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Class Information
Number: 438/974
Name: Semiconductor device manufacturing: process > Substrate surface preparation
Description: Art collection involving treatment of the surface of a substrate prior to an operation being affected thereupon.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8664012 Combined silicon oxide etch and contamination removal process Mar. 4, 2014
8575039 Surface treating method and film depositing method Nov. 5, 2013
8530353 SiC substrate and method of manufacturing the same Sep. 10, 2013
8436366 Substrate composed of silicon carbide with thin film, semiconductor device, and method of manufacturing a semiconductor device May. 7, 2013
8383491 Method for manufacturing semiconductor substrate Feb. 26, 2013
8377825 Semiconductor wafer re-use using chemical mechanical polishing Feb. 19, 2013
8334222 Semiconductor wafer processing method and apparatus Dec. 18, 2012
8268735 Semiconductor device manufacturing method and method for reducing microroughness of semiconductor surface Sep. 18, 2012
8232123 Organic light emitting diode display with improved on-current, and method for manufacturing the same Jul. 31, 2012
8177989 Copper conducting wire structure and fabricating method thereof May. 15, 2012
8153505 Method for low temperature bonding and bonded structure Apr. 10, 2012
8084337 Growth of III-V compound semiconductor nanowires on silicon substrates Dec. 27, 2011
8053329 Method for low temperature bonding and bonded structure Nov. 8, 2011
8048693 Methods and structures for relaxation of strained layers Nov. 1, 2011
8012886 Leadframe treatment for enhancing adhesion of encapsulant thereto Sep. 6, 2011
8012852 Controlled process and resulting device Sep. 6, 2011
7919815 Spinel wafers and methods of preparation Apr. 5, 2011
7871898 Method for low temperature bonding and bonded structure Jan. 18, 2011
7867877 Method for manufacturing SOI wafer Jan. 11, 2011
7846818 Controlled process and resulting device Dec. 7, 2010
7833907 CMP methods avoiding edge erosion and related wafer Nov. 16, 2010
7807549 Method for low temperature bonding and bonded structure Oct. 5, 2010
7781307 Method for low temperature bonding and bonded structure Aug. 24, 2010
7768018 Polarizer based on a nanowire grid Aug. 3, 2010
7737005 Method for forming Ti film and TiN film, contact structure, computer readable storing medium and computer program Jun. 15, 2010
7659148 Bonding method and apparatus Feb. 9, 2010
7553744 Method for low temperature bonding and bonded structure Jun. 30, 2009
7531437 Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material May. 12, 2009
7485551 Semiconductor-on-insulator type heterostructure and method of fabrication Feb. 3, 2009
7439189 Surface treatment after selective etching Oct. 21, 2008
7402520 Edge removal of silicon-on-insulator transfer wafer Jul. 22, 2008
7387944 Method for low temperature bonding and bonded structure Jun. 17, 2008
7374955 Method of manufacturing silicon wafer May. 20, 2008
7371603 Method of fabricating light emitting diode package May. 13, 2008
RE40139 Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer Mar. 4, 2008
7335572 Method for low temperature bonding and bonded structure Feb. 26, 2008
7326656 Method of forming a metal oxide dielectric Feb. 5, 2008
7288418 Process for treating substrates for the microelectronics industry, and substrates obtained by this process Oct. 30, 2007
7190050 Integrated circuit on corrugated substrate Mar. 13, 2007
7166505 Method for making a semiconductor device having a high-k gate dielectric Jan. 23, 2007
7112545 Passivation of material using ultra-fast pulsed laser Sep. 26, 2006
7071077 Method for preparing a bonding surface of a semiconductor layer of a wafer Jul. 4, 2006
7057259 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them Jun. 6, 2006
7052927 Pin detector apparatus and method of fabrication May. 30, 2006
7041178 Method for low temperature bonding and bonded structure May. 9, 2006
7029993 Method for treating substrates for microelectronics and substrates obtained according to said method Apr. 18, 2006
7011717 Method for heat treatment of silicon wafers and silicon wafer Mar. 14, 2006
7008886 Process for treatment of the surface of a semiconducting material, particularly using hydrogen, and surface obtained using this process Mar. 7, 2006
7005368 BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUC Feb. 28, 2006
7001845 Methods of treating surfaces of substrates Feb. 21, 2006

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