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Class Information
Number: 523/466
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Inorganic si-o bond dnrm
Description: Subject matter wherein the DNRM is an inorganic material which contains a silicon-to-oxygen bond, e.g., silica, glass, etc.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456230 |
Cationically photocurable epoxy resin compositions |
Nov. 25, 2008 |
| 7446136 |
Method for producing cure system, adhesive system, and electronic device |
Nov. 4, 2008 |
| 7442729 |
Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt |
Oct. 28, 2008 |
| 7432334 |
Silicone-modified single-component casting compound |
Oct. 7, 2008 |
| 7429800 |
Molding composition and method, and molded article |
Sep. 30, 2008 |
| 7405246 |
Cure system, adhesive system, electronic device |
Jul. 29, 2008 |
| 7390571 |
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
Jun. 24, 2008 |
| 7368170 |
Viscous chemical anchoring adhesive |
May. 6, 2008 |
| 7354978 |
Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound |
Apr. 8, 2008 |
| 7354499 |
Method for making a lubricating fast setting epoxy composition |
Apr. 8, 2008 |
| 7329711 |
Modified epoxy resins |
Feb. 12, 2008 |
| 7312104 |
Resin composition for encapsulating semiconductor device |
Dec. 25, 2007 |
| 7311972 |
Filled epoxy resin compositions |
Dec. 25, 2007 |
| 7307128 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 11, 2007 |
| 7304102 |
Process for making encapsulant for opto-electronic devices |
Dec. 4, 2007 |
| 7304120 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 4, 2007 |
| 7279223 |
Underfill composition and packaged solid state device |
Oct. 9, 2007 |
| 7276563 |
Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
Oct. 2, 2007 |
| 7268191 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
Sep. 11, 2007 |
| 7265167 |
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Sep. 4, 2007 |
| 7255925 |
Thermosetting resin composition for high speed transmission circuit board |
Aug. 14, 2007 |
| 7247683 |
Low voiding no flow fluxing underfill for electronic devices |
Jul. 24, 2007 |
| 7169833 |
Liquid epoxy resin composition and semiconductor device |
Jan. 30, 2007 |
| 7163973 |
Composition of bulk filler and epoxy-clay nanocomposite |
Jan. 16, 2007 |
| 7147921 |
Anti-fouling coatings containing silica-coated copper |
Dec. 12, 2006 |
| 7098276 |
Flame-retardant epoxy resin composition and semiconductor device made using the same |
Aug. 29, 2006 |
| 7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7094844 |
Liquid epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7087664 |
Resin film and multilayer printed wiring board using thereof |
Aug. 8, 2006 |
| 7037399 |
Underfill encapsulant for wafer packaging and method for its application |
May. 2, 2006 |
| 7026382 |
Conductive resin composition |
Apr. 11, 2006 |
| 7005185 |
Quick cure carbon fiber reinforced epoxy resin |
Feb. 28, 2006 |
| 6992166 |
Phenolic resin and method of producing the same |
Jan. 31, 2006 |
| 6946421 |
Latent catalyst |
Sep. 20, 2005 |
| 6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
Aug. 30, 2005 |
| 6933332 |
Powdered epoxy composition |
Aug. 23, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6916873 |
Liquid thermosetting resin composition, printed wiring boards and process for their production |
Jul. 12, 2005 |
| 6881812 |
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst |
Apr. 19, 2005 |
| 6872762 |
Epoxy resin composition with solid organic acid |
Mar. 29, 2005 |
| 6845797 |
Tire compositions comprising epoxidized natural rubber and a functionalized polyolefin |
Jan. 25, 2005 |
| 6841605 |
Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same |
Jan. 11, 2005 |
| 6830825 |
Epoxy resin composition and semiconductor device |
Dec. 14, 2004 |
| 6831113 |
Amine-modified epoxy resin reacted in presence of latent hardener |
Dec. 14, 2004 |
| 6822341 |
Latent catalysts for molding compounds |
Nov. 23, 2004 |
| 6803414 |
Damping resin composition and damping resin article for structure using the resin composition |
Oct. 12, 2004 |
| 6797750 |
Flame-retardant epoxy resin composition, molded article thereof, and electronic part |
Sep. 28, 2004 |
| 6794058 |
Flip-chip type semiconductor device |
Sep. 21, 2004 |
| 6790904 |
Liquid coating of film-forming resin and particles chemically modified to lower surface tension |
Sep. 14, 2004 |
| 6784228 |
Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same |
Aug. 31, 2004 |
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