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Class Information
Number: 451/55
Name: Abrading > Abrading process > With critical nonabrading work treating > Deforming
Description: Method wherein the workpiece is altered in shape or dimension.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8398463 Pad conditioner and method Mar. 19, 2013
8192248 Semiconductor wafer polishing apparatus and method of polishing Jun. 5, 2012
8087973 Slider with leading edge blend and conformal step features Jan. 3, 2012
8062094 Process of durability improvement of gear tooth flank surface Nov. 22, 2011
8047898 Grinder wheel for liquid crystal display device and method of fabricating liquid crystal display device using the same Nov. 1, 2011
7950982 Method for achieving stripe height control at bow compensated lapping May. 31, 2011
7862404 Micro-concave portion machining method Jan. 4, 2011
7794307 Method for correcting semi-conductive belt Sep. 14, 2010
RE41329 Machining apparatus for workpiece and method therefor May. 11, 2010
7534159 Processing method and apparatus May. 19, 2009
7527547 Wafer processing method May. 5, 2009
7481697 Head slider and method of manufacturing same Jan. 27, 2009
7458880 Method for grinding of cam profiles Dec. 2, 2008
7435607 Method of wafer laser processing using a gas permeable protective tape Oct. 14, 2008
7255896 Producing method for die coater and coating apparatus Aug. 14, 2007
7144303 Method of polishing a large part and abrasive for use in the method Dec. 5, 2006
7134942 Wafer processing method Nov. 14, 2006
7134943 Wafer processing method Nov. 14, 2006
7096561 Separator plate for wet-type multiplate clutch and wet-type multiplate clutch provided with such separator plates Aug. 29, 2006
6966820 High quality optically polished aluminum mirror and process for producing Nov. 22, 2005
6869338 Method of surface-treating reactor member and method of manufacturing reactor member by using the surface treatment method Mar. 22, 2005
6859984 Method for providing a matrix array ultrasonic transducer with an integrated interconnection means Mar. 1, 2005
6855033 Fixture for clamping a gas turbine component blank and its use in shaping the gas turbine component blank Feb. 15, 2005
6827634 Ultra fine particle film forming method and apparatus Dec. 7, 2004
6786804 Siding board for clapboard boarding and a clapboard boarding structure Sep. 7, 2004
6767275 Machining apparatus for workpiece and method therefor Jul. 27, 2004
6709321 Processing jig Mar. 23, 2004
6623336 Magnetic head polishing device and method thereof Sep. 23, 2003
6599170 Method and apparatus for polishing, and lapping jig Jul. 29, 2003
6596150 Production method for an aluminum support for a lithographic printing plate Jul. 22, 2003
6571444 Method of manufacturing an ultrasonic transducer Jun. 3, 2003
6565414 Polishing apparatus for magnetic head and method therefor May. 20, 2003
6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad. Mar. 18, 2003
6527623 Method of treating a surface with hard particles using free running rollers Mar. 4, 2003
6488572 Method and apparatus for removing marine organisms from a submerged substrate Dec. 3, 2002
6447367 Processing jig Sep. 10, 2002
6431958 Method for mechanochemical treatment of a material Aug. 13, 2002
6416617 Apparatus and method for chemical/mechanical polishing Jul. 9, 2002
6375553 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks Apr. 23, 2002
6364751 Method for singling semiconductor components and semiconductor component singling device Apr. 2, 2002
6346029 Bow compensated lapping Feb. 12, 2002
6290579 Fixed abrasive polishing pad Sep. 18, 2001
6287170 Multipoint bending apparatus for lapping heads of a data storage device Sep. 11, 2001
6277000 Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks Aug. 21, 2001
6193585 Method of polishing a hard material-coated wafer Feb. 27, 2001
6186873 Wafer edge cleaning Feb. 13, 2001
6146247 Method and apparatus for grinding the surface of a work Nov. 14, 2000
6139403 Method and device for positioning and accessing a die under analysis Oct. 31, 2000
6113468 Wafer planarization carrier having floating pad load ring Sep. 5, 2000
6086459 Device for deburring edges on an object Jul. 11, 2000

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