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Class Information
Number: 438/976
Name: Semiconductor device manufacturing: process > Temporary protective layer
Description: Art collection involving the temporary use of a protective layer.
Patents under this class:
Patent Number |
Title Of Patent |
Date Issued |
8679280 |
Laser ablation of adhesive for integrated circuit fabrication |
Mar. 25, 2014 |
8679289 |
Method and apparatus for separating protective tape |
Mar. 25, 2014 |
8623721 |
Silicide formation and associated devices |
Jan. 7, 2014 |
8609515 |
Dicing die bonding film, semiconductor wafer, and semiconductor device |
Dec. 17, 2013 |
8561664 |
Die bonder, pickup method, and pickup device |
Oct. 22, 2013 |
8562750 |
Method and apparatus for processing bevel edge |
Oct. 22, 2013 |
8507363 |
Laser and plasma etch wafer dicing using water-soluble die attach film |
Aug. 13, 2013 |
8419895 |
Laser ablation for integrated circuit fabrication |
Apr. 16, 2013 |
8338198 |
Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device |
Dec. 25, 2012 |
8334222 |
Semiconductor wafer processing method and apparatus |
Dec. 18, 2012 |
8309440 |
Method and apparatus for cleaning a substrate surface |
Nov. 13, 2012 |
8268687 |
Three-dimensional semiconductor memory device and method of fabricating the same |
Sep. 18, 2012 |
8192578 |
Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method |
Jun. 5, 2012 |
8172968 |
Method and system for contacting of a flexible sheet and a substrate |
May. 8, 2012 |
8158519 |
Method of manufacturing non-volatile memory cell using self-aligned metal silicide |
Apr. 17, 2012 |
8053337 |
Method of manufacturing semiconductor device |
Nov. 8, 2011 |
8048614 |
Semiconductor integrated circuit device fabrication method |
Nov. 1, 2011 |
8017466 |
Semiconductor device and manufacturing method for the same |
Sep. 13, 2011 |
8008166 |
Method and apparatus for cleaning a substrate surface |
Aug. 30, 2011 |
7981246 |
Method and device for detaching a component which is attached to a flexible film |
Jul. 19, 2011 |
7883989 |
Method for manufacturing semiconductor device |
Feb. 8, 2011 |
7846288 |
Methods and systems for removing protective films from microfeature workpieces |
Dec. 7, 2010 |
7820006 |
Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies |
Oct. 26, 2010 |
7771560 |
Methods to prevent ECC (edge chipping and cracking) damage during die picking process |
Aug. 10, 2010 |
7763145 |
System for removal of an integrated circuit from a mount material |
Jul. 27, 2010 |
7757742 |
Vibration-induced die detachment system |
Jul. 20, 2010 |
7736921 |
Method for manufacturing electroluminescent element |
Jun. 15, 2010 |
7698806 |
Process for fabricating a slider or head for a data storage device |
Apr. 20, 2010 |
7644747 |
Rectangular substrate dividing apparatus |
Jan. 12, 2010 |
7642152 |
Method of fabricating spacers and cleaning method of post-etching and semiconductor device |
Jan. 5, 2010 |
7641760 |
Method of thermal adherend release and apparatus for thermal adherend release |
Jan. 5, 2010 |
7632374 |
Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor |
Dec. 15, 2009 |
7622361 |
Method for manufacturing semiconductor device |
Nov. 24, 2009 |
7614137 |
Method of manufacturing a magnetic slider head |
Nov. 10, 2009 |
7569118 |
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method |
Aug. 4, 2009 |
7540077 |
Method for bonding slider row bars for photolithography process |
Jun. 2, 2009 |
7521384 |
Method and apparatus for peeling surface protective film |
Apr. 21, 2009 |
7497920 |
Method of manufacturing semiconductor device |
Mar. 3, 2009 |
7490650 |
Workpiece processing device |
Feb. 17, 2009 |
7455332 |
Method for controlling overcoat recession in a magnetic thin film head |
Nov. 25, 2008 |
7445688 |
Method and apparatus for picking up work piece and mounting machine |
Nov. 4, 2008 |
7390742 |
Method for producing a rewiring printed circuit board |
Jun. 24, 2008 |
7374584 |
Interconnects forming method and interconnects forming apparatus |
May. 20, 2008 |
7371591 |
Process for manufacturing liquid ejection head |
May. 13, 2008 |
7335605 |
Protective tape applying and separating method |
Feb. 26, 2008 |
7306695 |
Apparatus and method for picking up semiconductor chip |
Dec. 11, 2007 |
7303647 |
Driving mechanism for chip detachment apparatus |
Dec. 4, 2007 |
7297412 |
Fabrication of stacked microelectronic devices |
Nov. 20, 2007 |
7282417 |
Ion doping method to form source and drain |
Oct. 16, 2007 |
7264979 |
Method of manufacturing light emitting device |
Sep. 4, 2007 |
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