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Class Information
Number: 523/461
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Organic nitrogen compound dnrm
Description: Subject matter wherein the DNRM is an organic compound containing nitrogen, e.g., an azo dye, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7442434 |
Epoxy resin composition |
Oct. 28, 2008 |
| 7405247 |
Conductive adhesive composition |
Jul. 29, 2008 |
| 7390571 |
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
Jun. 24, 2008 |
| 7271224 |
Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same |
Sep. 18, 2007 |
| 7255925 |
Thermosetting resin composition for high speed transmission circuit board |
Aug. 14, 2007 |
| 7090895 |
Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device |
Aug. 15, 2006 |
| 7084194 |
Halogen-free resin composition |
Aug. 1, 2006 |
| 7064157 |
Flame retardant resin and flame retardant composition containing the same |
Jun. 20, 2006 |
| 7053138 |
Flame-proofing agents |
May. 30, 2006 |
| 7041399 |
Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
May. 9, 2006 |
| 7008986 |
Stabilized thermoplastic moulding materials |
Mar. 7, 2006 |
| 7001938 |
Epoxy resin curing compositions and resin compositions including same |
Feb. 21, 2006 |
| 6946503 |
Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins |
Sep. 20, 2005 |
| 6936646 |
Flame-retardant molding compositions |
Aug. 30, 2005 |
| 6924000 |
Environmentally preferred high solids, low viscosity flock adhesives |
Aug. 2, 2005 |
| 6899924 |
Coating compositions and processes |
May. 31, 2005 |
| 6843939 |
UV stabilizing additive composition |
Jan. 18, 2005 |
| 6831113 |
Amine-modified epoxy resin reacted in presence of latent hardener |
Dec. 14, 2004 |
| 6809162 |
Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst |
Oct. 26, 2004 |
| 6774160 |
Curable epoxy resin compositions and the cured residues thereof |
Aug. 10, 2004 |
| 6774193 |
Stabilized unsaturated polymer resin compositions and methods of using the same |
Aug. 10, 2004 |
| 6770691 |
Curable epoxy resin compositions and the cured residues thereof |
Aug. 3, 2004 |
| 6767639 |
Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them |
Jul. 27, 2004 |
| 6767941 |
Halogen-free flame-retardant composition |
Jul. 27, 2004 |
| 6713536 |
Removable imbibition composition of photochromic compound and epoxy and polyol kinetic enhancing additives |
Mar. 30, 2004 |
| 6635721 |
Powder coating of semicrystalline and amorphous polyesters with crosslinker |
Oct. 21, 2003 |
| 6617401 |
Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
Sep. 9, 2003 |
| 6617400 |
Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
Sep. 9, 2003 |
| 6528594 |
Flowable glanulates |
Mar. 4, 2003 |
| 6525113 |
Process for producing cross-linked polyallylamine hydrochloride |
Feb. 25, 2003 |
| 6485834 |
Flexible deployable preform |
Nov. 26, 2002 |
| 6467961 |
Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using |
Oct. 22, 2002 |
| 6440567 |
Halogen free flame retardant adhesive resin coated composite |
Aug. 27, 2002 |
| 6433043 |
Removable imbibition composition of photochromic compound and kinetic enhancing additive |
Aug. 13, 2002 |
| 6429238 |
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
Aug. 6, 2002 |
| 6387990 |
Curable epoxy resin compositions with brominated triazine flame retardants |
May. 14, 2002 |
| 6359035 |
Adhesive for electroless plating and method of producing the same |
Mar. 19, 2002 |
| 6346573 |
Amine-modified epoxy resin reacted in presence of latent hardener |
Feb. 12, 2002 |
| 6346329 |
Curable resin composition |
Feb. 12, 2002 |
| 6337362 |
Ultraviolet resistant pre-mix compositions and articles using such compositions |
Jan. 8, 2002 |
| 6331226 |
LCP bonding method |
Dec. 18, 2001 |
| 6294259 |
Polyimide hybrid adhesives |
Sep. 25, 2001 |
| 6265469 |
Epoxy resin adhesive for flexible printed circuits |
Jul. 24, 2001 |
| 6245836 |
Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using |
Jun. 12, 2001 |
| 6207235 |
One-pack coating composition and coating method using the same |
Mar. 27, 2001 |
| 6187443 |
Thermosetting composition, uses thereof and a flexible deployable preform comprising the composition |
Feb. 13, 2001 |
| 6177489 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Jan. 23, 2001 |
| 6172141 |
Reworkable epoxy underfill encapsulants |
Jan. 9, 2001 |
| 6172143 |
Resin composition for use in sealant and liquid sealant using the resin composition |
Jan. 9, 2001 |
| 6171418 |
Methods for dynamic balancing |
Jan. 9, 2001 |
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