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Class Information
Number: 438/754
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Electrically conductive material (e.g., metal, conductive oxide, etc.)
Description: Processes wherein the material undergoing wet chemical etching is an electrically conductive material.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6790711 |
Method of making semiconductor device |
Sep. 14, 2004 |
| 6780784 |
Etchant and array substrate having copper lines etched by the etchant |
Aug. 24, 2004 |
| 6780773 |
Method of chemical mechanical polishing with high throughput and low dishing |
Aug. 24, 2004 |
| 6780751 |
Method for eliminating voiding in plated solder |
Aug. 24, 2004 |
| 6776919 |
Method and apparatus for etching ruthenium films |
Aug. 17, 2004 |
| 6759343 |
Method and composition for selectively etching against cobalt silicide |
Jul. 6, 2004 |
| 6749760 |
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead |
Jun. 15, 2004 |
| 6743720 |
Method of manufacturing a portion of a memory by selectively etching to remove metal nitride or metal oxynitride extrusions |
Jun. 1, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
| 6740600 |
Enhanced interface thermoelectric coolers with all-metals tips |
May. 25, 2004 |
| 6737360 |
Controlled potential anodic etching process for the selective removal of conductive thin films |
May. 18, 2004 |
| 6737286 |
Apparatus and method for fabricating arrays of atomic-scale contacts and gaps between electrodes and applications thereof |
May. 18, 2004 |
| 6730605 |
Redistribution of copper deposited films |
May. 4, 2004 |
| 6723657 |
Method for fabricating a gate stack in very large scale integrated semiconductor memories |
Apr. 20, 2004 |
| 6713399 |
Carbon-conductive ink resistor printed circuit board and its fabrication method |
Mar. 30, 2004 |
| 6707065 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits |
Mar. 16, 2004 |
| 6706642 |
Method for fabricating semiconductor capacitors |
Mar. 16, 2004 |
| 6699769 |
Method for fabricating capacitor using electrochemical deposition and wet etching |
Mar. 2, 2004 |
| 6693028 |
Semiconductor device having multilayer wiring structure and method for manufacturing the same |
Feb. 17, 2004 |
| 6693044 |
Semiconductor device and method of manufacturing the same |
Feb. 17, 2004 |
| 6693045 |
High density wafer production method |
Feb. 17, 2004 |
| 6664196 |
Method of cleaning electronic device and method of fabricating the same |
Dec. 16, 2003 |
| 6664195 |
Method for forming damascene metal gate |
Dec. 16, 2003 |
| 6664179 |
Semiconductor device production method and semiconductor device production apparatus |
Dec. 16, 2003 |
| 6664197 |
Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components |
Dec. 16, 2003 |
| 6656369 |
Method for fabricating a scanning probe microscope probe |
Dec. 2, 2003 |
| 6656851 |
Method for forming isolation film |
Dec. 2, 2003 |
| 6653243 |
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates |
Nov. 25, 2003 |
| 6649077 |
Method and apparatus for removing coating layers from alignment marks on a wafer |
Nov. 18, 2003 |
| 6638796 |
Method of forming a novel top-metal fuse structure |
Oct. 28, 2003 |
| 6632743 |
Post-planarization, pre-oxide removal ozone treatment |
Oct. 14, 2003 |
| 6630402 |
Integrated circuit resistant to the formation of cracks in a passivation layer |
Oct. 7, 2003 |
| 6624086 |
Effective solution and process to wet-etch metal-alloy films in semiconductor processing |
Sep. 23, 2003 |
| 6624087 |
Etchant for patterning indium tin oxide and method of fabricating liquid crystal display device using the same |
Sep. 23, 2003 |
| 6617234 |
Method of forming metal fuse and bonding pad |
Sep. 9, 2003 |
| 6610610 |
Methods for selective removal of material from wafer alignment marks |
Aug. 26, 2003 |
| 6602787 |
Method for fabricating semiconductor devices |
Aug. 5, 2003 |
| 6602795 |
System and method for analyzing a semiconductor surface |
Aug. 5, 2003 |
| 6594898 |
Method of manufacturing an ink jet printer head |
Jul. 22, 2003 |
| 6596640 |
Method of forming a raised contact for a substrate |
Jul. 22, 2003 |
| 6596547 |
Methods of preventing reduction of IrOx during PZT formation by metalorganic chemical vapor deposition or other processing |
Jul. 22, 2003 |
| 6593239 |
Chemical mechanical polishing method useful for copper substrates |
Jul. 15, 2003 |
| 6590297 |
Semiconductor chip having pads with plural junctions for different assembly methods |
Jul. 8, 2003 |
| 6589884 |
Method of forming an inset in a tungsten silicide layer in a transistor gate stack |
Jul. 8, 2003 |
| 6589858 |
Method of making metal gate stack with etch endpoint tracer layer |
Jul. 8, 2003 |
| 6585905 |
Leadless plastic chip carrier with partial etch die attach pad |
Jul. 1, 2003 |
| 6586342 |
Edge bevel removal of copper from silicon wafers |
Jul. 1, 2003 |
| 6579798 |
Processes for chemical-mechanical polishing of a semiconductor wafer |
Jun. 17, 2003 |
| 6576563 |
Method of manufacturing a semiconductor device employing a fluorine-based etch substantially free of hydrogen |
Jun. 10, 2003 |
| 6569770 |
Method for improving oxide erosion of tungsten CMP operations |
May. 27, 2003 |
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