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Class Information
Number: 73/827
Name: Measuring and testing > Specimen stress or strain, or testing by stress or strain application > By loading of specimen (e.g., strength of material test) > Tensile > Bond test
Description: Subject matter where the specimen includes an interface where two materials are joined together.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7448279 |
Device for testing material properties with regard to combined tensile and shear loads, in particular for testing adhesives |
Nov. 11, 2008 |
| 7426856 |
Device and method for measuring adhesion strength between two optical elements |
Sep. 23, 2008 |
| 7392708 |
Apparatus and method of measuring shear strain of thick adhesive bondlines |
Jul. 1, 2008 |
| 7389698 |
Nutplate bond strength tester unit |
Jun. 24, 2008 |
| 7380467 |
Bond integrity tool |
Jun. 3, 2008 |
| 7240564 |
Method and apparatus for detecting and determining event characteristics with reduced data collection |
Jul. 10, 2007 |
| 7219556 |
Yarn snarling testing apparatus and method |
May. 22, 2007 |
| 7202796 |
Device and method for triggering a sensor for cables |
Apr. 10, 2007 |
| 7162929 |
System and method for field testing a tack coat layer |
Jan. 16, 2007 |
| 7134591 |
Method of and apparatus for testing a wire bond connection |
Nov. 14, 2006 |
| 7041960 |
Bond separation inspection method using compressive thermal strain in optical sensor part |
May. 9, 2006 |
| 7028555 |
Apparatus and method for testing tire liner surface adhesion capability |
Apr. 18, 2006 |
| 7017422 |
Bond testing system, method, and apparatus |
Mar. 28, 2006 |
| 6918305 |
Test for measuring adhesion of polymer binders to a heated metal surface |
Jul. 19, 2005 |
| 6912915 |
Apparatus for shear testing bonds on silicon substrate |
Jul. 5, 2005 |
| 6912906 |
Method and apparatus for the production and quality testing of a bonded wire connection |
Jul. 5, 2005 |
| 6886734 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
May. 3, 2005 |
| 6871550 |
Polymer shrinkage tensometer |
Mar. 29, 2005 |
| 6832525 |
Method of testing peel strength between layers of a tubular laminate |
Dec. 21, 2004 |
| 6802214 |
Envelope quality control apparatus |
Oct. 12, 2004 |
| 6799472 |
Method of and apparatus for measuring and evaluating material strength by detecting charged particles |
Oct. 5, 2004 |
| 6786387 |
Method for clamping and wire-bonding the leads of a lead frame one set at a time |
Sep. 7, 2004 |
| 6761074 |
Atomic force microscopy measurements of contact resistance and current-dependent stiction |
Jul. 13, 2004 |
| 6758385 |
Apparatus for performing a pull test |
Jul. 6, 2004 |
| 6739202 |
Method and apparatus for non-destructive testing of leaded packages |
May. 25, 2004 |
| 6647803 |
Operating procedures for automated needle sorting, swaging and packaging machines |
Nov. 18, 2003 |
| 6612185 |
Method and associated apparatus for measuring the adhesiveness of slow-release tablets or the like |
Sep. 2, 2003 |
| 6612184 |
Method and apparatus for testing bonded tubular joints |
Sep. 2, 2003 |
| 6612161 |
Atomic force microscopy measurements of contact resistance and current-dependent stiction |
Sep. 2, 2003 |
| 6584858 |
Device and method for measuring adhesive strength |
Jul. 1, 2003 |
| 6553843 |
Tool to be fitted onto a machine for traction testing of two elements which are glued to one another |
Apr. 29, 2003 |
| 6523419 |
Electrode tensile test method and apparatus, substrate/probe support device for electrode tensile test, and electrode-probe bonding device for electrode tensile test |
Feb. 25, 2003 |
| 6520026 |
Method for making and testing thermocompression bonds |
Feb. 18, 2003 |
| 6513374 |
Apparatus to quantify the adhesion of film |
Feb. 4, 2003 |
| 6478264 |
Peel test mandrel assembly and method |
Nov. 12, 2002 |
| 6467672 |
Methods for clamping and wire-bonding the leads of a lead frame one set at a time |
Oct. 22, 2002 |
| 6435399 |
Method of checking wirebond condition |
Aug. 20, 2002 |
| 6393905 |
Adhesive testing apparatus |
May. 28, 2002 |
| 6339958 |
Adhesion strength testing using a depth-sensing indentation technique |
Jan. 22, 2002 |
| 6301971 |
Apparatus for testing the integrity of a bond |
Oct. 16, 2001 |
| 6299049 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
Oct. 9, 2001 |
| 6289741 |
Molding device and method for measuring the bonding strength of elastomers |
Sep. 18, 2001 |
| 6282950 |
Method and apparatus for testing the bond strength of materials |
Sep. 4, 2001 |
| 6237422 |
Apparatus and method for testing strength of electrical bond sites on semiconductor devices |
May. 29, 2001 |
| 6237833 |
Method of checking wirebond condition |
May. 29, 2001 |
| 6230569 |
Use of a stream of compressed gas to detect semiconductor interconnect problems |
May. 15, 2001 |
| 6220102 |
Die-shear test fixture apparatus |
Apr. 24, 2001 |
| 6178823 |
Apparatus and method for testing bond strength of electrical connection |
Jan. 30, 2001 |
| 6117695 |
Apparatus and method for testing a flip chip integrated circuit package adhesive layer |
Sep. 12, 2000 |
| 6092427 |
Method of testing a bond interface |
Jul. 25, 2000 |
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