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Class Information
Number: 451/530
Name: Abrading > Flexible-member tool, per se > Work face variegated or on projecting backing
Description: Flexible-member tool whose abrasive work engaging face comprises either (a) different sizes or kinds of abrasive particles of one uninterrupted layer* or (b) an uninterrupted abrasive layer which does not completely cover the supporting structure.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7604529 |
Three-dimensional network for chemical mechanical polishing |
Oct. 20, 2009 |
| 7594845 |
Abrasive article and method of modifying the surface of a workpiece |
Sep. 29, 2009 |
| 7553346 |
Abrasive product |
Jun. 30, 2009 |
| 7527546 |
Viscoelastic polisher and polishing method using the same |
May. 5, 2009 |
| 7520800 |
Raised island abrasive, lapping apparatus and method of use |
Apr. 21, 2009 |
| 7452265 |
Abrasive article and methods of making same |
Nov. 18, 2008 |
| 7429210 |
Materials for chemical mechanical polishing |
Sep. 30, 2008 |
| 7377840 |
Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
May. 27, 2008 |
| 7329175 |
Abrasive article and methods of making same |
Feb. 12, 2008 |
| 7316605 |
Sheet for mounting polishing workpiece and method for making the same |
Jan. 8, 2008 |
| 7300340 |
CMP pad having overlaid constant area spiral grooves |
Nov. 27, 2007 |
| 7300342 |
Scratch removal device and method |
Nov. 27, 2007 |
| 7294048 |
Abrasive article |
Nov. 13, 2007 |
| 7267610 |
CMP pad having unevenly spaced grooves |
Sep. 11, 2007 |
| 7238097 |
Polishing pad and method of producing same |
Jul. 3, 2007 |
| 7214126 |
Abrasive material |
May. 8, 2007 |
| 7204742 |
Polishing pad comprising hydrophobic region and endpoint detection port |
Apr. 17, 2007 |
| 7201647 |
Subpad having robust, sealed edges |
Apr. 10, 2007 |
| 7182677 |
Chemical mechanical polishing pad for controlling polishing slurry distribution |
Feb. 27, 2007 |
| 7179159 |
Materials for chemical mechanical polishing |
Feb. 20, 2007 |
| 7160181 |
Polishing pad of CMP equipment for polishing a semiconductor wafer |
Jan. 9, 2007 |
| 7137872 |
Scratch removal device and method |
Nov. 21, 2006 |
| 7134953 |
Endless abrasive belt and method of making the same |
Nov. 14, 2006 |
| 7131895 |
CMP pad having a radially alternating groove segment configuration |
Nov. 7, 2006 |
| 7131901 |
Polishing pad and fabricating method thereof |
Nov. 7, 2006 |
| 7097550 |
Chemical mechanical polishing pad |
Aug. 29, 2006 |
| 7077723 |
Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives |
Jul. 18, 2006 |
| 7059949 |
CMP pad having an overlapping stepped groove arrangement |
Jun. 13, 2006 |
| 7059950 |
CMP polishing pad having grooves arranged to improve polishing medium utilization |
Jun. 13, 2006 |
| 7059951 |
Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method |
Jun. 13, 2006 |
| 7018282 |
Customized polishing pad for selective process performance during chemical mechanical polishing |
Mar. 28, 2006 |
| 6998166 |
Polishing pad with oriented pore structure |
Feb. 14, 2006 |
| 6997793 |
Polishing pad, polishing apparatus having the same, and bonding apparatus |
Feb. 14, 2006 |
| 6986706 |
Polishing pad and method of producing the same |
Jan. 17, 2006 |
| 6976910 |
Polishing pad |
Dec. 20, 2005 |
| 6951506 |
Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
Oct. 4, 2005 |
| 6913519 |
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
Jul. 5, 2005 |
| 6913527 |
Edge-sealed pad for CMP process |
Jul. 5, 2005 |
| 6899611 |
Polishing pad for a semiconductor device having a dissolvable substance |
May. 31, 2005 |
| 6896606 |
Drywall sanding implement |
May. 24, 2005 |
| 6893325 |
Method and apparatus for increasing chemical-mechanical-polishing selectivity |
May. 17, 2005 |
| 6884156 |
Multi-layer polishing pad material for CMP |
Apr. 26, 2005 |
| 6875096 |
Chemical mechanical polishing pad having holes and or grooves |
Apr. 5, 2005 |
| 6846232 |
Backing and abrasive product made with the backing and method of making and using the backing and abrasive product |
Jan. 25, 2005 |
| 6837780 |
Lapping and polishing device |
Jan. 4, 2005 |
| 6830506 |
Surface processing abrasive body, support provided with said body and machine comprising the processing abrasive body and support |
Dec. 14, 2004 |
| 6821189 |
Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
Nov. 23, 2004 |
| 6783448 |
Foam buffing/polishing pad |
Aug. 31, 2004 |
| 6780095 |
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
Aug. 24, 2004 |
| 6776699 |
Abrasive pad for CMP |
Aug. 17, 2004 |
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