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Class Information
Number: 438/751
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate > Each etch step exposes surface of an adjacent layer
Description: Processes wherein a layer on the semiconductor substrate previously covered by a different layer is exposed by each liquid phase etching step.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
6605863 Low k film application for interlevel dielectric and method of cleaning etched features Aug. 12, 2003
6579798 Processes for chemical-mechanical polishing of a semiconductor wafer Jun. 17, 2003
6566241 Method of forming metal contact in semiconductor device May. 20, 2003
6555477 Method for preventing Cu CMP corrosion Apr. 29, 2003
6521512 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit Feb. 18, 2003
6509278 Method of forming a semiconductor contact that includes selectively removing a Ti-containing layer from the surface Jan. 21, 2003
6498079 Method for selective source diffusion Dec. 24, 2002
6495472 Method for avoiding erosion of conductor structure during removing etching residues Dec. 17, 2002
6489250 Method for cutting group III nitride semiconductor light emitting element Dec. 3, 2002
6465358 Post etch clean sequence for making a semiconductor device Oct. 15, 2002
6458704 Light sensitive chemical-mechanical polishing method Oct. 1, 2002
6436791 Method of manufacturing a very deep STI (shallow trench isolation) Aug. 20, 2002
6436612 Method for forming a protection device with slope laterals Aug. 20, 2002
6423618 Method of manufacturing trench gate structure Jul. 23, 2002
6417108 Semiconductor substrate and method of manufacturing the same Jul. 9, 2002
6391780 Method to prevent copper CMP dishing May. 21, 2002
6387811 Method for detecting scratch of an insulating film May. 14, 2002
6372620 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Apr. 16, 2002
6329302 Removal of a top IC die from a bottom IC die of a multichip IC package with preservation of interconnect Dec. 11, 2001
6329301 Method and apparatus for selective removal of material from wafer alignment marks Dec. 11, 2001
6326540 Solar cell having a front-mounted bypass diode Dec. 4, 2001
6323136 Method of producing samples of semiconductor substrate with quantified amount of contamination Nov. 27, 2001
6319845 Method of purifying alkaline solution and method of etching semiconductor wafers Nov. 20, 2001
6316364 Polishing method and polishing solution Nov. 13, 2001
6287982 Method of removing a portion of a silicon oxide form over stacked polysilicon and silicide layers by using hydrofluorine (HF) solution Sep. 11, 2001
6279585 Etching method and method for manufacturing semiconductor device using the same Aug. 28, 2001
6277725 Method for fabricating passivation layer on metal pad Aug. 21, 2001
6254796 Selective etching of silicate Jul. 3, 2001
6211087 Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer Apr. 3, 2001
6207555 Electron beam process during dual damascene processing Mar. 27, 2001
6194326 Low temperature rinse of etching agents Feb. 27, 2001
6180536 Suspended moving channels and channel actuators for microfluidic applications and method for making Jan. 30, 2001
6177359 Method for detaching an epitaxial layer from one substrate and transferring it to another substrate Jan. 23, 2001
6171959 Method for making a semiconductor device Jan. 9, 2001
6159858 Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry Dec. 12, 2000
6156662 Fabrication process of a liquid crystal display device with improved yield Dec. 5, 2000
6140248 Process for producing a semiconductor device with a roughened semiconductor surface Oct. 31, 2000
6117699 Monolithic multiple wavelength VCSEL array Sep. 12, 2000
6110393 Epoxy bond and stop etch fabrication method Aug. 29, 2000
6103624 Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish Aug. 15, 2000
6103970 Solar cell having a front-mounted bypass diode Aug. 15, 2000
6077790 Etching process using a buffer layer Jun. 20, 2000
6060402 Process for selective recess etching of epitaxial field effect transistors with a novel etch-stop layer May. 9, 2000
6037271 Low haze wafer treatment process Mar. 14, 2000
6033995 Inverted layer epitaxial liftoff process Mar. 7, 2000
6022751 Production of electronic device Feb. 8, 2000
6017824 Passivation etching procedure, using a polysilicon stop layer, for repairing embedded DRAM cells Jan. 25, 2000
6004881 Digital wet etching of semiconductor materials Dec. 21, 1999
5994239 Manufacturing process to eliminate polystringers in high density nand-type flash memory devices Nov. 30, 1999
5990022 Method of evaluating a silicon wafer Nov. 23, 1999

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