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Class Information
Number: 438/754
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Electrically conductive material (e.g., metal, conductive oxide, etc.)
Description: Processes wherein the material undergoing wet chemical etching is an electrically conductive material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6177349 |
Preventing Cu dendrite formation and growth |
Jan. 23, 2001 |
| 6174819 |
Low temperature photoresist removal for rework during metal mask formation |
Jan. 16, 2001 |
| 6165911 |
Method of patterning a metal layer |
Dec. 26, 2000 |
| 6156484 |
Gray scale etching for thin flexible interposer |
Dec. 5, 2000 |
| 6153460 |
Method of fabricating semiconductor memory device |
Nov. 28, 2000 |
| 6153526 |
Method to remove residue in wolfram CMP |
Nov. 28, 2000 |
| 6153528 |
Method of fabricating a dual damascene structure |
Nov. 28, 2000 |
| 6153531 |
Method for preventing electrochemical erosion of interconnect structures |
Nov. 28, 2000 |
| 6153535 |
Method for removing a thin film for a window glass |
Nov. 28, 2000 |
| 6150279 |
Reverse current gold etch |
Nov. 21, 2000 |
| 6150269 |
Copper interconnect patterning |
Nov. 21, 2000 |
| 6147002 |
Process for removing contaminant from a surface and composition useful therefor |
Nov. 14, 2000 |
| 6143642 |
Programmable semiconductor structures and methods for making the same |
Nov. 7, 2000 |
| 6140233 |
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices thereby |
Oct. 31, 2000 |
| 6140239 |
Chemically removable Cu CMP slurry abrasive |
Oct. 31, 2000 |
| 6140243 |
Low temperature process for post-etch defluoridation of metals |
Oct. 31, 2000 |
| 6133158 |
Process for removing alkali metals from solvents used in the manufacture of semiconductor wafers |
Oct. 17, 2000 |
| 6130170 |
Process improvements for titanium-tungsten etching in the presence of electroplated C4's |
Oct. 10, 2000 |
| 6127282 |
Method for removing copper residue from surfaces of a semiconductor wafer |
Oct. 3, 2000 |
| 6123088 |
Method and cleaner composition for stripping copper containing residue layers |
Sep. 26, 2000 |
| 6117775 |
Polishing method |
Sep. 12, 2000 |
| 6117784 |
Process for integrated circuit wiring |
Sep. 12, 2000 |
| 6117790 |
Method for fabricating a capacitor for a semiconductor memory configuration |
Sep. 12, 2000 |
| 6114246 |
Method of using a polish stop film to control dishing during copper chemical mechanical polishing |
Sep. 5, 2000 |
| 6107201 |
Aluminum spiking inspection method |
Aug. 22, 2000 |
| 6096652 |
Method of chemical mechanical planarization using copper coordinating ligands |
Aug. 1, 2000 |
| 6093649 |
Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto |
Jul. 25, 2000 |
| 6090721 |
Aqueous solutions of ammonium fluoride in propylene glycol and their use in the removal of etch residues from silicon substrates |
Jul. 18, 2000 |
| 6087272 |
Method of producing thin film transistor |
Jul. 11, 2000 |
| 6083837 |
Fabrication of components by coining |
Jul. 4, 2000 |
| 6083838 |
Method of planarizing a surface on a semiconductor wafer |
Jul. 4, 2000 |
| 6083840 |
Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys |
Jul. 4, 2000 |
| 6083847 |
Method for manufacturing local interconnect |
Jul. 4, 2000 |
| 6077789 |
Method for forming a passivation layer with planarization |
Jun. 20, 2000 |
| 6074949 |
Method of preventing copper dendrite formation and growth |
Jun. 13, 2000 |
| 6074960 |
Method and composition for selectively etching against cobalt silicide |
Jun. 13, 2000 |
| 6040002 |
Etching resist composition, pattern forming method making use of the same, printed-wiring board and its production |
Mar. 21, 2000 |
| 6037271 |
Low haze wafer treatment process |
Mar. 14, 2000 |
| 6028011 |
Method of forming electric pad of semiconductor device and method of forming solder bump |
Feb. 22, 2000 |
| 6027790 |
Etching process which protects metal |
Feb. 22, 2000 |
| 6010969 |
Method of depositing films on semiconductor devices by using carboxylate complexes |
Jan. 4, 2000 |
| 6007729 |
Carrier tape and manufacturing method of said carrier tape |
Dec. 28, 1999 |
| 6008141 |
Semiconductor device and fabrication method thereof |
Dec. 28, 1999 |
| 6007695 |
Selective removal of material using self-initiated galvanic activity in electrolytic bath |
Dec. 28, 1999 |
| 5998297 |
Method of etching copper or copper-doped aluminum |
Dec. 7, 1999 |
| 5993686 |
Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
Nov. 30, 1999 |
| 5990021 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture |
Nov. 23, 1999 |
| 5990022 |
Method of evaluating a silicon wafer |
Nov. 23, 1999 |
| 5968850 |
Wiring using chromium nitride and methods of fabrication therefor, liquid crystal display panels using the same wiring and methods of fabrication therefor |
Oct. 19, 1999 |
| 5963832 |
Removal of metal cusp for improved contact fill |
Oct. 5, 1999 |
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