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Class Information
Number: 438/751
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate > Each etch step exposes surface of an adjacent layer
Description: Processes wherein a layer on the semiconductor substrate previously covered by a different layer is exposed by each liquid phase etching step.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6656851 |
Method for forming isolation film |
Dec. 2, 2003 |
| 6653226 |
Method for electrochemical planarization of metal surfaces |
Nov. 25, 2003 |
| 6638796 |
Method of forming a novel top-metal fuse structure |
Oct. 28, 2003 |
| 6630398 |
Borderless contact with buffer layer |
Oct. 7, 2003 |
| 6617508 |
Solar cell having a front-mounted bypass diode |
Sep. 9, 2003 |
| 6610610 |
Methods for selective removal of material from wafer alignment marks |
Aug. 26, 2003 |
| 6605863 |
Low k film application for interlevel dielectric and method of cleaning etched features |
Aug. 12, 2003 |
| 6579798 |
Processes for chemical-mechanical polishing of a semiconductor wafer |
Jun. 17, 2003 |
| 6566241 |
Method of forming metal contact in semiconductor device |
May. 20, 2003 |
| 6555477 |
Method for preventing Cu CMP corrosion |
Apr. 29, 2003 |
| 6521512 |
Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit |
Feb. 18, 2003 |
| 6509278 |
Method of forming a semiconductor contact that includes selectively removing a Ti-containing layer from the surface |
Jan. 21, 2003 |
| 6498079 |
Method for selective source diffusion |
Dec. 24, 2002 |
| 6495472 |
Method for avoiding erosion of conductor structure during removing etching residues |
Dec. 17, 2002 |
| 6489250 |
Method for cutting group III nitride semiconductor light emitting element |
Dec. 3, 2002 |
| 6465358 |
Post etch clean sequence for making a semiconductor device |
Oct. 15, 2002 |
| 6458704 |
Light sensitive chemical-mechanical polishing method |
Oct. 1, 2002 |
| 6436791 |
Method of manufacturing a very deep STI (shallow trench isolation) |
Aug. 20, 2002 |
| 6436612 |
Method for forming a protection device with slope laterals |
Aug. 20, 2002 |
| 6423618 |
Method of manufacturing trench gate structure |
Jul. 23, 2002 |
| 6417108 |
Semiconductor substrate and method of manufacturing the same |
Jul. 9, 2002 |
| 6391780 |
Method to prevent copper CMP dishing |
May. 21, 2002 |
| 6387811 |
Method for detecting scratch of an insulating film |
May. 14, 2002 |
| 6372620 |
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device |
Apr. 16, 2002 |
| 6329301 |
Method and apparatus for selective removal of material from wafer alignment marks |
Dec. 11, 2001 |
| 6329302 |
Removal of a top IC die from a bottom IC die of a multichip IC package with preservation of interconnect |
Dec. 11, 2001 |
| 6326540 |
Solar cell having a front-mounted bypass diode |
Dec. 4, 2001 |
| 6323136 |
Method of producing samples of semiconductor substrate with quantified amount of contamination |
Nov. 27, 2001 |
| 6319845 |
Method of purifying alkaline solution and method of etching semiconductor wafers |
Nov. 20, 2001 |
| 6316364 |
Polishing method and polishing solution |
Nov. 13, 2001 |
| 6287982 |
Method of removing a portion of a silicon oxide form over stacked polysilicon and silicide layers by using hydrofluorine (HF) solution |
Sep. 11, 2001 |
| 6279585 |
Etching method and method for manufacturing semiconductor device using the same |
Aug. 28, 2001 |
| 6277725 |
Method for fabricating passivation layer on metal pad |
Aug. 21, 2001 |
| 6254796 |
Selective etching of silicate |
Jul. 3, 2001 |
| 6211087 |
Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer |
Apr. 3, 2001 |
| 6207555 |
Electron beam process during dual damascene processing |
Mar. 27, 2001 |
| 6194326 |
Low temperature rinse of etching agents |
Feb. 27, 2001 |
| 6180536 |
Suspended moving channels and channel actuators for microfluidic applications and method for making |
Jan. 30, 2001 |
| 6177359 |
Method for detaching an epitaxial layer from one substrate and transferring it to another substrate |
Jan. 23, 2001 |
| 6171959 |
Method for making a semiconductor device |
Jan. 9, 2001 |
| 6159858 |
Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry |
Dec. 12, 2000 |
| 6156662 |
Fabrication process of a liquid crystal display device with improved yield |
Dec. 5, 2000 |
| 6140248 |
Process for producing a semiconductor device with a roughened semiconductor surface |
Oct. 31, 2000 |
| 6117699 |
Monolithic multiple wavelength VCSEL array |
Sep. 12, 2000 |
| 6110393 |
Epoxy bond and stop etch fabrication method |
Aug. 29, 2000 |
| 6103624 |
Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish |
Aug. 15, 2000 |
| 6103970 |
Solar cell having a front-mounted bypass diode |
Aug. 15, 2000 |
| 6077790 |
Etching process using a buffer layer |
Jun. 20, 2000 |
| 6060402 |
Process for selective recess etching of epitaxial field effect transistors with a novel etch-stop layer |
May. 9, 2000 |
| 6037271 |
Low haze wafer treatment process |
Mar. 14, 2000 |
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