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Class Information
Number: 523/443
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Designated nonreactive material (dnrm) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range > Silicon
Description: Subject matter wherein the DNRM having numerical limitations contains a silicon atom, e.g., silica, mica, clay, etc.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449241 |
Organic coating compositions for aluminizing metal substrates, and related methods and articles |
Nov. 11, 2008 |
| 7446136 |
Method for producing cure system, adhesive system, and electronic device |
Nov. 4, 2008 |
| 7432334 |
Silicone-modified single-component casting compound |
Oct. 7, 2008 |
| 7405246 |
Cure system, adhesive system, electronic device |
Jul. 29, 2008 |
| 7384682 |
Electronic package with epoxy or cyanate ester resin encapsulant |
Jun. 10, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7368170 |
Viscous chemical anchoring adhesive |
May. 6, 2008 |
| 7321005 |
Encapsulant composition and electronic package utilizing same |
Jan. 22, 2008 |
| 7311972 |
Filled epoxy resin compositions |
Dec. 25, 2007 |
| 7312104 |
Resin composition for encapsulating semiconductor device |
Dec. 25, 2007 |
| 7304102 |
Process for making encapsulant for opto-electronic devices |
Dec. 4, 2007 |
| 7282266 |
Corrosion and alkali-resistant compositions and methods for using the same |
Oct. 16, 2007 |
| 7279223 |
Underfill composition and packaged solid state device |
Oct. 9, 2007 |
| 7262233 |
Surface treated silicas |
Aug. 28, 2007 |
| 7192997 |
Encapsulant composition and electronic package utilizing same |
Mar. 20, 2007 |
| 7157119 |
Method and compositions for applying multiple overlying organic pigmented decorations on ceramic substrates |
Jan. 2, 2007 |
| 7147897 |
Weldable compositions comprising a conductive pigment and silicon and methods for using the same |
Dec. 12, 2006 |
| 7125916 |
Method for producing nanosilica plates |
Oct. 24, 2006 |
| 7026382 |
Conductive resin composition |
Apr. 11, 2006 |
| 7022410 |
Combinations of resin compositions and methods of use thereof |
Apr. 4, 2006 |
| 7008982 |
Surface treated silicas |
Mar. 7, 2006 |
| 6855197 |
Tooth cavity restoration with nanocomposite of epoxy resin and nanoparticles |
Feb. 15, 2005 |
| 6855751 |
Silica powder and method for producing the same |
Feb. 15, 2005 |
| 6846559 |
Activatable material |
Jan. 25, 2005 |
| 6822341 |
Latent catalysts for molding compounds |
Nov. 23, 2004 |
| 6818685 |
Ink-receptive coatings and recording medium prepared therefrom |
Nov. 16, 2004 |
| 6809130 |
Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same |
Oct. 26, 2004 |
| 6779656 |
Polymerizable preparations based on epoxides that contain silicon |
Aug. 24, 2004 |
| 6749896 |
Self-cross linking powder paint based on epoxy resins and the use thereof |
Jun. 15, 2004 |
| 6743510 |
Composition comprising a cationic polymerization compound and coating obtained from the same |
Jun. 1, 2004 |
| 6733901 |
Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
May. 11, 2004 |
| 6710105 |
Curable epoxy resin composition comprising fillers |
Mar. 23, 2004 |
| 6709756 |
Optical device-related adhesive and optical device |
Mar. 23, 2004 |
| 6706417 |
Fluxing underfill compositions |
Mar. 16, 2004 |
| 6706405 |
Composite coating for imparting particel erosion resistance |
Mar. 16, 2004 |
| 6692664 |
Printed wiring board conductive via hole filler having metal oxide reducing capability |
Feb. 17, 2004 |
| 6664307 |
Low-shrinkage epoxy resin formulation |
Dec. 16, 2003 |
| 6656996 |
Semiconductor-sealing resin composition and semiconductor device using it |
Dec. 2, 2003 |
| 6645643 |
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
Nov. 11, 2003 |
| 6620862 |
Sheet resin composition and process for manufacturing semiconductor device therewith |
Sep. 16, 2003 |
| 6569922 |
Silica powder and method for producing the same |
May. 27, 2003 |
| 6566422 |
Connecting material |
May. 20, 2003 |
| 6562482 |
Liquid potting composition |
May. 13, 2003 |
| 6562884 |
Epoxy resin compositions having a long shelf life |
May. 13, 2003 |
| 6559206 |
Bitumen and filled resin emulsion for road surfacing emulsion |
May. 6, 2003 |
| 6555601 |
Process for impregnating electrical coils, and selected epoxy composition for carrying out the impregnation |
Apr. 29, 2003 |
| 6521354 |
Epoxy resin composition and semiconductor device |
Feb. 18, 2003 |
| 6518332 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith |
Feb. 11, 2003 |
| 6512031 |
Epoxy resin composition, laminate film using the same, and semiconductor device |
Jan. 28, 2003 |
| 6506822 |
Epoxy resin composition |
Jan. 14, 2003 |
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