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Class Information
Number: 438/792
Name: Semiconductor device manufacturing: process > Coating of substrate containing semiconductor region or of semiconductor substrate > Insulative material deposited upon semiconductive substrate > Silicon nitride formation > Utilizing electromagnetic or wave energy (e.g., photo-induced deposition, plasma, etc.)
Description: Processes wherein the silicon nitride is deposited using irradiation of electromagnetic or wave energy.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618548 |
Silicon-containing structure with deep etched features, and method of manufacture |
Nov. 17, 2009 |
| 7601652 |
Method for treating substrates and films with photoexcitation |
Oct. 13, 2009 |
| 7601619 |
Method and apparatus for plasma processing |
Oct. 13, 2009 |
| 7598562 |
Semiconductor device and method of manufacturing the same |
Oct. 6, 2009 |
| 7598184 |
Plasma composition for selective high-k etch |
Oct. 6, 2009 |
| 7592273 |
Semiconductor device with hydrogen barrier and method therefor |
Sep. 22, 2009 |
| 7592222 |
Method of fabricating flash memory device |
Sep. 22, 2009 |
| 7589031 |
Method of avoiding haze formation on surfaces of silicon-containing PECVD-deposited thin films |
Sep. 15, 2009 |
| 7589027 |
Method of manufacturing semiconductor device |
Sep. 15, 2009 |
| 7585704 |
Method of producing highly strained PECVD silicon nitride thin films at low temperature |
Sep. 8, 2009 |
| 7563731 |
Field effect transistor having a stressed dielectric layer based on an enhanced device topography |
Jul. 21, 2009 |
| 7550397 |
Method of manufacturing a semiconductor device having a pre-metal dielectric liner |
Jun. 23, 2009 |
| 7534732 |
Semiconductor devices with copper interconnects and composite silicon nitride capping layers |
May. 19, 2009 |
| 7528078 |
Process of forming electronic device including a densified nitride layer adjacent to an opening within a semiconductor layer |
May. 5, 2009 |
| 7521380 |
Methods for fabricating a stress enhanced semiconductor device having narrow pitch and wide pitch transistors |
Apr. 21, 2009 |
| 7517818 |
Method for forming a nitrided germanium-containing layer using plasma processing |
Apr. 14, 2009 |
| 7514377 |
Plasma generator, ozone generator, substrate processing apparatus and manufacturing method of semiconductor device |
Apr. 7, 2009 |
| 7514376 |
Manufacture of semiconductor device having nitridized insulating film |
Apr. 7, 2009 |
| 7510985 |
Method to manufacture high-precision RFID straps and RFID antennas using a laser |
Mar. 31, 2009 |
| 7501353 |
Method of formation of a damascene structure utilizing a protective film |
Mar. 10, 2009 |
| 7501355 |
Decreasing the etch rate of silicon nitride by carbon addition |
Mar. 10, 2009 |
| 7494941 |
Manufacturing method of semiconductor device, and substrate processing apparatus |
Feb. 24, 2009 |
| 7491660 |
Method of forming nitride films with high compressive stress for improved PFET device performance |
Feb. 17, 2009 |
| 7488694 |
Methods of forming silicon nitride layers using nitrogenous compositions |
Feb. 10, 2009 |
| 7482286 |
Method for forming dielectric or metallic films |
Jan. 27, 2009 |
| 7462571 |
Film formation method and apparatus for semiconductor process for forming a silicon nitride film |
Dec. 9, 2008 |
| 7462527 |
Method of forming nitride films with high compressive stress for improved PFET device performance |
Dec. 9, 2008 |
| 7435663 |
Methods for dicing a released CMOS-MEMS multi-project wafer |
Oct. 14, 2008 |
| 7427518 |
Semiconductor device fabrication method and fabrication apparatus |
Sep. 23, 2008 |
| 7390744 |
Method and composition for polishing a substrate |
Jun. 24, 2008 |
| 7380328 |
Method of forming an inductor |
Jun. 3, 2008 |
| 7381608 |
Method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode |
Jun. 3, 2008 |
| 7381660 |
Dielectric barrier layer for a copper metallization layer having a varying silicon concentration along its thickness |
Jun. 3, 2008 |
| 7374635 |
Forming method and forming system for insulation film |
May. 20, 2008 |
| 7351668 |
Film formation method and apparatus for semiconductor process |
Apr. 1, 2008 |
| 7312151 |
System for ultraviolet atmospheric seed layer remediation |
Dec. 25, 2007 |
| 7303962 |
Fabricating method of CMOS and MOS device |
Dec. 4, 2007 |
| 7300891 |
Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation |
Nov. 27, 2007 |
| 7271110 |
High density plasma and bias RF power process to make stable FSG with less free F and SiN with less H to enhance the FSG/SiN integration reliability |
Sep. 18, 2007 |
| 7265066 |
Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation |
Sep. 4, 2007 |
| 7265065 |
Method for fabricating dielectric layer doped with nitrogen |
Sep. 4, 2007 |
| 7247582 |
Deposition of tensile and compressive stressed materials |
Jul. 24, 2007 |
| 7238616 |
Photo-assisted method for semiconductor fabrication |
Jul. 3, 2007 |
| 7229896 |
STI process for eliminating silicon nitride liner induced defects |
Jun. 12, 2007 |
| 7226874 |
Substrate processing method |
Jun. 5, 2007 |
| 7220686 |
Process for contact opening definition for active element electrical connections |
May. 22, 2007 |
| 7220687 |
Method to improve water-barrier performance by changing film surface morphology |
May. 22, 2007 |
| 7217659 |
Process for producing materials for electronic device |
May. 15, 2007 |
| 7202187 |
Method of forming sidewall spacer using dual-frequency plasma enhanced CVD |
Apr. 10, 2007 |
| 7186642 |
Low temperature nitride used as Cu barrier layer |
Mar. 6, 2007 |
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