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Class Information
Number: 438/959
Name: Semiconductor device manufacturing: process > Mechanical polishing of wafer
Description: Art collection involving mechanically abrading a semiconductor substrate.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8592316 Nitride semiconductor substrate, production method therefor and nitride semiconductor device Nov. 26, 2013
8552510 Semiconductor device having ring-shaped gate electrode, design apparatus, and program Oct. 8, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8530353 SiC substrate and method of manufacturing the same Sep. 10, 2013
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Sep. 3, 2013
8486805 Through-silicon via and method for forming the same Jul. 16, 2013
8481342 Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device Jul. 9, 2013
8455983 Microelectronic device wafers and methods of manufacturing Jun. 4, 2013
8304345 Germanium layer polishing Nov. 6, 2012
8187907 Solder structures for fabrication of inverted metamorphic multijunction solar cells May. 29, 2012
8124471 Method of post-mold grinding a semiconductor package Feb. 28, 2012
8101523 Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device Jan. 24, 2012
8093137 Method of manufacturing semiconductor wafer Jan. 10, 2012
8062958 Microelectronic device wafers and methods of manufacturing Nov. 22, 2011
8029335 Wafer processing method Oct. 4, 2011
8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer Aug. 30, 2011
7851381 Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal su Dec. 14, 2010
7758402 Wafer grinding method Jul. 20, 2010
7737038 Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches Jun. 15, 2010
7727859 Semiconductor device and manufacturing method thereof Jun. 1, 2010
7682224 Method of machining substrate Mar. 23, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7659207 Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafer Feb. 9, 2010
7625821 Process and apparatus for thinning a semiconductor workpiece Dec. 1, 2009
7625810 Wafer processing method Dec. 1, 2009
7554175 Gallium nitride substrate, and gallium-nitride-substrate testing and manufacturing methods Jun. 30, 2009
7541287 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Jun. 2, 2009
7446423 Semiconductor device and method for assembling the same Nov. 4, 2008
7366575 Wafer polishing control Apr. 29, 2008
7338882 Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same Mar. 4, 2008
7314823 Chemical mechanical polishing composition and process Jan. 1, 2008
7300876 Method for cleaning slurry particles from a surface polished by chemical mechanical polishing Nov. 27, 2007
7259097 Control system for multi-layer chemical mechanical polishing process and control method for the same Aug. 21, 2007
7186654 Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the same Mar. 6, 2007
7078312 Method for controlling etch process repeatability Jul. 18, 2006
7052996 Electrochemically polishing conductive films on semiconductor wafers May. 30, 2006
7052969 Method for semiconductor wafer planarization by isolation material growth May. 30, 2006
7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Apr. 18, 2006
7005383 Apparatus and methods of chemical mechanical polishing Feb. 28, 2006
7001845 Methods of treating surfaces of substrates Feb. 21, 2006
7003148 Detection of an end point of polishing a substrate Feb. 21, 2006
6958272 Pocket implant for complementary bit disturb improvement and charging improvement of SONOS memory cell Oct. 25, 2005
6955971 Semiconductor structure and methods for fabricating same Oct. 18, 2005
6943114 Integration scheme for metal gap fill, with fixed abrasive CMP Sep. 13, 2005
6930037 Process for forming a metal interconnect Aug. 16, 2005
6930023 Semiconductor wafer thinning method, and thin semiconductor wafer Aug. 16, 2005
6927160 Fabrication of copper-containing region such as electrical interconnect Aug. 9, 2005
6909935 Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer Jun. 21, 2005
6893977 Method of manufacturing a semiconductor device May. 17, 2005
6890866 Method for manufacturing semiconductor device May. 10, 2005

1 2 3 4

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