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Browse by Category: Main > Tools & Hardware
Class Information
Number: 451/10
Name: Abrading > Precision device or process - or with condition responsive control > With indicating > And feeding of tool or work holder
Description: Subject matter combined with the use of means to relatively move an abrading tool and workpiece gripping means.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
6540586 Apparatus and methods for collision detection and recovery for waterjet cutting systems Apr. 1, 2003
6540588 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements Apr. 1, 2003
6533642 Electronic control system by planer/sander Mar. 18, 2003
6520835 Polishing system, polishing method, polishing pad, and method of forming polishing pad Feb. 18, 2003
6520834 Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Feb. 18, 2003
6511364 Method and apparatus for grinding eccentric cylindrical portions of workpiece with diameter measuring device Jan. 28, 2003
6488569 Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process Dec. 3, 2002
6482072 Method and apparatus for providing and controlling delivery of a web of polishing material Nov. 19, 2002
6480757 Method of locating a workpiece on a computer numeric controlled machining system Nov. 12, 2002
6468132 Grinding arrangement Oct. 22, 2002
6464564 System for real-time control of semiconductor wafer polishing Oct. 15, 2002
6464561 System for real-time control of semiconductor wafer polishing Oct. 15, 2002
6462409 Semiconductor wafer polishing apparatus Oct. 8, 2002
6458012 Polishing apparatus Oct. 1, 2002
6454629 Method for the production of medical fittings, in particular dental fittings Sep. 24, 2002
6447369 Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates Sep. 10, 2002
6431953 CMP process involving frequency analysis-based monitoring Aug. 13, 2002
6428389 Polishing apparatus Aug. 6, 2002
6419552 Thin-film magnetic head manufacturing method and apparatus Jul. 16, 2002
6416385 Method and apparatus for polishing semiconductor wafers Jul. 9, 2002
6413147 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment Jul. 2, 2002
6409576 Polishing apparatus Jun. 25, 2002
6402589 Wafer grinder and method of detecting grinding amount Jun. 11, 2002
6386945 Method of correcting conicity in a tire with a feedback loop May. 14, 2002
6381012 System, method and article of manufacture to determine and communicate optical lens sizing and prescription information Apr. 30, 2002
6379214 Apparatus and methods for z-axis control and collision detection and recovery for waterjet cutting systems Apr. 30, 2002
6361406 Abrasion method of semiconductor device Mar. 26, 2002
6358116 Thrown wafer failsafe system for chemical/mechanical planarization Mar. 19, 2002
6354907 Polishing apparatus including attitude controller for turntable and/or wafer carrier Mar. 12, 2002
6352466 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements Mar. 5, 2002
6347983 ELG for both MRE sensor height and resistance monitoring Feb. 19, 2002
6343974 Real-time method for profiling and conditioning chemical-mechanical polishing pads Feb. 5, 2002
6341996 Tool grinding simulation system Jan. 29, 2002
6338667 System for real-time control of semiconductor wafer polishing Jan. 15, 2002
6338668 In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation Jan. 15, 2002
6336841 Method of CMP endpoint detection Jan. 8, 2002
6331133 Automatic drill bit re-pointing apparatus and method Dec. 18, 2001
6325699 Lapping apparatus and lapping method Dec. 4, 2001
6322423 Internal abrasive machine Nov. 27, 2001
6315634 Method of optimizing chemical mechanical planarization process Nov. 13, 2001
6309277 System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning Oct. 30, 2001
6299507 Thin-film magnetic head manufacturing method and apparatus Oct. 9, 2001
6293845 System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current Sep. 25, 2001
6290570 Belt grinding machine Sep. 18, 2001
6290574 Method and device for centering a dressing tool in the thread of a grinding worm Sep. 18, 2001
6290571 Virtual teach-in system Sep. 18, 2001
6280292 Polishing apparatus Aug. 28, 2001
6280293 End face polishing apparatus and method for polishing end face of ferrule Aug. 28, 2001
6276989 Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing Aug. 21, 2001
6273784 Surface treatment method and apparatus for support of lithographic plate Aug. 14, 2001

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