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Class Information
Number: 451/57
Name: Abrading > Abrading process > Combined abrading
Description: Method wherein a workpiece is subjected to at least two abrading operations which are relative to one another and occur either (a) concurrently, but over separately defined work surfaces, or (b) in sequence.

Sub-classes under this class:

Class Number Class Name Patents
451/58 Utilizing mounted rigid abrading tool only 221

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
8712575 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder Apr. 29, 2014
8690640 Complex geographical edge polishing Apr. 8, 2014
8684796 Floor grinding and polishing machine Apr. 1, 2014
8668553 Method of manufacturing semiconductor device Mar. 11, 2014
8657648 Processing apparatus having four processing units Feb. 25, 2014
8657645 Methods for testing the polishability of materials Feb. 25, 2014
8647173 Method for polishing a semiconductor wafer Feb. 11, 2014
8616935 Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing Dec. 31, 2013
8616937 Running bases Dec. 31, 2013
8615317 Process and apparatus for generating control data for controlling a tool on a machine tool comprising at least 5 axes Dec. 24, 2013
8597388 System for making a dental restoration providing ventilation of a control unit of the system, and a corresponding method Dec. 3, 2013
8591287 Methods of fabricating a honeycomb extrusion die from a die body Nov. 26, 2013
8585465 Planarization of a material system in a semiconductor device by using a non-selective in situ prepared slurry Nov. 19, 2013
8560111 Method of determining pressure to apply to wafers during a CMP Oct. 15, 2013
8551253 Post polish disk cleaning process Oct. 8, 2013
8550880 Platen and adapter assemblies for facilitating silicon electrode polishing Oct. 8, 2013
8550876 Force-controlled surface finishing through the use of a passive magnetic constant-force device Oct. 8, 2013
8529315 Method for producing a semiconductor wafer Sep. 10, 2013
8523636 Working object grinding method Sep. 3, 2013
8517800 Polishing pad and fabricating method thereof Aug. 27, 2013
8517801 Method for producing pulley for belt-type continuously variable transmission Aug. 27, 2013
8512099 Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers Aug. 20, 2013
8500518 Method of grinding an indexable insert and grinding wheel for carrying out the grinding method Aug. 6, 2013
8500517 Preparation of synthetic quartz glass substrates Aug. 6, 2013
8500516 Method for polishing a semiconductor wafer Aug. 6, 2013
8480454 Glass substrate for information recording medium and method for manufacturing the same Jul. 9, 2013
8469774 Amorphous alloy component and surface treating method for making same Jun. 25, 2013
8460058 Complex apparatus and method for polishing an ingot block Jun. 11, 2013
8460061 Method for producing large-size synthetic quartz glass substrate Jun. 11, 2013
8454852 Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer Jun. 4, 2013
8444455 Polishing pad and method for polishing a semiconductor wafer May. 21, 2013
8439725 Method and device for the production of a precise concrete prefabricated part May. 14, 2013
8403725 Method and device for machining workpieces Mar. 26, 2013
8403727 Pre-planarization system and method Mar. 26, 2013
8398457 Multi-sander Mar. 19, 2013
8388411 Method for polishing the edge of a semiconductor wafer Mar. 5, 2013
8376810 Method for chemically grinding a semiconductor wafer on both sides Feb. 19, 2013
8376811 Method for the double sided polishing of a semiconductor wafer Feb. 19, 2013
8369976 Method for compensating for tool processing variation in the routing of wafers/lots Feb. 5, 2013
8366514 Semiconductor substrate planarization apparatus and planarization method Feb. 5, 2013
8365715 Combined apparatus for machining of articles in particular in form of slabs Feb. 5, 2013
8360819 Method for grinding a machine part, and grinding machine for carrying out said method Jan. 29, 2013
8360824 Method of processing synthetic quartz glass substrate for semiconductor Jan. 29, 2013
8348718 Servo stroking method and system for producing special shapes Jan. 8, 2013
8333637 Manufacturing method of metal mold and relection mirror for projection optical system Dec. 18, 2012
8323072 Method of polishing transparent armor Dec. 4, 2012
8303373 Slurry supplying apparatus and method of polishing semiconductor wafer utilizing same Nov. 6, 2012
8303377 Heat-resistant roll, production method thereof, and method of producing sheet glass using heat-resistant roll Nov. 6, 2012
8292698 On-line chamber cleaning using dry ice blasting Oct. 23, 2012
8277283 Wafer polishing method and wafer produced thereby Oct. 2, 2012

1 2 3 4 5 6 7 8 9 10 11 12 13 14

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