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Class Information
Number: 523/427
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof > Composition wherein two or more polymers or a polymer and a reactant all contain more than one 1,2-epoxy group, or product thereof
Description: Subject matter wherein the composition contains two or more polymers or a polymer and a reactant all of which contains more than one 1,2-epoxy group or product thereof, e.g., an epoxy resin of a diglycidyl ether of an aliphatic diol and an epoxy resin from bisphenol A, etc.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456230 |
Cationically photocurable epoxy resin compositions |
Nov. 25, 2008 |
| 7446136 |
Method for producing cure system, adhesive system, and electronic device |
Nov. 4, 2008 |
| 7405246 |
Cure system, adhesive system, electronic device |
Jul. 29, 2008 |
| 7390858 |
Coating compositions and methods |
Jun. 24, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7345102 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
Mar. 18, 2008 |
| 7311972 |
Filled epoxy resin compositions |
Dec. 25, 2007 |
| 7304102 |
Process for making encapsulant for opto-electronic devices |
Dec. 4, 2007 |
| 7294660 |
Epoxy resin composition |
Nov. 13, 2007 |
| 7288606 |
Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities |
Oct. 30, 2007 |
| 7179552 |
Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
Feb. 20, 2007 |
| 7105614 |
Curable epoxy resin composition |
Sep. 12, 2006 |
| 7098276 |
Flame-retardant epoxy resin composition and semiconductor device made using the same |
Aug. 29, 2006 |
| 7070861 |
Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition |
Jul. 4, 2006 |
| 7064157 |
Flame retardant resin and flame retardant composition containing the same |
Jun. 20, 2006 |
| 7056978 |
Toughened epoxy-anhydride no-flow underfill encapsulant |
Jun. 6, 2006 |
| 7037586 |
Film for circuit board |
May. 2, 2006 |
| 7009008 |
Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities |
Mar. 7, 2006 |
| 7005185 |
Quick cure carbon fiber reinforced epoxy resin |
Feb. 28, 2006 |
| 6955739 |
Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
Oct. 18, 2005 |
| 6936664 |
Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
Aug. 30, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6902689 |
Epoxy, epoxy system, and method of forming a conductive adhesive connection |
Jun. 7, 2005 |
| 6881768 |
Water-based epoxy grout |
Apr. 19, 2005 |
| 6881769 |
Matting agents for thermally curable systems |
Apr. 19, 2005 |
| 6844379 |
Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts |
Jan. 18, 2005 |
| 6805958 |
Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
Oct. 19, 2004 |
| 6770965 |
Wiring substrate using embedding resin |
Aug. 3, 2004 |
| 6684936 |
Erosion-resistant cold-box foundry binder systems |
Feb. 3, 2004 |
| 6686402 |
Cold-box foundry binder systems |
Feb. 3, 2004 |
| 6620510 |
Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers |
Sep. 16, 2003 |
| 6613438 |
Single component adhesive with an adaptable open joint time |
Sep. 2, 2003 |
| 6607825 |
Metal film bonded body, bonding agent layer and bonding agent |
Aug. 19, 2003 |
| 6518331 |
Composition of epoxy resins and curing agent capable of being coarsened |
Feb. 11, 2003 |
| 6506820 |
Method for manufacture of particles for powder coating |
Jan. 14, 2003 |
| 6492483 |
Integrated continuous process for upstaging epoxy resins |
Dec. 10, 2002 |
| 6489380 |
Long and short-chain cycloaliphatic epoxy resins with cyanate ester |
Dec. 3, 2002 |
| 6489042 |
Photoimageable dielectric material for circuit protection |
Dec. 3, 2002 |
| 6486235 |
Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH) |
Nov. 26, 2002 |
| 6469074 |
Composition of cyanate ester, epoxy resin and acid anhydride |
Oct. 22, 2002 |
| 6459358 |
Flexible moldable conductive current-limiting materials |
Oct. 1, 2002 |
| 6458917 |
Polymerizable composition |
Oct. 1, 2002 |
| 6423367 |
Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
Jul. 23, 2002 |
| 6417322 |
Episulfide based polymerizable composition catalyzed by an (alkoxyphenyl)phosphine, articles made therefrom and process for making same |
Jul. 9, 2002 |
| 6403221 |
Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
Jun. 11, 2002 |
| 6379799 |
Low moisture absorption epoxy resin systems with alkylated diamine hardeners |
Apr. 30, 2002 |
| 6376053 |
Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
Apr. 23, 2002 |
| 6361879 |
Semiconductor device and method for fabricating it, and semiconductor sealing resin composition |
Mar. 26, 2002 |
| 6350825 |
Reacting diglycidyl, bisphenol and monophenol with catalyst and mixing with polyglycidyl |
Feb. 26, 2002 |
| 6300464 |
Polymerizable composition |
Oct. 9, 2001 |
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