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Class Information
Number: 523/459
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Elemental metal or metal compound other than as silicate dnrm > Heavy metal
Description: Subject matter wherein the metal or compound thereof contains a heavy metal, e.g., zinc sulfide, etc.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7348370 |
Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer |
Mar. 25, 2008 |
| 7255925 |
Thermosetting resin composition for high speed transmission circuit board |
Aug. 14, 2007 |
| 7179853 |
Resin dispersion for cationic electrodeposition and cationic electrodeposition coating composition including the same |
Feb. 20, 2007 |
| 7157507 |
Ultraviolet curable silver composition and related method |
Jan. 2, 2007 |
| 7125917 |
Epoxy molding compounds with resistance to UV light and heat |
Oct. 24, 2006 |
| 7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7008981 |
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof |
Mar. 7, 2006 |
| 6994891 |
Method for producing an epoxy composition |
Feb. 7, 2006 |
| 6989412 |
Epoxy molding compounds containing phosphor and process for preparing such compositions |
Jan. 24, 2006 |
| 6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
Oct. 18, 2005 |
| 6830815 |
Low wear and low friction coatings for articles made of low softening point materials |
Dec. 14, 2004 |
| 6815495 |
Coating of melamine, epoxy, urethane or alkyd resin with phenolic resin binder |
Nov. 9, 2004 |
| 6809162 |
Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst |
Oct. 26, 2004 |
| 6794058 |
Flip-chip type semiconductor device |
Sep. 21, 2004 |
| 6791839 |
Thermal interface materials and methods for their preparation and use |
Sep. 14, 2004 |
| 6777464 |
Circuit connecting material, and structure and method of connecting circuit terminal |
Aug. 17, 2004 |
| 6750274 |
Weldable coating of phosphated epoxy polymer, curing agent and electroconductive pigment |
Jun. 15, 2004 |
| 6737108 |
Microcapsulating conductive metal particles with polymerized monomers |
May. 18, 2004 |
| 6699351 |
Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
Mar. 2, 2004 |
| 6689459 |
Clear cathodic electrocoating compositions |
Feb. 10, 2004 |
| 6641928 |
Adhesives and electric devices |
Nov. 4, 2003 |
| 6630745 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2003 |
| 6627328 |
Light-transmissive epoxy resin composition and semiconductor device |
Sep. 30, 2003 |
| 6617400 |
Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
Sep. 9, 2003 |
| 6617401 |
Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
Sep. 9, 2003 |
| 6610407 |
Corrosion resistant coating for an iron-based part and method for applying same |
Aug. 26, 2003 |
| 6610406 |
Flame retardant molding compositions |
Aug. 26, 2003 |
| 6583201 |
Conductive materials with electrical stability for use in electronics devices |
Jun. 24, 2003 |
| 6544651 |
High dielectric constant nano-structure polymer-ceramic composite |
Apr. 8, 2003 |
| 6528552 |
Resist composition excellent in flame resistance |
Mar. 4, 2003 |
| 6525115 |
Method of making an aqueous dispersion of particles comprising an epoxy material for use in coatings |
Feb. 25, 2003 |
| 6475641 |
Connecting material and connection structure |
Nov. 5, 2002 |
| 6469074 |
Composition of cyanate ester, epoxy resin and acid anhydride |
Oct. 22, 2002 |
| 6465541 |
Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
Oct. 15, 2002 |
| 6462108 |
High Tg potting compound |
Oct. 8, 2002 |
| 6432540 |
Flame retardant molding compositions |
Aug. 13, 2002 |
| 6406746 |
Microcapsulating conductive metal particles with polymerized monomers |
Jun. 18, 2002 |
| 6322620 |
Conductive ink composition |
Nov. 27, 2001 |
| 6323264 |
Corrosion barrier coating composition |
Nov. 27, 2001 |
| 6319619 |
Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
Nov. 20, 2001 |
| 6316529 |
Two-component coating agent based on an epoxy resin for cement-bound backgrounds |
Nov. 13, 2001 |
| 6312813 |
Cation-electrodepositable resin composition |
Nov. 6, 2001 |
| 6306926 |
Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
Oct. 23, 2001 |
| 6300402 |
Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards |
Oct. 9, 2001 |
| 6284322 |
Low-friction coating composition |
Sep. 4, 2001 |
| 6193910 |
Paste for through-hole filling and printed wiring board using the same |
Feb. 27, 2001 |
| 6190787 |
Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices |
Feb. 20, 2001 |
| 6177490 |
Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof |
Jan. 23, 2001 |
| 6169159 |
Alcohol-blocked brominated bisphenol a epoxy resin flame retardants for carbonyl-containing thermoplastic resins |
Jan. 2, 2001 |
| 6146488 |
Weld bonding method |
Nov. 14, 2000 |
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