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Class Information
Number: 438/963
Name: Semiconductor device manufacturing: process > Removing process residues from vertical substrate surfaces
Description: Art collection involving the removal of unwanted process residues from vertical surfaces of the substrate.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8404590 Plasma processing method and storage medium Mar. 26, 2013
8389351 Method for fabricating semiconductor device Mar. 5, 2013
8143655 Trench schottky barrier diode with differential oxide thickness Mar. 27, 2012
8143701 Method of forming a high capacitance diode and structure therefor Mar. 27, 2012
8124545 Methods of etching oxide, reducing roughness, and forming capacitor constructions Feb. 28, 2012
7977244 Semiconductor manufacturing process Jul. 12, 2011
7846845 Integrated method for removal of halogen residues from etched substrates in a processing system Dec. 7, 2010
7713885 Methods of etching oxide, reducing roughness, and forming capacitor constructions May. 11, 2010
7700490 Semiconductor manufacturing method for removing residue generated by dry etching Apr. 20, 2010
7531492 Composition for the removal of sidewall residues May. 12, 2009
7531434 Method of fabricating semiconductor devices May. 12, 2009
7465977 Method for producing a packaged integrated circuit Dec. 16, 2008
7462553 Ultra thin back-illuminated photodiode array fabrication methods Dec. 9, 2008
7417016 Composition for the removing of sidewall residues Aug. 26, 2008
7347951 Method of manufacturing electronic device Mar. 25, 2008
7332449 Method for forming dual damascenes with supercritical fluid treatments Feb. 19, 2008
7323402 Trench Schottky barrier diode with differential oxide thickness Jan. 29, 2008
7276452 Method for removing mottled etch in semiconductor fabricating process Oct. 2, 2007
7273824 Semiconductor structure and fabrication therefor Sep. 25, 2007
7256134 Selective etching of carbon-doped low-k dielectrics Aug. 14, 2007
7235489 Device and method to eliminate shorting induced by via to metal misalignment Jun. 26, 2007
7208424 Method of forming a semiconductor device having a metal layer Apr. 24, 2007
7192878 Method for removing post-etch residue from wafer surface Mar. 20, 2007
7022537 Liquid crystal display device and fabricating method thereof, and reworking method of alignment film using the same Apr. 4, 2006
7018552 Method of manufacturing electronic device Mar. 28, 2006
6989228 Method and apparatus for processing samples Jan. 24, 2006
6855593 Trench Schottky barrier diode Feb. 15, 2005
6838369 Method for forming contact hole of semiconductor device Jan. 4, 2005
6812120 Method of forming floating gate of memory device Nov. 2, 2004
6812128 Method of manufacturing multilayer structured semiconductor device Nov. 2, 2004
6797618 Method for forming silicide film of a semiconductor device Sep. 28, 2004
6773947 Method of manufacturing semiconductor device including an opening formed by a laser Aug. 10, 2004
6734121 Methods of treating surfaces of substrates May. 11, 2004
6734120 Method of photoresist ash residue removal May. 11, 2004
6723626 Method of manufacturing semiconductor device Apr. 20, 2004
6713376 Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board Mar. 30, 2004
6673721 PROCESS FOR REMOVAL OF PHOTORESIST MASK USED FOR MAKING VIAS IN LOW K CARBON-DOPED SILICON OXIDE DIELECTRIC MATERIAL, AND FOR REMOVAL OF ETCH RESIDUES FROM FORMATION OF VIAS AND REMOVAL OF PHO Jan. 6, 2004
6638875 Oxygen free plasma stripping process Oct. 28, 2003
6596637 Chemically preventing Cu dendrite formation and growth by immersion Jul. 22, 2003
6573181 Method of forming contact structures using nitrogen trifluoride preclean etch process and a titanium chemical vapor deposition step Jun. 3, 2003
6465358 Post etch clean sequence for making a semiconductor device Oct. 15, 2002
6457477 Method of cleaning a copper/porous low-k dual damascene etch Oct. 1, 2002
6454956 Structuring method Sep. 24, 2002
6440874 High throughput plasma resist strip process for temperature sensitive applications Aug. 27, 2002
6432806 Method of forming bumps and template used for forming bumps Aug. 13, 2002
6429142 In-situ photoresist removal by an attachable chamber with light source Aug. 6, 2002
6426275 Method for manufacturing semiconductor chips using protecting pricing and separating sheets Jul. 30, 2002
6417112 Post etch cleaning composition and process for dual damascene system Jul. 9, 2002
6413436 Selective treatment of the surface of a microelectronic workpiece Jul. 2, 2002
6406991 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board Jun. 18, 2002

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