezel focus lock system
Two-dimensional sensor using laps for measuring cell activity
Winding machine and method providing improved shielding relative to debris that may be encountered in a winding operation
Radiant-energy heating and/or cooking apparatus with honeycomb coverplate
LCD with pixels connected to multiple gate lines
Focusing position detection apparatus
Temperature sensing of flowing liquid
Data item values
Hybrid BGA and QFP chip package assembly and process for same
Housing having electromagnetic wave shielding and waterproof structure