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Class Information
Number: 438/754
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Electrically conductive material (e.g., metal, conductive oxide, etc.)
Description: Processes wherein the material undergoing wet chemical etching is an electrically conductive material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5175124 |
Process for fabricating a semiconductor device using re-ionized rinse water |
Dec. 29, 1992 |
| 5124269 |
Method of producing a semiconductor device using a wire mask having a specified diameter |
Jun. 23, 1992 |
| 5094978 |
Method of patterning a transparent conductor |
Mar. 10, 1992 |
| 5091342 |
Multilevel resist plated transfer layer process for fine line lithography |
Feb. 25, 1992 |
| 5041191 |
Diffusion barrier for thin film hybrid circuits |
Aug. 20, 1991 |
| 5030590 |
Process for etching polysilicon layer in formation of integrated circuit structure |
Jul. 9, 1991 |
| 5017513 |
Method for manufacturing a semiconductor device |
May. 21, 1991 |
| 4992135 |
Method of etching back of tungsten layers on semiconductor wafers, and solution therefore |
Feb. 12, 1991 |
| 4976810 |
Method of forming pattern and apparatus for implementing the same |
Dec. 11, 1990 |
| 4876223 |
Method of manufacturing semiconductor devices |
Oct. 24, 1989 |
| 4814293 |
Method of manufacturing a semiconductor device |
Mar. 21, 1989 |
| 4787958 |
Method of chemically etching TiW and/or TiWN |
Nov. 29, 1988 |
| 4704188 |
Wet chemical etching of crxsiynz |
Nov. 3, 1987 |
| 4681657 |
Preferential chemical etch for doped silicon |
Jul. 21, 1987 |
| 4668335 |
Anti-corrosion treatment for patterning of metallic layers |
May. 26, 1987 |
| 4665008 |
Method for fabricating thin-film image sensing devices |
May. 12, 1987 |
| 4663191 |
Salicide process for forming low sheet resistance doped silicon junctions |
May. 5, 1987 |
| 4641417 |
Process for making molybdenum gate and titanium silicide contacted MOS transistors in VLSI semiconductor devices |
Feb. 10, 1987 |
| 4554046 |
Method of selectively etching high impurity concentration semiconductor layer |
Nov. 19, 1985 |
| 4543171 |
Method for eliminating defects in a photodetector |
Sep. 24, 1985 |
| 4539222 |
Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed |
Sep. 3, 1985 |
| 4443295 |
Method of etching refractory metal film on semiconductor structures utilizing triethylamine and H.sub.2 O.sub.2 |
Apr. 17, 1984 |
| 4425183 |
Metal bevel process for multi-level metal semiconductor applications |
Jan. 10, 1984 |
| 4415606 |
Method of reworking upper metal in multilayer metal integrated circuits |
Nov. 15, 1983 |
| 4352724 |
Method of manufacturing a semiconductor device |
Oct. 5, 1982 |
| 4350564 |
Method of etching metallic materials including a major percentage of chromium |
Sep. 21, 1982 |
| 4348255 |
Process for the preparation of an optically transparent and electrically conductive film pattern |
Sep. 7, 1982 |
| 4345969 |
Metal etch solution and method |
Aug. 24, 1982 |
| 4239661 |
Surface-treating agent adapted for intermediate products of a semiconductor device |
Dec. 16, 1980 |
| 4230522 |
PNAF Etchant for aluminum and silicon |
Oct. 28, 1980 |
| 4200969 |
Semiconductor device with multi-layered metalizations |
May. 6, 1980 |
| 4187140 |
Method for etching silicon and a residue and oxidation resistant etchant therefor |
Feb. 5, 1980 |
| 4113551 |
Polycrystalline silicon etching with tetramethylammonium hydroxide |
Sep. 12, 1978 |
| 4067100 |
Method of making a semiconductor device |
Jan. 10, 1978 |
| 4057895 |
Method of forming sloped members of N-type polycrystalline silicon |
Nov. 15, 1977 |
| 4022930 |
Multilevel metallization for integrated circuits |
May. 10, 1977 |
| 4009299 |
Tin strip formulation for metal to glass seal diodes |
Feb. 22, 1977 |
| 3994758 |
Method of manufacturing a semiconductor device having closely spaced electrodes by perpendicular projection |
Nov. 30, 1976 |
| 3992235 |
Etching of thin layers of reactive metals |
Nov. 16, 1976 |
| 3972756 |
Method of producing MIS structure |
Aug. 3, 1976 |
| 3951710 |
Method for removing copper contaminant from semiconductor surfaces |
Apr. 20, 1976 |
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