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Class Information
Number: 525/481
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Mixing of two or more solid polymers; mixing of solid polymer or sicp with sicp or spfi; mixing of sicp with an ethylenic agent; mixing of solid polymer with a chemical treating or ethylenic agent; or processes of forming or reacting; or the resultant product of any of the above operations > Solid polymer or specified intermediate condensation product derived from at least one phenolic reactant and at least one aldehyde or aldehyde-type reactant or polymer therefrom > Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom
Description: Subject matter wherein a solid polymer or specified intermediate condensation product derived from at least one phenolic reactant and at least one aldehyde or aldehyde-type reactant is mixed with a reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7595144 |
Sulfonate-containing anti-reflective coating forming composition for lithography |
Sep. 29, 2009 |
| 7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate |
Jun. 9, 2009 |
| 7504471 |
Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin compositi |
Mar. 17, 2009 |
| 7491774 |
Producing granular epoxy resin by refining and pulverizing solid epoxy resin |
Feb. 17, 2009 |
| 7491789 |
Disulfide-containing phenolic resin as curing agent for epoxy resin |
Feb. 17, 2009 |
| 7479527 |
Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component |
Jan. 20, 2009 |
| 7470754 |
Biphenylaralkyl epoxy and phenolic resins |
Dec. 30, 2008 |
| 7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt |
Oct. 28, 2008 |
| 7425598 |
Adhesive of epoxy resin and curing agent with xylylene diamine structure |
Sep. 16, 2008 |
| 7423096 |
Underfill of resin and sulfonic acid-releasing thermally cleavable compound |
Sep. 9, 2008 |
| 7345102 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
Mar. 18, 2008 |
| 7307128 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 11, 2007 |
| 7304120 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 4, 2007 |
| 7291684 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Nov. 6, 2007 |
| 7285602 |
Granular epoxy resin, production method thereof, and granular epoxy resin package |
Oct. 23, 2007 |
| 7271225 |
Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the compositi |
Sep. 18, 2007 |
| 7268191 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
Sep. 11, 2007 |
| 7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Sep. 4, 2007 |
| 7259213 |
Indole resins epoxy resins and resin compositions containing the same |
Aug. 21, 2007 |
| 7247683 |
Low voiding no flow fluxing underfill for electronic devices |
Jul. 24, 2007 |
| 7098276 |
Flame-retardant epoxy resin composition and semiconductor device made using the same |
Aug. 29, 2006 |
| 7094843 |
Epoxy compositions having improved shelf life and articles containing the same |
Aug. 22, 2006 |
| 7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7087664 |
Resin film and multilayer printed wiring board using thereof |
Aug. 8, 2006 |
| 7009009 |
Fluxing underfill compositions |
Mar. 7, 2006 |
| 7001560 |
Molding resin composition and method of molding |
Feb. 21, 2006 |
| 6992151 |
Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same |
Jan. 31, 2006 |
| 6962744 |
Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof |
Nov. 8, 2005 |
| 6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
Oct. 18, 2005 |
| 6946421 |
Latent catalyst |
Sep. 20, 2005 |
| 6942922 |
Cationic paint composition |
Sep. 13, 2005 |
| 6933618 |
Tablet comprising epoxy resin composition |
Aug. 23, 2005 |
| 6916539 |
Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
Jul. 12, 2005 |
| 6916890 |
Thermally reworkable epoxy resins and compositions based thereon |
Jul. 12, 2005 |
| 6900270 |
Curable coating compositions with carbamate compounds |
May. 31, 2005 |
| 6890994 |
Curable coating compositions with carbamate-containing acrylic polymers |
May. 10, 2005 |
| 6881812 |
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst |
Apr. 19, 2005 |
| 6858674 |
Carbamate functional materials, a method of making said materials, and curable coating compositions containing said materials |
Feb. 22, 2005 |
| 6852263 |
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition |
Feb. 8, 2005 |
| 6831129 |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil |
Dec. 14, 2004 |
| 6815495 |
Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder |
Nov. 9, 2004 |
| 6794481 |
Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof |
Sep. 21, 2004 |
| 6784260 |
Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s) |
Aug. 31, 2004 |
| 6749927 |
Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
Jun. 15, 2004 |
| 6733880 |
Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
May. 11, 2004 |
| 6727325 |
Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound |
Apr. 27, 2004 |
| 6723803 |
Adhesive of flexible epoxy resin and latent dihydrazide |
Apr. 20, 2004 |
| 6713571 |
Process for producing epoxy resin composition for photosemiconductor element encapsulation |
Mar. 30, 2004 |
| 6664325 |
Fiber processing agent, reinforcing fiber processed by the fiber processing agent and rubber product reinforced by the reinforcing fiber |
Dec. 16, 2003 |
| 6664344 |
Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
Dec. 16, 2003 |
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