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Class Information
Number: 438/977
Name: Semiconductor device manufacturing: process > Thinning or removal of substrate
Description: Art collection involving the reduction in thickness of a substrate or the removal of the entirety thereof.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622361 |
Method for manufacturing semiconductor device |
Nov. 24, 2009 |
| 7622791 |
III-V group nitride system semiconductor substrate |
Nov. 24, 2009 |
| 7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Nov. 10, 2009 |
| 7601217 |
Method of fabricating an epitaxially grown layer |
Oct. 13, 2009 |
| 7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
Oct. 13, 2009 |
| 7569835 |
Gating grid and method of manufacture |
Aug. 4, 2009 |
| 7563629 |
Method of fabricating vertical structure LEDs |
Jul. 21, 2009 |
| 7560310 |
Semiconductor constructions and semiconductor device fabrication methods |
Jul. 14, 2009 |
| 7544964 |
Method for fabricating thin layer device |
Jun. 9, 2009 |
| 7538010 |
Method of fabricating an epitaxially grown layer |
May. 26, 2009 |
| 7521384 |
Method and apparatus for peeling surface protective film |
Apr. 21, 2009 |
| 7521360 |
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
Apr. 21, 2009 |
| 7510945 |
Element formation substrate, method of manufacturing the same, and semiconductor device |
Mar. 31, 2009 |
| 7507638 |
Ultra-thin die and method of fabricating same |
Mar. 24, 2009 |
| 7504277 |
Method for fabricating a high performance PIN focal plane structure using three handle wafers |
Mar. 17, 2009 |
| 7501303 |
Reflective layer buried in silicon and method of fabrication |
Mar. 10, 2009 |
| 7498076 |
Methods for manufacturing porous dielectric substrates including patterned electrodes |
Mar. 3, 2009 |
| 7485562 |
Method of making multichip wafer level packages and computing systems incorporating same |
Feb. 3, 2009 |
| 7473617 |
Integrated circuit chip manufacturing method and semiconductor device |
Jan. 6, 2009 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7435608 |
III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer |
Oct. 14, 2008 |
| 7410813 |
Method of parallel lapping a semiconductor die |
Aug. 12, 2008 |
| 7410840 |
Building fully-depleted and bulk transistors on same chip |
Aug. 12, 2008 |
| 7410841 |
Building fully-depleted and partially-depleted transistors on same chip |
Aug. 12, 2008 |
| 7387912 |
Packaging of electronic chips with air-bridge structures |
Jun. 17, 2008 |
| 7368310 |
Light generating semiconductor device and method of making the same |
May. 6, 2008 |
| 7361519 |
Method of manufacturing a semiconductor device |
Apr. 22, 2008 |
| 7358593 |
Microfabricated miniature grids |
Apr. 15, 2008 |
| 7354798 |
Three-dimensional device fabrication method |
Apr. 8, 2008 |
| 7351300 |
Peeling method and method of manufacturing semiconductor device |
Apr. 1, 2008 |
| 7348261 |
Wafer scale thin film package |
Mar. 25, 2008 |
| 7344936 |
Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production |
Mar. 18, 2008 |
| 7335575 |
Semiconductor constructions and semiconductor device fabrication methods |
Feb. 26, 2008 |
| 7335578 |
Method for manufacturing semiconductor chip |
Feb. 26, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7314767 |
Method for local wafer thinning and reinforcement |
Jan. 1, 2008 |
| 7309620 |
Use of sacrificial layers in the manufacture of high performance systems on tailored substrates |
Dec. 18, 2007 |
| 7300823 |
Apparatus for housing a micromechanical structure and method for producing the same |
Nov. 27, 2007 |
| 7288471 |
Bumping electronic components using transfer substrates |
Oct. 30, 2007 |
| 7279751 |
Semiconductor laser device and manufacturing method thereof |
Oct. 9, 2007 |
| 7279402 |
Method for fabricating a semiconductor device |
Oct. 9, 2007 |
| 7279400 |
Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass |
Oct. 9, 2007 |
| 7265030 |
Method of fabricating silicon on glass via layer transfer |
Sep. 4, 2007 |
| 7253083 |
Method of thinning a semiconductor structure |
Aug. 7, 2007 |
| 7250325 |
Image sensor with deep well region and method of fabricating the image sensor |
Jul. 31, 2007 |
| 7244663 |
Wafer reinforcement structure and methods of fabrication |
Jul. 17, 2007 |
| 7205211 |
Method for handling semiconductor layers in such a way as to thin same |
Apr. 17, 2007 |
| 7195988 |
Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer |
Mar. 27, 2007 |
| 7189599 |
Lead frame, semiconductor device using the same and method of producing the semiconductor device |
Mar. 13, 2007 |
| 7176102 |
Method for producing SOI wafer and SOI wafer |
Feb. 13, 2007 |
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