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Class Information
Number: 451/285
Name: Abrading > Machine > Rotary tool > Rotary disk > Work rotating > Rotary work holder
Description: Abrading machine including a member adapted to grip and turn with the work about an axis more than 360°.










Sub-classes under this class:

Class Number Class Name Patents
451/286 By means loosely confining work 289
451/290 Disk or wheel abrader 195
451/289 Having vacuum or adhesive securing means 355
451/287 Planar surface abrading 1,068
451/291 Planetary 58
451/292 Turret 30


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
6155915 System and method for independent air bearing zoning for semiconductor polishing device Dec. 5, 2000
6149505 Cavitational polishing pad conditioner Nov. 21, 2000
6149506 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen Nov. 21, 2000
6146256 Clamping wafer holder for chemical-mechanical planarization machines and method for using it Nov. 14, 2000
6146250 Process for forming a semiconductor device Nov. 14, 2000
6143127 Carrier head with a retaining ring for a chemical mechanical polishing system Nov. 7, 2000
6139408 Surface grinding machine and carrier used therefor Oct. 31, 2000
6135865 CMP apparatus with built-in slurry distribution and removal Oct. 24, 2000
6123610 Polisher for spherical and non-spherical surfaces Sep. 26, 2000
6123609 Polishing machine with improved polishing pad structure Sep. 26, 2000
6116991 Installation for improving chemical-mechanical polishing operation Sep. 12, 2000
6117778 Semiconductor wafer edge bead removal method and tool Sep. 12, 2000
6116992 Substrate retaining ring Sep. 12, 2000
6113472 Method and an apparatus for polishing a roller and for removing the chromium plating thereof Sep. 5, 2000
6110011 Integrated electrodeposition and chemical-mechanical polishing tool Aug. 29, 2000
6110012 Chemical-mechanical polishing apparatus and method Aug. 29, 2000
6110024 Polishing apparatus Aug. 29, 2000
6102778 Wafer lapping method capable of achieving a stable abrasion rate Aug. 15, 2000
6102776 Apparatus and method for controlling polishing of integrated circuit substrates Aug. 15, 2000
6102780 Substrate polishing apparatus and method for polishing semiconductor substrate Aug. 15, 2000
6099386 Control device for maintaining a chemical mechanical polishing machine in a wet mode Aug. 8, 2000
6095908 Polishing apparatus having a material for adjusting a surface of a polishing pad and method for adjusting the surface of the polishing pad Aug. 1, 2000
6093280 Chemical-mechanical polishing pad conditioning systems Jul. 25, 2000
6093088 Surface polishing machine Jul. 25, 2000
6089960 Semiconductor wafer polishing mechanism Jul. 18, 2000
6090475 Polishing pad, methods of manufacturing and use Jul. 18, 2000
6089961 Wafer polishing carrier and ring extension therefor Jul. 18, 2000
6086457 Washing transfer station in a system for chemical mechanical polishing Jul. 11, 2000
6080049 Wafer polishing apparatus Jun. 27, 2000
6080048 Polishing machine Jun. 27, 2000
6077149 Method and apparatus for surface-grinding of workpiece Jun. 20, 2000
6074276 Polishing apparatus Jun. 13, 2000
6074286 Wafer processing apparatus and method of processing a wafer utilizing a processing slurry Jun. 13, 2000
6071177 Method and apparatus for determining end point in a polishing process Jun. 6, 2000
6062961 Wafer polishing head drive May. 16, 2000
6062954 Semiconductor wafer surface flattening apparatus May. 16, 2000
6054015 Apparatus for loading and unloading substrates to a chemical-mechanical planarization machine Apr. 25, 2000
6050882 Carrier head to apply pressure to and retain a substrate Apr. 18, 2000
6045433 Apparatus for optical inspection of wafers during polishing Apr. 4, 2000
6033987 Method for mapping and adjusting pressure distribution of CMP processes Mar. 7, 2000
6033520 Apparatus for and method of polishing workpiece Mar. 7, 2000
6033293 Apparatus for performing chemical-mechanical polishing Mar. 7, 2000
6027398 Wafer polishing apparatus Feb. 22, 2000
6024630 Fluid-pressure regulated wafer polishing head Feb. 15, 2000
6012970 Process for forming a semiconductor device Jan. 11, 2000
6007411 Wafer carrier for chemical mechanical polishing Dec. 28, 1999
6004193 Dual purpose retaining ring and polishing pad conditioner Dec. 21, 1999
6004187 Method and apparatus for measuring film thickness and film thickness distribution during polishing Dec. 21, 1999
6001001 Apparatus and method for chemical mechanical polishing of a wafer Dec. 14, 1999
5997384 Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates Dec. 7, 1999

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