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Browse by Category: Main > Tools & Hardware
Class Information
Number: 451/534
Name: Abrading > Flexible-member tool, per se > Laminate > Discontinuous or differential coating impregnation or bond
Description: Flexible-member tool comprising plastic facing, saturating, or joining material which is present in isolated areas, or as differing compositions, or varying in concentration or in physical characteristics; or comprising plural layers whose juncture (either adhesive or cohesive) is of different character (e.g., strong bond next to weak bond) in different areas of the tool.


Patents under this class:
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Patent Number Title Of Patent Date Issued
7544114 Abrasive articles with novel structures and methods for grinding Jun. 9, 2009
7520968 Conductive pad design modification for better wafer-pad contact Apr. 21, 2009
7427340 Conductive pad Sep. 23, 2008
7374476 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates May. 20, 2008
7364501 Sanding block and method of making same Apr. 29, 2008
7329171 Fixed abrasive article for use in modifying a semiconductor wafer Feb. 12, 2008
7275980 Abrasive articles with novel structures and methods for grinding Oct. 2, 2007
7163450 Abrasive pad Jan. 16, 2007
7137872 Scratch removal device and method Nov. 21, 2006
7077737 Flexible file and file dispenser system Jul. 18, 2006
6986705 Polishing pad and method of making same Jan. 17, 2006
6935931 Microporous polishing pads Aug. 30, 2005
6929539 Flexible abrasive product and method of making and using the same Aug. 16, 2005
6921566 Cushioned grip tape Jul. 26, 2005
6915796 Superabrasive wire saw and associated methods of manufacture Jul. 12, 2005
6913517 Microporous polishing pads Jul. 5, 2005
6905526 Fabrication of an ion exchange polish pad Jun. 14, 2005
6899598 Microporous polishing pads May. 31, 2005
6896593 Microporous polishing pads May. 24, 2005
6881483 Ceramic aggregate particles Apr. 19, 2005
6875097 Fixed abrasive CMP pad with built-in additives Apr. 5, 2005
6846232 Backing and abrasive product made with the backing and method of making and using the backing and abrasive product Jan. 25, 2005
6840843 Method for manufacturing a polishing pad having a compressed translucent region Jan. 11, 2005
6837781 Polishing pad Jan. 4, 2005
6790126 Agglomerate abrasive grain and a method of making the same Sep. 14, 2004
6786801 Method for gasket removal Sep. 7, 2004
6752708 Pad conditioner for semiconductor substrates Jun. 22, 2004
6716092 Apparatus for making a polishing pad with a partial adhesive coating Apr. 6, 2004
6632129 Fixed abrasive article for use in modifying a semiconductor wafer Oct. 14, 2003
6616520 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate Sep. 9, 2003
6582289 Flap disc Jun. 24, 2003
6537140 Patterned abrasive tools Mar. 25, 2003
6517426 Composite polishing pad for chemical-mechanical polishing Feb. 11, 2003
6514132 Hardened skin care instrument Feb. 4, 2003
6500220 Impregnated grinding wheel Dec. 31, 2002
6464576 Stacked polishing pad having sealed edge Oct. 15, 2002
6458023 Multi characterized chemical mechanical polishing pad and method for fabricating the same Oct. 1, 2002
6425803 Scored polishing pad and methods relating thereto Jul. 30, 2002
6419573 Sanding sponge with high tear strength backing layer Jul. 16, 2002
6406577 Method of making abrasive belt with an endless, seamless backing Jun. 18, 2002
6406576 Method of making coated abrasive belt with an endless, seamless backing Jun. 18, 2002
6375543 Abrasive molding, abrasive disc and polishing process using the abrasive disc Apr. 23, 2002
6337280 Polishing cloth and method of manufacturing semiconductor device using the same Jan. 8, 2002
6299521 Polishing sheet Oct. 9, 2001
6231427 Linear polisher and method for semiconductor wafer planarization May. 15, 2001
6217432 Abrasive article comprising a barrier coating Apr. 17, 2001
6190240 Method for producing pad conditioner for semiconductor substrates Feb. 20, 2001
6120359 Apparatus and method for forming spherical end surface of coaxial composite member Sep. 19, 2000
6117000 Polishing pad for a semiconductor substrate Sep. 12, 2000
6095912 Flexible abrasive member Aug. 1, 2000

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