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Class Information
Number: 438/927
Name: Semiconductor device manufacturing: process > Electromigration resistant metallization
Description: Art collection directed to metallization constructed so as to prevent the mass transport of metal by momentum exchange between thermally activated metal ions and conduction charge carriers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8575007 Selective electromigration improvement for high current C4s Nov. 5, 2013
8518819 Semiconductor device contact structures and methods for making the same Aug. 27, 2013
8461683 Self-forming, self-aligned barriers for back-end interconnects and methods of making same Jun. 11, 2013
8461043 Barrier layer for integrated circuit contacts Jun. 11, 2013
8367541 Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same Feb. 5, 2013
8323990 Reliability test structure for multilevel interconnect Dec. 4, 2012
8288270 Enhanced electromigration resistance in TSV structure and design Oct. 16, 2012
8211740 Solid state imaging device having wirings with diffusion prevention film Jul. 3, 2012
8034709 Method for forming composite barrier layer Oct. 11, 2011
7981771 Structures and methods to enhance Cu interconnect electromigration (EM) performance Jul. 19, 2011
7902669 Semiconductor device and method for manufacturing the same Mar. 8, 2011
7772119 Dual liner capping layer interconnect structure Aug. 10, 2010
7749778 Addressable hierarchical metal wire test methodology Jul. 6, 2010
7569835 Gating grid and method of manufacture Aug. 4, 2009
7518167 Semiconductor device Apr. 14, 2009
7422977 Copper adhesion improvement device and method Sep. 9, 2008
7327031 Semiconductor device and method of manufacturing the same Feb. 5, 2008
7235882 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same Jun. 26, 2007
7224006 Semiconductor device May. 29, 2007
7214613 Cross diffusion barrier layer in polysilicon May. 8, 2007
7157795 Composite tantalum nitride/tantalum copper capping layer Jan. 2, 2007
7098054 Method and structure for determining thermal cycle reliability Aug. 29, 2006
7052993 Thin film transistor having copper alloy wire and method of manufacturing the same May. 30, 2006
6777328 Method of forming multilayered conductive layers for semiconductor device Aug. 17, 2004
6750108 Method for manufacturing a semiconductor device Jun. 15, 2004
6686661 Thin film transistor having a copper alloy wire Feb. 3, 2004
6531780 Via formation in integrated circuit interconnects Mar. 11, 2003
6498086 Use of membrane properties to reduce residual stress in an interlayer region Dec. 24, 2002
6498397 Seed layer with annealed region for integrated circuit interconnects Dec. 24, 2002
6424046 Substrate for manufacturing a semiconductor device with three element alloy Jul. 23, 2002
6410412 Methods for fabricating memory devices Jun. 25, 2002
6391754 Method of making an integrated circuit interconnect May. 21, 2002
6306732 Method and apparatus for simultaneously improving the electromigration reliability and resistance of damascene vias using a controlled diffusivity barrier Oct. 23, 2001
6268273 Fabrication method of single electron tunneling device Jul. 31, 2001
6261963 Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices Jul. 17, 2001
6204167 Method of making a multi-level interconnect having a refractory metal wire and a degassed oxidized, TiN barrier layer Mar. 20, 2001
6200894 Method for enhancing aluminum interconnect properties Mar. 13, 2001
6150041 Thick-film circuits and metallization process Nov. 21, 2000
6144097 Semiconductor device and method of fabricating the same Nov. 7, 2000
6114236 Process for production of semiconductor device having an insulating film of low dielectric constant Sep. 5, 2000
6110819 Interconnect structure using Al.sub.2 Cu for an integrated circuit chip Aug. 29, 2000
6072945 System for automated electromigration verification Jun. 6, 2000
6057238 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom May. 2, 2000
5993908 Method of producing an aluminum film Nov. 30, 1999
5981378 Reliable interconnect via structures and methods for making the same Nov. 9, 1999
5963729 Method for automated electromigration verification Oct. 5, 1999
5963831 Method of making an interconnect structure employing equivalent resistance paths to improve electromigration resistance Oct. 5, 1999
5959360 Interconnect structure employing equivalent resistance paths to improve electromigration resistance Sep. 28, 1999
5930587 Stress migration evaluation method Jul. 27, 1999
5913145 Method for fabricating thermally stable contacts with a diffusion barrier formed at high temperatures Jun. 15, 1999

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