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Class Information
Number: 523/400
Name: Synthetic resins or natural rubbers -- part of the class 520 series > Synthetic resins (class 520, subclass 1) > Processes of preparing a desired or intentional composition of at least one nonreactant material and at least one solid polymer or specified intermediate condensation product, or product thereof > Process of forming a composition containing a nonreactive material (nrm) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof
Description: Subject matter concerning the process of forming a composition containing a nonreactive material (NRM) admixed with at least one polymer containing more than one 1,2-epoxy group; or with a polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group; or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 523/401 |
Contains inorganic water settable material nrm |
51 |
| 523/402 |
Product contains water per se or water of hydration as designated nonreactive material (dnrm) |
297 |
| 523/427 |
Composition wherein two or more polymers or a polymer and a reactant all contain more than one 1,2-epoxy group, or product thereof |
194 |
| 523/435 |
Solid polymer derived from reactant containing element other than c, h, o, or n or chlorine-containing reactant of three or more carbon atoms |
187 |
| 523/436 |
Polymer is graft, graft-type, block, or block-type |
127 |
| 523/437 |
Two or more polymers derived from ethylenic reactants only |
96 |
| 523/439 |
Polymer derived from ethylenic reactants only derived from heterocyclic reactant other than 1,2-epoxy solely |
45 |
| 523/440 |
Designated nonreactive material (dnrm) has numerically specified characteristics, e.g., particle size, density, etc., other than viscosity, m.p., b.p., molec. wt., chemical composition or percentage range |
182 |
| 523/445 |
Boron dnrm |
105 |
| 523/446 |
Biologically derived cellular material other than cereal, cotton, or diatomaceous earth dnrm |
19 |
| 523/447 |
Carbohydrate or derivative including tannin or derivative dnrm |
33 |
| 523/449 |
Protein or biologically active polypeptide dnrm |
13 |
| 523/450 |
Coal, asphaltic, or bituminous material dnrm |
33 |
| 523/451 |
Phosphorus dnrm |
185 |
| 523/453 |
Organic sulfur compound dnrm |
76 |
| 523/454 |
Ketone or aldehyde dnrm |
122 |
| 523/455 |
Carboxylic acid or derivative devoid of heavy metal atom dnrm |
241 |
| 523/456 |
Organic chalcogen compound dnrm |
291 |
| 523/457 |
Elemental metal or metal compound other than as silicate dnrm |
421 |
| 523/461 |
Organic nitrogen compound dnrm |
144 |
| 523/462 |
Halogenated hydrocarbon other than carbon tetrachloride, chloroform, or methylene chloride dnrm |
30 |
| 523/463 |
Hydrocarbon other than xylenes, benzene, or toluene dnrm |
61 |
| 523/466 |
Inorganic si-o bond dnrm |
533 |
| 523/468 |
Elemental carbon dnrm |
217 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456235 |
Flame-retardant composition for coating powders |
Nov. 25, 2008 |
| 7442434 |
Epoxy resin composition |
Oct. 28, 2008 |
| 7431990 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Oct. 7, 2008 |
| 7393419 |
Conductive adhesive rework method |
Jul. 1, 2008 |
| 7390571 |
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
Jun. 24, 2008 |
| 7338226 |
Aerosol can containing a two-component epoxy-paint |
Mar. 4, 2008 |
| 7338712 |
Coating composition for a smoothing and/or polishing element and a grinding wheel provided with said coating composition |
Mar. 4, 2008 |
| 7326755 |
Coolant resistant and thermally stable primer composition |
Feb. 5, 2008 |
| 7312260 |
Epoxide adducts and their salts as dispersants |
Dec. 25, 2007 |
| 7297406 |
Lead-free electrodeposition coating composition and coated article |
Nov. 20, 2007 |
| 7288161 |
Reworkable adhesives containing thermally labile groups |
Oct. 30, 2007 |
| 7268181 |
Volume-modified casting compounds based on polymeric matrix resins |
Sep. 11, 2007 |
| 7268174 |
Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same |
Sep. 11, 2007 |
| 7262233 |
Surface treated silicas |
Aug. 28, 2007 |
| 7253219 |
Functional composite material using shape memory alloy and production method therefor |
Aug. 7, 2007 |
| 7244786 |
Flame-retardant resin composition, moldings thereof and flame retardant |
Jul. 17, 2007 |
| 7208228 |
Epoxy resin for fiber reinforced composite materials |
Apr. 24, 2007 |
| 7179552 |
Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
Feb. 20, 2007 |
| 7157313 |
Epoxy resin composition and semiconductor device using thereof |
Jan. 2, 2007 |
| 7157143 |
Two-component epoxy adhesive formulation for high elongation with low modulus |
Jan. 2, 2007 |
| 7138444 |
Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
Nov. 21, 2006 |
| 7125916 |
Method for producing nanosilica plates |
Oct. 24, 2006 |
| 7122595 |
Powder-slurry that can be hardened by actinic radiation or by thermal means, method for producing said slurry and use of the same |
Oct. 17, 2006 |
| 7097881 |
Printed release liners |
Aug. 29, 2006 |
| 7094468 |
Sizing agent for carbon fiber, aqueous dispersion thereof, carbon fiber treated by sizing sheet-form object comprising the carbon fiber, and carbon fiber-reinforced coposite material |
Aug. 22, 2006 |
| 7090895 |
Flame retardant epoxy resin composition, semiconductor encapsulating material using same, and resin encapsulated semiconductor device |
Aug. 15, 2006 |
| 7087304 |
Polysulfide-based toughening agents, compositions containing same and methods for the use thereof |
Aug. 8, 2006 |
| 7084210 |
Heat activated epoxy adhesive and use in a structural foam insert |
Aug. 1, 2006 |
| 7056978 |
Toughened epoxy-anhydride no-flow underfill encapsulant |
Jun. 6, 2006 |
| 7041399 |
Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
May. 9, 2006 |
| 7026382 |
Conductive resin composition |
Apr. 11, 2006 |
| 7008995 |
Carboxy resin crosslinkers |
Mar. 7, 2006 |
| 7005483 |
Epoxy ebonite compositions |
Feb. 28, 2006 |
| 6984262 |
Adhesion enhancing coating composition, process for using and articles produced |
Jan. 10, 2006 |
| 6936644 |
Releasable microcapsule and adhesive curing system using the same |
Aug. 30, 2005 |
| 6936646 |
Flame-retardant molding compositions |
Aug. 30, 2005 |
| 6933050 |
Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
Aug. 23, 2005 |
| 6919305 |
Solid detergent compositions and methods of preparing the same |
Jul. 19, 2005 |
| 6916538 |
Thermosetting resin composition and semiconductor device obtained with the same |
Jul. 12, 2005 |
| 6906120 |
Poly(arylene ether) adhesive compositions |
Jun. 14, 2005 |
| 6899917 |
Powdered epoxy composition |
May. 31, 2005 |
| 6887737 |
Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
May. 3, 2005 |
| 6881769 |
Matting agents for thermally curable systems |
Apr. 19, 2005 |
| 6878448 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
Apr. 12, 2005 |
| 6858257 |
Powder coating composition |
Feb. 22, 2005 |
| 6841605 |
Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same |
Jan. 11, 2005 |
| 6841251 |
Composition having sealing and sound dampening properties and methods related thereto |
Jan. 11, 2005 |
| 6838176 |
Epoxy resin composition and prepreg made with the epoxy resin composition |
Jan. 4, 2005 |
| 6833442 |
Complex and method for producing epoxides by using the complex |
Dec. 21, 2004 |
| 6831116 |
Polymeric modifying agents |
Dec. 14, 2004 |
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