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Class Information
Number: 523/457
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Elemental metal or metal compound other than as silicate dnrm
Description: Subject matter wherein the DNRM contains an elemental or metal compound thereof other than as a silicate, e.g., strontium-aluminum alloy, barium sulfate, magnesium oxide, calcium carbonate, etc.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456230 |
Cationically photocurable epoxy resin compositions |
Nov. 25, 2008 |
| 7456235 |
Flame-retardant composition for coating powders |
Nov. 25, 2008 |
| 7449241 |
Organic coating compositions for aluminizing metal substrates, and related methods and articles |
Nov. 11, 2008 |
| 7446136 |
Method for producing cure system, adhesive system, and electronic device |
Nov. 4, 2008 |
| 7439285 |
Liquid thermosetting ink |
Oct. 21, 2008 |
| 7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2008 |
| 7427652 |
Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler |
Sep. 23, 2008 |
| 7405246 |
Cure system, adhesive system, electronic device |
Jul. 29, 2008 |
| 7405247 |
Conductive adhesive composition |
Jul. 29, 2008 |
| 7390571 |
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
Jun. 24, 2008 |
| 7387718 |
Cationic electrodeposition coating composition and method of preparing the same |
Jun. 17, 2008 |
| 7354978 |
Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound |
Apr. 8, 2008 |
| 7354499 |
Method for making a lubricating fast setting epoxy composition |
Apr. 8, 2008 |
| 7348061 |
Slip-resistant coatings and substrates coated therewith |
Mar. 25, 2008 |
| 7348370 |
Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer |
Mar. 25, 2008 |
| 7323234 |
Curable alkanolamine containing epoxy powder coating composition |
Jan. 29, 2008 |
| 7312104 |
Resin composition for encapsulating semiconductor device |
Dec. 25, 2007 |
| 7312261 |
Thermal interface adhesive and rework |
Dec. 25, 2007 |
| 7307128 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 11, 2007 |
| 7304120 |
Epoxy compound, preparation method thereof, and use thereof |
Dec. 4, 2007 |
| 7297406 |
Lead-free electrodeposition coating composition and coated article |
Nov. 20, 2007 |
| 7291684 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Nov. 6, 2007 |
| 7271206 |
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof |
Sep. 18, 2007 |
| 7268174 |
Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same |
Sep. 11, 2007 |
| 7255925 |
Thermosetting resin composition for high speed transmission circuit board |
Aug. 14, 2007 |
| 7208105 |
Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
Apr. 24, 2007 |
| 7196124 |
Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
Mar. 27, 2007 |
| 7183363 |
Thermally conductive casting compound |
Feb. 27, 2007 |
| 7179853 |
Resin dispersion for cationic electrodeposition and cationic electrodeposition coating composition including the same |
Feb. 20, 2007 |
| 7169833 |
Liquid epoxy resin composition and semiconductor device |
Jan. 30, 2007 |
| 7163973 |
Composition of bulk filler and epoxy-clay nanocomposite |
Jan. 16, 2007 |
| 7157507 |
Ultraviolet curable silver composition and related method |
Jan. 2, 2007 |
| 7147921 |
Anti-fouling coatings containing silica-coated copper |
Dec. 12, 2006 |
| 7109258 |
Polymeric material with antistatic properties and method for obtaining it |
Sep. 19, 2006 |
| 7098276 |
Flame-retardant epoxy resin composition and semiconductor device made using the same |
Aug. 29, 2006 |
| 7094844 |
Liquid epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7084194 |
Halogen-free resin composition |
Aug. 1, 2006 |
| 7056585 |
Prepreg and laminate |
Jun. 6, 2006 |
| 7008981 |
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof |
Mar. 7, 2006 |
| 6994891 |
Method for producing an epoxy composition |
Feb. 7, 2006 |
| 6936646 |
Flame-retardant molding compositions |
Aug. 30, 2005 |
| 6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
Aug. 30, 2005 |
| 6921782 |
Adhesive and electric device |
Jul. 26, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6916539 |
Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
Jul. 12, 2005 |
| 6902689 |
Epoxy, epoxy system, and method of forming a conductive adhesive connection |
Jun. 7, 2005 |
| 6894091 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
May. 17, 2005 |
| 6893736 |
Thermosetting resin compositions useful as underfill sealants |
May. 17, 2005 |
| 6881769 |
Matting agents for thermally curable systems |
Apr. 19, 2005 |
| 6878448 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
Apr. 12, 2005 |
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