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Class Information
Number: 523/445
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Boron dnrm
Description: Subject matter wherein the DNRM contains boron, e.g., boron nitride, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446136 |
Method for producing cure system, adhesive system, and electronic device |
Nov. 4, 2008 |
| 7405246 |
Cure system, adhesive system, electronic device |
Jul. 29, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7378461 |
Curable epoxy resin compositions and process for production thereof |
May. 27, 2008 |
| 7332069 |
Cathodic corrosion protection powder coating composition and method |
Feb. 19, 2008 |
| 7323234 |
Curable alkanolamine containing epoxy powder coating composition |
Jan. 29, 2008 |
| 7311972 |
Filled epoxy resin compositions |
Dec. 25, 2007 |
| 7304102 |
Process for making encapsulant for opto-electronic devices |
Dec. 4, 2007 |
| 7294660 |
Epoxy resin composition |
Nov. 13, 2007 |
| 7183346 |
Cathodic corrosion protection powder coating composition and method |
Feb. 27, 2007 |
| 7169474 |
Epoxy resin composition and semiconductor device |
Jan. 30, 2007 |
| 7169833 |
Liquid epoxy resin composition and semiconductor device |
Jan. 30, 2007 |
| 7105614 |
Curable epoxy resin composition |
Sep. 12, 2006 |
| 7094844 |
Liquid epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7084194 |
Halogen-free resin composition |
Aug. 1, 2006 |
| 7064157 |
Flame retardant resin and flame retardant composition containing the same |
Jun. 20, 2006 |
| 7008983 |
Hydrolysis resistant polyester compositions and related articles and methods |
Mar. 7, 2006 |
| 6974846 |
Hydrolysis resistant polyester compositions and related articles and methods |
Dec. 13, 2005 |
| 6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
Aug. 30, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6830815 |
Low wear and low friction coatings for articles made of low softening point materials |
Dec. 14, 2004 |
| 6797972 |
Neutron shielding materials and a cask for spent fuel |
Sep. 28, 2004 |
| 6734263 |
Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates |
May. 11, 2004 |
| 6663968 |
Corrosion-and chip-resistant coatings for high tensile steel |
Dec. 16, 2003 |
| 6663969 |
Heat conductive adhesive film and manufacturing method thereof and electronic component |
Dec. 16, 2003 |
| 6517743 |
Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition |
Feb. 11, 2003 |
| 6235865 |
Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition |
May. 22, 2001 |
| 6160042 |
Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method |
Dec. 12, 2000 |
| 6077885 |
Chromate-free protective coatings |
Jun. 20, 2000 |
| 6060539 |
Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
May. 9, 2000 |
| 6046257 |
Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent |
Apr. 4, 2000 |
| 5904888 |
Curable compositions |
May. 18, 1999 |
| 5902755 |
High Strength composite materials |
May. 11, 1999 |
| 5681883 |
Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
Oct. 28, 1997 |
| 5624989 |
Semiconductor device |
Apr. 29, 1997 |
| 5610209 |
Heat-resistant epoxy resin composition having excellent stability at normal temperature and curing agent for epoxy resin |
Mar. 11, 1997 |
| 5591791 |
Thermal protective compositions |
Jan. 7, 1997 |
| 5508328 |
Curing epoxy resins using dicy, imidazole and acid |
Apr. 16, 1996 |
| 5308895 |
Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
May. 3, 1994 |
| 5260121 |
Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast |
Nov. 9, 1993 |
| 5232970 |
Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications |
Aug. 3, 1993 |
| 5214098 |
Hardenable epoxide resin mixtures containing a latent hardener, an amine and a thiol |
May. 25, 1993 |
| 5176842 |
Method of manufacturing a resin bound magnet |
Jan. 5, 1993 |
| 5084521 |
Liquid sprayable epoxy composition and method |
Jan. 28, 1992 |
| 5075033 |
Processes for preparing organophilic clay gellants |
Dec. 24, 1991 |
| 5068268 |
Epoxy polymer materials |
Nov. 26, 1991 |
| 5019605 |
Low density, self-extinguishing epoxide composition |
May. 28, 1991 |
| 5006614 |
Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer |
Apr. 9, 1991 |
| 4996279 |
Dissymmetric polymer materials |
Feb. 26, 1991 |
| 4959438 |
Epoxy resin composition and prepreg for composite materials using the same from bi and tri-epoxides, triarylbisphenols and diaminodiphenylsulfones |
Sep. 25, 1990 |
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