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Class Information
Number: 523/444
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Designated nonreactive material (dnrm) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range > Silicon > Glass
Description: Subject matter wherein the silicon-containing material is a glass, e.g., fiber glass 0.060 inch in length, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7311972 |
Filled epoxy resin compositions |
Dec. 25, 2007 |
| 7304102 |
Process for making encapsulant for opto-electronic devices |
Dec. 4, 2007 |
| 7157119 |
Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates |
Jan. 2, 2007 |
| 6887922 |
Glass composite |
May. 3, 2005 |
| 6779656 |
Polymerizable preparations based on epoxides that contain silicon |
Aug. 24, 2004 |
| 6737157 |
Coating type reinforcement composition of sheet metal |
May. 18, 2004 |
| 6692664 |
Printed wiring board conductive via hole filler having metal oxide reducing capability |
Feb. 17, 2004 |
| 6664307 |
Low-shrinkage epoxy resin formulation |
Dec. 16, 2003 |
| 6566422 |
Connecting material |
May. 20, 2003 |
| 6395823 |
Thermoplastic polyurethane additives for improved polymer matrix composites and methods of making and using therefor |
May. 28, 2002 |
| 6383660 |
Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
May. 7, 2002 |
| 6376100 |
Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device |
Apr. 23, 2002 |
| 6353061 |
.alpha., .omega.-methacrylate terminated macromonomer compounds |
Mar. 5, 2002 |
| 6337037 |
Printed wiring board conductive via hole filler having metal oxide reducing capability |
Jan. 8, 2002 |
| 6323263 |
Semiconductor sealing liquid epoxy resin compositions |
Nov. 27, 2001 |
| 6300402 |
Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards |
Oct. 9, 2001 |
| 6268425 |
Glass/polymer melt blends |
Jul. 31, 2001 |
| 6246123 |
Transparent compound and applications for its use |
Jun. 12, 2001 |
| 6060540 |
Modeling pastes |
May. 9, 2000 |
| 6043313 |
Thermoplastic polyurethane additives for improved polymer matrix composites and methods of making and using therefor |
Mar. 28, 2000 |
| 5919842 |
Water-based latex phenolic coating composition |
Jul. 6, 1999 |
| 5902755 |
High Strength composite materials |
May. 11, 1999 |
| 5876210 |
Dental polymer product |
Mar. 2, 1999 |
| 5834537 |
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
Nov. 10, 1998 |
| 5827907 |
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
Oct. 27, 1998 |
| 5827908 |
Naphthalene and or biphenyl skeleton containing epoxy resin composition |
Oct. 27, 1998 |
| 5747557 |
Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener |
May. 5, 1998 |
| 5677367 |
Graphite-containing compositions |
Oct. 14, 1997 |
| 5621025 |
Polymer concrete coating for pipe tubular shapes, other metal members and metal structures |
Apr. 15, 1997 |
| 5616633 |
Liquid epoxy resin composition |
Apr. 1, 1997 |
| 5604270 |
Chemical treating composition for glass fibers having emulsified epoxy with good stability and the treated glass fibers |
Feb. 18, 1997 |
| 5439766 |
Composition for photo imaging |
Aug. 8, 1995 |
| 5368922 |
Prepreg of thermoplastic polymer particles in liquid thermosettable resin |
Nov. 29, 1994 |
| 5367013 |
Process for producing reinforced crystalline engineering plastic composition |
Nov. 22, 1994 |
| 5324767 |
Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition |
Jun. 28, 1994 |
| 5280053 |
Machinable, high strength epoxy tooling compositions |
Jan. 18, 1994 |
| 5242958 |
Chemical treating composition for glass fibers having emulsified epoxy with good stability and the treated glass fibers |
Sep. 7, 1993 |
| 5232962 |
Adhesive bonding composition with bond line limiting spacer system |
Aug. 3, 1993 |
| 5198479 |
Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith |
Mar. 30, 1993 |
| 5189080 |
Epoxy resin composition for encapsulating electric circuit components |
Feb. 23, 1993 |
| 5175199 |
High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions |
Dec. 29, 1992 |
| 5167870 |
Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction |
Dec. 1, 1992 |
| 5156913 |
Glass reinforced acetal polymer products |
Oct. 20, 1992 |
| 5110857 |
Ultravioletsetting resin composition |
May. 5, 1992 |
| 5084521 |
Liquid sprayable epoxy composition and method |
Jan. 28, 1992 |
| 5081167 |
Cyanamide-cured maleimide/epoxy resin blend |
Jan. 14, 1992 |
| 5075354 |
Polyester resin composition and process for the preparation thereof |
Dec. 24, 1991 |
| 5053476 |
Epoxy resin composition based on bisphenol epoxy, polyetherpolyol, anhydride and imidazole |
Oct. 1, 1991 |
| 5043368 |
Polyetherimide/epoxy chopped fiber reinforced laminates and the preparation thereof |
Aug. 27, 1991 |
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