| |
 |
|
Class Information
Number: 438/751
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate > Each etch step exposes surface of an adjacent layer
Description: Processes wherein a layer on the semiconductor substrate previously covered by a different layer is exposed by each liquid phase etching step.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6033995 |
Inverted layer epitaxial liftoff process |
Mar. 7, 2000 |
| 6022751 |
Production of electronic device |
Feb. 8, 2000 |
| 6017824 |
Passivation etching procedure, using a polysilicon stop layer, for repairing embedded DRAM cells |
Jan. 25, 2000 |
| 6004881 |
Digital wet etching of semiconductor materials |
Dec. 21, 1999 |
| 5994239 |
Manufacturing process to eliminate polystringers in high density nand-type flash memory devices |
Nov. 30, 1999 |
| 5990022 |
Method of evaluating a silicon wafer |
Nov. 23, 1999 |
| 5981372 |
Method for manufacturing a semiconductor device |
Nov. 9, 1999 |
| 5980633 |
Process for producing a semiconductor substrate |
Nov. 9, 1999 |
| 5906951 |
Strained Si/SiGe layers on insulator |
May. 25, 1999 |
| 5885888 |
Etching material and etching process |
Mar. 23, 1999 |
| 5858861 |
Reducing nitride residue by changing the nitride film surface property |
Jan. 12, 1999 |
| 5833759 |
Method for preparing vias for subsequent metallization |
Nov. 10, 1998 |
| 5827784 |
Method for improving contact openings during the manufacture of an integrated circuit |
Oct. 27, 1998 |
| 5750441 |
Mask having a tapered profile used during the formation of a semiconductor device |
May. 12, 1998 |
| 5700739 |
Method of multi-step reactive ion etch for patterning adjoining semiconductor metallization layers |
Dec. 23, 1997 |
| 5674799 |
1,5-diethenylnaphthalene compounds and bifunctional primers for anionic polymerization prepared therefrom |
Oct. 7, 1997 |
| 5654244 |
Process for producing semiconductor strain-sensitive sensor |
Aug. 5, 1997 |
| 5620611 |
Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads |
Apr. 15, 1997 |
| 5607543 |
Integrated circuit etching |
Mar. 4, 1997 |
| 5492235 |
Process for single mask C4 solder bump fabrication |
Feb. 20, 1996 |
| 5490901 |
Method for forming a contact hole in a semiconductor device |
Feb. 13, 1996 |
| 5455193 |
Method of forming a silicon-on-insulator (SOI) material having a high degree of thickness uniformity |
Oct. 3, 1995 |
| 5372675 |
Method for producing fine structure for electronic device |
Dec. 13, 1994 |
| 5344524 |
SOI substrate fabrication |
Sep. 6, 1994 |
| 5334259 |
Amorphous silicon solar cell and method of manufacture |
Aug. 2, 1994 |
| 5330932 |
Method for fabricating GaInP/GaAs structures |
Jul. 19, 1994 |
| 5316618 |
Etching method for obtaining at least one cavity in a substrate |
May. 31, 1994 |
| 5277748 |
Semiconductor device substrate and process for preparing the same |
Jan. 11, 1994 |
| 5264076 |
Integrated circuit process using a "hard mask" |
Nov. 23, 1993 |
| 5261999 |
Process for making strain-compensated bonded silicon-on-insulator material free of dislocations |
Nov. 16, 1993 |
| 5223081 |
Method for roughening a silicon or polysilicon surface for a semiconductor substrate |
Jun. 29, 1993 |
| 5185277 |
Method for the making of a transistor gate |
Feb. 9, 1993 |
| 5173447 |
Method for producing strained quantum well semiconductor laser elements |
Dec. 22, 1992 |
| 5147808 |
High energy ion implanted silicon on insulator structure |
Sep. 15, 1992 |
| 5137845 |
Method of forming metal contact pads and terminals on semiconductor chips |
Aug. 11, 1992 |
| 5081002 |
Method of localized photohemical etching of multilayered semiconductor body |
Jan. 14, 1992 |
| 4954218 |
Method for etching a pattern |
Sep. 4, 1990 |
| 4944838 |
Method of making tapered semiconductor waveguides |
Jul. 31, 1990 |
| 4588471 |
Process for etching composite chrome layers |
May. 13, 1986 |
| 4495026 |
Method for manufacturing metallized semiconductor components |
Jan. 22, 1985 |
| 4372803 |
Method for etch thinning silicon devices |
Feb. 8, 1983 |
| 4354898 |
Method of preferentially etching optically flat mirror facets in InGaAsP/InP heterostructures |
Oct. 19, 1982 |
| 4255229 |
Method of reworking PROMS |
Mar. 10, 1981 |
|
|
|
