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Class Information
Number: 438/902
Name: Semiconductor device manufacturing: process > Capping layer
Description: Art collection involving the use of an overlayer serving to separate and protect an underlying region or layer from the environment.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8704204 Ferroelectric nanoshell devices Apr. 22, 2014
8323995 Diodes, and methods of forming diodes Dec. 4, 2012
8231732 Cleaning method and substrate processing apparatus Jul. 31, 2012
8226835 Ultra-thin film formation using gas cluster ion beam processing Jul. 24, 2012
8202810 Low-H plasma treatment with N.sub.2 anneal for electronic memory devices Jun. 19, 2012
8039389 Semiconductor device having an organic anti-reflective coating (ARC) and method therefor Oct. 18, 2011
7994046 Method for forming a dielectric layer with an air gap, and a structure including the dielectric layer with the air gap Aug. 9, 2011
7977224 Method using multiple layer annealing cap for fabricating group III-nitride semiconductor device structures and devices formed thereby Jul. 12, 2011
7951619 Diodes, and methods of forming diodes May. 31, 2011
7811840 Diodes, and methods of forming diodes Oct. 12, 2010
7678642 Method for manufacturing phase change memory device using a patterning process Mar. 16, 2010
7601575 Integration of pre-S/D anneal selective nitride/oxide composite cap for improving transistor performance Oct. 13, 2009
7563731 Field effect transistor having a stressed dielectric layer based on an enhanced device topography Jul. 21, 2009
7211481 Method to strain NMOS devices while mitigating dopant diffusion for PMOS using a capped poly layer May. 1, 2007
7172960 Multi-layer film stack for extinction of substrate reflections during patterning Feb. 6, 2007
7141494 Method for reducing tungsten film roughness and improving step coverage Nov. 28, 2006
7091601 Method of fabricating an apparatus including a sealed cavity Aug. 15, 2006
7084060 Forming capping layer over metal wire structure using selective atomic layer deposition Aug. 1, 2006
7008885 Chemical treatment of semiconductor substrates Mar. 7, 2006
6972252 Method of improving adhesion between two dielectric films Dec. 6, 2005
6929831 Methods of forming nitride films Aug. 16, 2005
6913946 Method of making an ultimate low dielectric device Jul. 5, 2005
6884641 Site-specific methodology for localization and analyzing junction defects in mosfet devices Apr. 26, 2005
6838369 Method for forming contact hole of semiconductor device Jan. 4, 2005
6808975 Method for forming a self-aligned contact hole in a semiconductor device Oct. 26, 2004
6790778 Method for capping over a copper layer Sep. 14, 2004
6787462 Method of manufacturing semiconductor device having buried metal wiring Sep. 7, 2004
6784084 Method for fabricating semiconductor device capable of reducing seam generations Aug. 31, 2004
6784074 Defect-free semiconductor templates for epitaxial growth and method of making same Aug. 31, 2004
6774058 Chemical treatment of semiconductor substrates Aug. 10, 2004
6756321 Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Jun. 29, 2004
6689673 Method for forming a gate with metal silicide Feb. 10, 2004
6660634 Method of forming reliable capped copper interconnects Dec. 9, 2003
6653166 Semiconductor device and method of making same Nov. 25, 2003
6645829 Silicon wafer with embedded optoelectronic material for monolithic OEIC Nov. 11, 2003
6562544 Method and apparatus for improving accuracy in photolithographic processing of substrates May. 13, 2003
6455424 Selective cap layers over recessed polysilicon plugs Sep. 24, 2002
6420214 Method of forming an integrated circuit device having cyanate ester buffer coat Jul. 16, 2002
6410427 Metal silicidation methods and methods for using same Jun. 25, 2002
6368885 Method for manufacturing a micromechanical component Apr. 9, 2002
6261887 Transistors with independently formed gate structures and method Jul. 17, 2001
6255213 Method of forming a structure upon a semiconductive substrate Jul. 3, 2001
6214713 Two step cap nitride deposition for forming gate electrodes Apr. 10, 2001
6211078 Method of improving resist adhesion for use in patterning conductive layers Apr. 3, 2001
6187632 Anneal technique for reducing amount of electronic trap in gate oxide film of transistor Feb. 13, 2001
6184158 Inductively coupled plasma CVD Feb. 6, 2001
6153542 Method of manufacturing semiconductor devices Nov. 28, 2000
6114186 Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits Sep. 5, 2000
6100184 Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer Aug. 8, 2000
6093643 Electrically conductive projections and semiconductor processing method of forming same Jul. 25, 2000

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