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Class Information
Number: 438/913
Name: Semiconductor device manufacturing: process > Diverse treatments performed in unitary chamber
Description: Art collection involving diverse treatments performed upon a semiconductor substrate which are affected in a single processing chamber.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8492253 Method of forming contacts for a back-contact solar cell Jul. 23, 2013
8486844 Method and system for isolated and discretized process sequence integration Jul. 16, 2013
8207069 Advanced mixing method for integrated tool having site-isolated reactors Jun. 26, 2012
8163631 Methods for discretized processing and process sequence integration of regions of a substrate Apr. 24, 2012
8058154 Methods for discretized processing and process sequence integration of regions of a substrate Nov. 15, 2011
8008198 Large scale method and furnace system for selenization of thin film photovoltaic materials Aug. 30, 2011
7993820 Pattern manufacturing equipments, organic thin-film transistors and manufacturing methods for organic thin-film transistor Aug. 9, 2011
7947597 Methods of titanium deposition May. 24, 2011
7700480 Methods of titanium deposition Apr. 20, 2010
7682987 Device for processing substrate and method of manufacturing semiconductor device Mar. 23, 2010
7648576 Epitaxial wafer and method for producing same Jan. 19, 2010
7435445 Method for manufacturing semiconductor device Oct. 14, 2008
7122454 Method for improving nitrogen profile in plasma nitrided gate dielectric layers Oct. 17, 2006
7115508 Oxide-like seasoning for dielectric low k films Oct. 3, 2006
7049154 Vapor phase growth method by controlling the heat output in the gas introduction region May. 23, 2006
6969682 Single workpiece processing system Nov. 29, 2005
6930046 Single workpiece processing system Aug. 16, 2005
6900132 Single workpiece processing system May. 31, 2005
6887775 Process and apparatus for epitaxially coating a semiconductor wafer and epitaxially coated semiconductor wafer May. 3, 2005
6884701 Process for fabricating semiconductor device Apr. 26, 2005
6858508 SOI annealing method Feb. 22, 2005
6846742 Si seasoning to reduce particles, extend clean frequency, block mobile ions and increase chamber throughput Jan. 25, 2005
6844260 Insitu post atomic layer deposition destruction of active species Jan. 18, 2005
6828235 Semiconductor manufacturing method, substrate processing method, and semiconductor manufacturing apparatus Dec. 7, 2004
6809015 Method for heat treatment of silicon wafers and silicon wafer Oct. 26, 2004
6806194 Apparatus and methods for processing a workpiece Oct. 19, 2004
6790777 Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device Sep. 14, 2004
6774056 Sonic immersion process system and methods Aug. 10, 2004
6759336 Methods for reducing contamination of semiconductor substrates Jul. 6, 2004
6716769 Use of a plasma source to form a layer during the formation of a semiconductor device Apr. 6, 2004
6680253 Apparatus for processing a workpiece Jan. 20, 2004
6667187 Semiconductor laser and method of manufacturing the same Dec. 23, 2003
6649537 Intermittent pulsed oxidation process Nov. 18, 2003
6596631 Method of forming copper interconnect capping layers with improved interface and adhesion Jul. 22, 2003
6589868 Si seasoning to reduce particles, extend clean frequency, block mobile ions and increase chamber throughput Jul. 8, 2003
6582567 Method of growing epitaxial layers using magnetron sputter source in MBE apparatus Jun. 24, 2003
6573183 Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface Jun. 3, 2003
6548411 Apparatus and methods for processing a workpiece Apr. 15, 2003
6528427 Methods for reducing contamination of semiconductor substrates Mar. 4, 2003
6528435 Plasma processing Mar. 4, 2003
6511914 Reactor for processing a workpiece using sonic energy Jan. 28, 2003
6498095 CVD METHOD FOR PRODUCING AN INTERCONNECTION FILM BY DEPOSITING A LOWER LAYER TO FILL A RECESS PERFORMING A CLEANING STEP TO REMOVE DISSOCIATED REACTANT GAS, AND CONSEQUENTLY DEPOSITING AN UPPE Dec. 24, 2002
6492284 Reactor for processing a workpiece using sonic energy Dec. 10, 2002
6447633 Reactor for processing a semiconductor wafer Sep. 10, 2002
6440841 Method of fabricating vias Aug. 27, 2002
6429142 In-situ photoresist removal by an attachable chamber with light source Aug. 6, 2002
6429139 Serial wafer handling mechanism Aug. 6, 2002
6426303 Processing system Jul. 30, 2002
6383927 Process for fabricating semiconductor device, apparatus using more than one kind of inert gas for evacuating air and method for entering wafer into the apparatus May. 7, 2002
6380103 Rapid thermal etch and rapid thermal oxidation Apr. 30, 2002

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