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Class Information
Number: 438/756
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Silicon oxide
Description: Processes wherein the material undergoing wet chemical etching is a compound of silicon and oxygen.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6593239 |
Chemical mechanical polishing method useful for copper substrates |
Jul. 15, 2003 |
| 6593179 |
Method of manufacturing a semiconductor device |
Jul. 15, 2003 |
| 6589882 |
Copper post-etch cleaning process |
Jul. 8, 2003 |
| 6586338 |
Methods for creating elements of predetermined shape and apparatus using these elements |
Jul. 1, 2003 |
| 6586293 |
Semiconductor device and method of manufacturing the same |
Jul. 1, 2003 |
| 6573141 |
In-situ etch and pre-clean for high quality thin oxides |
Jun. 3, 2003 |
| 6569747 |
Methods for trench isolation with reduced step height |
May. 27, 2003 |
| 6562724 |
Self-aligned stack formation |
May. 13, 2003 |
| 6559059 |
Method for fabricating a MOS transistor of an embedded memory |
May. 6, 2003 |
| 6555201 |
Method for fabricating a microelectromechanical bearing |
Apr. 29, 2003 |
| 6548421 |
Method for forming a refractory-metal-silicide layer in a semiconductor device |
Apr. 15, 2003 |
| 6544898 |
Method for improved die release of a semiconductor device from a wafer |
Apr. 8, 2003 |
| 6530380 |
Method for selective oxide etching in pre-metal deposition |
Mar. 11, 2003 |
| 6524964 |
Method for forming contact by using ArF lithography |
Feb. 25, 2003 |
| 6524880 |
Solar cell and method for fabricating the same |
Feb. 25, 2003 |
| 6521540 |
Method for making self-aligned contacts to source/drain without a hard mask layer |
Feb. 18, 2003 |
| 6517735 |
Ink feed trench etch technique for a fully integrated thermal inkjet printhead |
Feb. 11, 2003 |
| 6518142 |
Fabrication method for MIM capacitive circuit having little leakage current |
Feb. 11, 2003 |
| 6511609 |
Cu seed layer deposition for ULSI metalization |
Jan. 28, 2003 |
| 6503841 |
Oxide etch |
Jan. 7, 2003 |
| 6497827 |
Method for etching dielectric films |
Dec. 24, 2002 |
| 6498079 |
Method for selective source diffusion |
Dec. 24, 2002 |
| 6495471 |
Etching process using a buffer layer |
Dec. 17, 2002 |
| 6495472 |
Method for avoiding erosion of conductor structure during removing etching residues |
Dec. 17, 2002 |
| 6492283 |
Method of forming ultrathin oxide layer |
Dec. 10, 2002 |
| 6492273 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
Dec. 10, 2002 |
| 6489251 |
Method of forming a slope lateral structure |
Dec. 3, 2002 |
| 6486075 |
Anisotropic wet etching method |
Nov. 26, 2002 |
| 6482748 |
Poly gate silicide inspection by back end etching |
Nov. 19, 2002 |
| 6479395 |
Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
Nov. 12, 2002 |
| 6478975 |
Inductor and fabricating method thereof |
Nov. 12, 2002 |
| 6475403 |
Etching method and apparatus |
Nov. 5, 2002 |
| 6472333 |
Silicon carbide cap layers for low dielectric constant silicon oxide layers |
Oct. 29, 2002 |
| 6472332 |
Surface micromachined structure fabrication methods for a fluid ejection device |
Oct. 29, 2002 |
| 6472331 |
Method and apparatus for measuring and dispensing a wafer etchant |
Oct. 29, 2002 |
| 6472271 |
Planarization method of memory unit of flash memory |
Oct. 29, 2002 |
| 6468904 |
RPO process for selective CoSix formation |
Oct. 22, 2002 |
| 6468910 |
Slurry for chemical mechanical polishing silicon dioxide |
Oct. 22, 2002 |
| 6458705 |
Method for forming via-first dual damascene interconnect structure |
Oct. 1, 2002 |
| 6458710 |
Process for forming uniform multiple contact holes |
Oct. 1, 2002 |
| 6436834 |
Chemical-mechanical abrasive composition and method |
Aug. 20, 2002 |
| 6436807 |
Method for making an interconnect layer and a semiconductor device including the same |
Aug. 20, 2002 |
| 6436809 |
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this method |
Aug. 20, 2002 |
| 6436791 |
Method of manufacturing a very deep STI (shallow trench isolation) |
Aug. 20, 2002 |
| 6436833 |
Method for pre-STI-CMP planarization using poly-si thermal oxidation |
Aug. 20, 2002 |
| 6432836 |
Cleaning method for semiconductor substrate and cleaning solution |
Aug. 13, 2002 |
| 6429144 |
Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch |
Aug. 6, 2002 |
| 6423641 |
Method of making self-aligned bit-lines |
Jul. 23, 2002 |
| 6423618 |
Method of manufacturing trench gate structure |
Jul. 23, 2002 |
| 6423600 |
Method for forming uniform oxide thickness |
Jul. 23, 2002 |
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