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Class Information
Number: 525/485
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Mixing of two or more solid polymers; mixing of solid polymer or sicp with sicp or spfi; mixing of sicp with an ethylenic agent; mixing of solid polymer with a chemical treating or ethylenic agent; or processes of forming or reacting; or the resultant product of any of the above operations > Solid polymer or specified intermediate condensation product derived from at least one phenolic reactant and at least one aldehyde or aldehyde-type reactant or polymer therefrom > Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom > With specified material
Description: Subject matter wherein a specified material is present in the mixture.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605213 |
Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound |
Oct. 20, 2009 |
| 7579392 |
Low-viscosity epoxy resin, phenolic chain extender, catalyst and boron inhibitor |
Aug. 25, 2009 |
| 7501087 |
Injection molding thermosetting resin composition into reinforcing fiber substrate |
Mar. 10, 2009 |
| 7495060 |
Tetrakisphenol and non-clathrated curing agent for epoxy resin |
Feb. 24, 2009 |
| 7427652 |
Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler |
Sep. 23, 2008 |
| 7410673 |
Smooth board and process for preparing a smooth board |
Aug. 12, 2008 |
| 7202311 |
Phosphine oxide hydroxyarl mixtures with novolac resins for co-curing epoxy resins |
Apr. 10, 2007 |
| 7201957 |
Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
Apr. 10, 2007 |
| 7148294 |
Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
Dec. 12, 2006 |
| 6992151 |
Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same |
Jan. 31, 2006 |
| 6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
Aug. 30, 2005 |
| 6916890 |
Thermally reworkable epoxy resins and compositions based thereon |
Jul. 12, 2005 |
| 6911503 |
Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
Jun. 28, 2005 |
| 6887950 |
Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
May. 3, 2005 |
| 6881799 |
Curing agent for epoxy resins and epoxy resin composition |
Apr. 19, 2005 |
| 6818707 |
Spray dried phenolic resole molding powder with crystalline phenolic compounds |
Nov. 16, 2004 |
| 6812299 |
Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin |
Nov. 2, 2004 |
| 6667194 |
Method of bonding die chip with underfill fluxing composition |
Dec. 23, 2003 |
| 6664344 |
Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
Dec. 16, 2003 |
| 6569959 |
Modified phenolic hydroxyl-containing resin by reacting epoxy resin with difunctional phenol |
May. 27, 2003 |
| 6432539 |
Phosphorus-containing polymer having phenolic units and uses thereof |
Aug. 13, 2002 |
| 6376053 |
Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
Apr. 23, 2002 |
| 6376101 |
Epoxy resin composition and semiconductor devices |
Apr. 23, 2002 |
| 6329474 |
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole |
Dec. 11, 2001 |
| 6274251 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 14, 2001 |
| 6214455 |
Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
Apr. 10, 2001 |
| 6204422 |
Process for producing dialklylnaphthalenes |
Mar. 20, 2001 |
| 6197898 |
Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
Mar. 6, 2001 |
| 6046284 |
Phenolic hydroxyl-containing resin by reacting epoxy resin with excess difunctional phenol and epoxidation thereof |
Apr. 4, 2000 |
| 5959043 |
Phosphorus-containing dicarboxylic reaction product of epoxy resins and phosphorus acid (anhydride) with hardener |
Sep. 28, 1999 |
| 5936010 |
Process for producing highly reactive low-viscosity modified phenolic resins |
Aug. 10, 1999 |
| 5834569 |
Grinding wheel for flat glass beveling |
Nov. 10, 1998 |
| 5773533 |
Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener |
Jun. 30, 1998 |
| 5767175 |
Aqueous coating composition |
Jun. 16, 1998 |
| 5677414 |
Acetal derivatives of resole compounds |
Oct. 14, 1997 |
| 5661223 |
Composition of phenolic resin-modified epoxy resin and straight chain polymer |
Aug. 26, 1997 |
| 5648436 |
Halogen-free mixture, a self-extinguishing prepreg containing this mixture and the use of such a prepreg |
Jul. 15, 1997 |
| 5644003 |
Epoxy resin composition, process for producing the same and resin-sealed semiconductor device |
Jul. 1, 1997 |
| 5643675 |
Addition for promotion of bench life extension in a hot box binder system |
Jul. 1, 1997 |
| 5641839 |
Novolac type epoxy resin and electronic parts encapsulating resin composition |
Jun. 24, 1997 |
| 5618891 |
Solventless resin composition having minimal reactivity at room temperature |
Apr. 8, 1997 |
| 5616631 |
Binder composition for mold making, binder/curing agent composition for mold making, sand composition for mold making, and process of making mold |
Apr. 1, 1997 |
| 5614600 |
Fiber-reinforced resin plate and process for producing the same |
Mar. 25, 1997 |
| 5607990 |
Method for making phenol-formaldehyde resins flame-resistant |
Mar. 4, 1997 |
| 5605984 |
Polymeric compositions and components thereof |
Feb. 25, 1997 |
| 5567749 |
Semiconductor device-encapsulating epoxy resin composition |
Oct. 22, 1996 |
| 5530048 |
Phenolic resins for reinforced composites |
Jun. 25, 1996 |
| 5503937 |
Curable composition which comprises adducts of heterocyclic compounds |
Apr. 2, 1996 |
| 5496889 |
Compatibilized fluoropolymer/aromatic polyester thermoplastic polyblends |
Mar. 5, 1996 |
| 5484854 |
Modified phenolic resin, epoxy resin and curing agent molding material |
Jan. 16, 1996 |
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