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Class Information
Number: 438/757
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Silicon nitride
Description: Processes wherein the material undergoing wet chemical etching is a compound of silicon and nitrogen.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6265304 |
Controlling an etching process of multiple layers based upon thickness ratio of the dielectric layers |
Jul. 24, 2001 |
| 6258678 |
Use of a wet etch dip step used as part of a self-aligned contact opening procedure |
Jul. 10, 2001 |
| 6258734 |
Method for patterning semiconductor devices on a silicon substrate using oxynitride film |
Jul. 10, 2001 |
| 6255123 |
Methods of monitoring and maintaining concentrations of selected species in solutions during semiconductor processing |
Jul. 3, 2001 |
| 6238590 |
Tribochemical polishing of ceramics and metals |
May. 29, 2001 |
| 6228770 |
Method to form self-sealing air gaps between metal interconnects |
May. 8, 2001 |
| 6221785 |
Method for forming shallow trench isolations |
Apr. 24, 2001 |
| 6218305 |
Composition and method for polishing a composite of silica and silicon nitride |
Apr. 17, 2001 |
| 6214713 |
Two step cap nitride deposition for forming gate electrodes |
Apr. 10, 2001 |
| 6211057 |
Method for manufacturing arch air gap in multilevel interconnection |
Apr. 3, 2001 |
| 6200909 |
Method for selective etching of antireflective coatings |
Mar. 13, 2001 |
| 6194320 |
Method for preparing a semiconductor device |
Feb. 27, 2001 |
| 6191037 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Feb. 20, 2001 |
| 6177355 |
Pad etch process capable of thick titanium nitride arc removal |
Jan. 23, 2001 |
| 6174820 |
Use of silicon oxynitride as a sacrificial material for microelectromechanical devices |
Jan. 16, 2001 |
| 6171973 |
Process for etching the gate in MOS technology using a SiON-based hard mask |
Jan. 9, 2001 |
| 6162370 |
Composition and method for selectively etching a silicon nitride film |
Dec. 19, 2000 |
| 6156618 |
Method for fabricating thin film resistor |
Dec. 5, 2000 |
| 6153531 |
Method for preventing electrochemical erosion of interconnect structures |
Nov. 28, 2000 |
| 6117351 |
Method for etching dielectric films |
Sep. 12, 2000 |
| 6103637 |
Method for selective etching of antireflective coatings |
Aug. 15, 2000 |
| 6096233 |
Method for wet etching of thin film |
Aug. 1, 2000 |
| 6090715 |
Masking process for forming self-aligned dual wells or self-aligned field-doping regions |
Jul. 18, 2000 |
| 6087273 |
Process for selectively etching silicon nitride in the presence of silicon oxide |
Jul. 11, 2000 |
| 6074949 |
Method of preventing copper dendrite formation and growth |
Jun. 13, 2000 |
| 6069082 |
Method to prevent dishing in damascene CMP process |
May. 30, 2000 |
| 6069056 |
Method of forming isolation structure |
May. 30, 2000 |
| 6066267 |
Etching of silicon nitride |
May. 23, 2000 |
| 6063708 |
Method for forming isolation layer in semiconductor device |
May. 16, 2000 |
| 6063713 |
Methods for forming silicon nitride layers on silicon-comprising substrates |
May. 16, 2000 |
| 6054394 |
Method of fabricating a dynamic random access memory capacitor |
Apr. 25, 2000 |
| 6051508 |
Manufacturing method of semiconductor device |
Apr. 18, 2000 |
| 6037269 |
Etching methods of silicon nitride films employed in microelectronic devices |
Mar. 14, 2000 |
| 6033996 |
Process for removing etching residues, etching mask and silicon nitride and/or silicon dioxide |
Mar. 7, 2000 |
| 6022751 |
Production of electronic device |
Feb. 8, 2000 |
| 5990021 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture |
Nov. 23, 1999 |
| 5981401 |
Method for selective etching of anitreflective coatings |
Nov. 9, 1999 |
| 5965465 |
Etching of silicon nitride |
Oct. 12, 1999 |
| 5942450 |
Method of fabricating semiconductor device |
Aug. 24, 1999 |
| 5933739 |
Self-aligned silicidation structure and method of formation thereof |
Aug. 3, 1999 |
| 5930611 |
Method for fabricating MIS device having GATE insulator of GaS or gallium sulfide |
Jul. 27, 1999 |
| 5918134 |
Method of reducing transistor channel length with oxidation inhibiting spacers |
Jun. 29, 1999 |
| 5891354 |
Methods of etching through wafers and substrates with a composite etch stop layer |
Apr. 6, 1999 |
| 5885903 |
Process for selectively etching silicon nitride in the presence of silicon oxide |
Mar. 23, 1999 |
| 5882978 |
Methods of forming a silicon nitride film, a capacitor dielectric layer and a capacitor |
Mar. 16, 1999 |
| 5883012 |
Method of etching a trench into a semiconductor substrate |
Mar. 16, 1999 |
| 5872055 |
Method for fabricating polysilicon conducting wires |
Feb. 16, 1999 |
| 5856003 |
Method for forming pseudo buried layer for sub-micron bipolar or BiCMOS device |
Jan. 5, 1999 |
| 5843850 |
Method of stripping a nitride layer from a wafer and wet etching apparatus using the same |
Dec. 1, 1998 |
| 5821170 |
Method for etching an insulating material |
Oct. 13, 1998 |
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