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Class Information
Number: 438/754
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Electrically conductive material (e.g., metal, conductive oxide, etc.)
Description: Processes wherein the material undergoing wet chemical etching is an electrically conductive material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5990021 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture |
Nov. 23, 1999 |
| 5968850 |
Wiring using chromium nitride and methods of fabrication therefor, liquid crystal display panels using the same wiring and methods of fabrication therefor |
Oct. 19, 1999 |
| 5963832 |
Removal of metal cusp for improved contact fill |
Oct. 5, 1999 |
| 5955384 |
Method of fabricating semiconductor device |
Sep. 21, 1999 |
| 5942448 |
Method of making contacts on an integrated circuit |
Aug. 24, 1999 |
| 5935871 |
Process for forming a semiconductor device |
Aug. 10, 1999 |
| 5933757 |
Etch process selective to cobalt silicide for formation of integrated circuit structures |
Aug. 3, 1999 |
| 5928968 |
Semiconductor pressure transducer structures and methods for making the same |
Jul. 27, 1999 |
| 5918134 |
Method of reducing transistor channel length with oxidation inhibiting spacers |
Jun. 29, 1999 |
| 5904859 |
Flip chip metallization |
May. 18, 1999 |
| 5902126 |
Methods for forming integrated circuit capacitor electrodes including surrounding insulating sidewalls and spacers |
May. 11, 1999 |
| 5897379 |
Low temperature system and method for CVD copper removal |
Apr. 27, 1999 |
| 5896869 |
Semiconductor package having etched-back silver-copper braze |
Apr. 27, 1999 |
| 5893756 |
Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing |
Apr. 13, 1999 |
| 5888903 |
Self-aligned silicide process |
Mar. 30, 1999 |
| 5885901 |
Rinsing solution after resist stripping process and method for manufacturing semiconductor device |
Mar. 23, 1999 |
| 5885888 |
Etching material and etching process |
Mar. 23, 1999 |
| 5882425 |
Composition and method for passivation of a metallization layer of a semiconductor circuit after metallization etching |
Mar. 16, 1999 |
| 5874358 |
Via hole profile and method of fabrication |
Feb. 23, 1999 |
| 5858257 |
Method for wet etching and device used therein |
Jan. 12, 1999 |
| 5840629 |
Copper chemical mechanical polishing slurry utilizing a chromate oxidant |
Nov. 24, 1998 |
| 5827784 |
Method for improving contact openings during the manufacture of an integrated circuit |
Oct. 27, 1998 |
| 5783868 |
Extended bond pads with a plurality of perforations |
Jul. 21, 1998 |
| 5773364 |
Method for using ammonium salt slurries for chemical mechanical polishing (CMP) |
Jun. 30, 1998 |
| 5773359 |
Interconnect system and method of fabrication |
Jun. 30, 1998 |
| 5766499 |
Method of making a circuitized substrate |
Jun. 16, 1998 |
| 5759437 |
Etching of Ti-W for C4 rework |
Jun. 2, 1998 |
| 5731245 |
High aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard cap |
Mar. 24, 1998 |
| 5714407 |
Etching agent, electronic device and method of manufacturing the device |
Feb. 3, 1998 |
| 5688366 |
Etching method, method of producing a semiconductor device, and etchant therefor |
Nov. 18, 1997 |
| 5670062 |
Method for producing tapered lines |
Sep. 23, 1997 |
| 5670019 |
Removal process for tungsten etchback precipitates |
Sep. 23, 1997 |
| 5670016 |
Method for cleaning substrate prior to tungsten deposition |
Sep. 23, 1997 |
| 5654244 |
Process for producing semiconductor strain-sensitive sensor |
Aug. 5, 1997 |
| 5639344 |
Etching material and etching process |
Jun. 17, 1997 |
| 5587103 |
Composition, and method for using same, for etching metallic alloys from a substrate |
Dec. 24, 1996 |
| 5538921 |
Integrated circuit fabrication |
Jul. 23, 1996 |
| 5538921 |
Integrated circuit fabrication |
Jul. 23, 1996 |
| 5521119 |
Post treatment of tungsten etching back |
May. 28, 1996 |
| 5508229 |
Method for forming solder bumps in semiconductor devices |
Apr. 16, 1996 |
| 5464791 |
Method of fabricating a micro-trench storage capacitor |
Nov. 7, 1995 |
| 5462638 |
Selective etching of TiW for C4 fabrication |
Oct. 31, 1995 |
| 5462891 |
Process for manufacturing a semiconductor device using NH.sub.4 OH-H.sub.2 O.sub.2 based etchant for Ti based thin film |
Oct. 31, 1995 |
| 5445986 |
Method of forming a roughened surface capacitor with two etching steps |
Aug. 29, 1995 |
| 5409567 |
Method of etching copper layers |
Apr. 25, 1995 |
| 5376235 |
Method to eliminate corrosion in conductive elements |
Dec. 27, 1994 |
| 5376231 |
Substrate for recording head, recording head and method for producing same |
Dec. 27, 1994 |
| 5352331 |
Cermet etch technique for integrated circuits |
Oct. 4, 1994 |
| 5350484 |
Method for the anisotropic etching of metal films in the fabrication of interconnects |
Sep. 27, 1994 |
| 5277756 |
Post fabrication processing of semiconductor chips |
Jan. 11, 1994 |
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