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Class Information
Number: 438/977
Name: Semiconductor device manufacturing: process > Thinning or removal of substrate
Description: Art collection involving the reduction in thickness of a substrate or the removal of the entirety thereof.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8679887 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained Mar. 25, 2014
8679944 Progressive trimming method Mar. 25, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8669179 Through-wafer interconnects for photoimager and memory wafers Mar. 11, 2014
8669166 Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon Mar. 11, 2014
8664084 Method for making a thin-film element Mar. 4, 2014
8664028 Semiconductor device production process Mar. 4, 2014
8637380 Method of processing silicon and glass substrates using a laser peeling technique Jan. 28, 2014
8558330 Deep well process for MEMS pressure sensor Oct. 15, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8536445 Inverted metamorphic multijunction solar cells Sep. 17, 2013
8530256 Production process for semiconductor device Sep. 10, 2013
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Sep. 3, 2013
8518797 Method of making an SOI substrate by using a separation layer with regions of non-uniform concentration Aug. 27, 2013
8507362 Process of forming ultra thin wafers having an edge support ring Aug. 13, 2013
8507367 Separation of semiconductor devices Aug. 13, 2013
8486805 Through-silicon via and method for forming the same Jul. 16, 2013
8486814 Wafer backside defectivity clean-up utilizing selective removal of substrate material Jul. 16, 2013
8471374 Integrated circuit package system with L-shaped leadfingers Jun. 25, 2013
8465992 Method of manufacturing flexible display device Jun. 18, 2013
8466039 Pressurized treatment of substrates to enhance cleaving process Jun. 18, 2013
8450184 Thin substrate fabrication using stress-induced spalling May. 28, 2013
8420505 Process for manufacture of thin wafer Apr. 16, 2013
8415208 Semiconductor device and peeling off method and method of manufacturing semiconductor device Apr. 9, 2013
8372296 Manufacturing method for a thermal head Feb. 12, 2013
8361822 Light-emitting device and method for producing light emitting device Jan. 29, 2013
8357588 Method for machining a workpiece on a workpiece support Jan. 22, 2013
8314018 Method for manufacturing semiconductor device Nov. 20, 2012
8309403 Method for encapsulating electronic components on a wafer Nov. 13, 2012
8304316 Semiconductor device and method of forming a semiconductor device Nov. 6, 2012
8288250 Method for transferring chips onto a substrate Oct. 16, 2012
8278187 Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatments Oct. 2, 2012
8247261 Thin substrate fabrication using stress-induced substrate spalling Aug. 21, 2012
8236588 Method for manufacturing a multi-wavelength integrated semiconductor laser Aug. 7, 2012
8222083 Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same Jul. 17, 2012
8216917 Method for fabricating a semiconductor on insulator type substrate Jul. 10, 2012
8211780 Method for manufacturing SOI substrate Jul. 3, 2012
8211781 Semiconductor manufacturing method Jul. 3, 2012
8207045 Method for manufacturing SOI substrate Jun. 26, 2012
8169019 Metal-oxide-semiconductor chip and fabrication method thereof May. 1, 2012
8168470 Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound May. 1, 2012
8148237 Pressurized treatment of substrates to enhance cleaving process Apr. 3, 2012
8110439 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Feb. 7, 2012
8101503 Method of producing a thin layer of semiconductor material Jan. 24, 2012
8101523 Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device Jan. 24, 2012
8093687 Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer Jan. 10, 2012
8093138 Method of fabricating an epitaxially grown layer Jan. 10, 2012
8076168 Light-emitting device and method for producing light emitting device Dec. 13, 2011
8048774 Methods and systems for laser machining a substrate Nov. 1, 2011

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