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Class Information
Number: 438/751
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate > Each etch step exposes surface of an adjacent layer
Description: Processes wherein a layer on the semiconductor substrate previously covered by a different layer is exposed by each liquid phase etching step.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7429534 |
Etching a nitride-based heterostructure |
Sep. 30, 2008 |
| 7410901 |
Submicron device fabrication |
Aug. 12, 2008 |
| 7371695 |
Use of TEOS oxides in integrated circuit fabrication processes |
May. 13, 2008 |
| 7344997 |
Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
Mar. 18, 2008 |
| 7338908 |
Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage |
Mar. 4, 2008 |
| 7319076 |
Low resistance T-shaped ridge structure |
Jan. 15, 2008 |
| 7303995 |
Method for reducing dimensions between patterns on a photoresist |
Dec. 4, 2007 |
| 7303933 |
Process of manufacturing a semiconductor device |
Dec. 4, 2007 |
| 7268065 |
Methods of manufacturing metal-silicide features |
Sep. 11, 2007 |
| 7259091 |
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer |
Aug. 21, 2007 |
| 7238620 |
System and method for providing a uniform oxide layer over a laser trimmed fuse with a differential wet etch stop technique |
Jul. 3, 2007 |
| 7189628 |
Fabrication of trenches with multiple depths on the same substrate |
Mar. 13, 2007 |
| 7172975 |
Process for the wet chemical treatment of semiconductor wafers |
Feb. 6, 2007 |
| 7119006 |
Via formation for damascene metal conductors in an integrated circuit |
Oct. 10, 2006 |
| 7087534 |
Semiconductor substrate cleaning |
Aug. 8, 2006 |
| 7071116 |
Semiconductor device and method for manufacturing same |
Jul. 4, 2006 |
| 7067389 |
Method for manufacturing semiconductor device |
Jun. 27, 2006 |
| 7030024 |
Dual-gate structure and method of fabricating integrated circuits having dual-gate structures |
Apr. 18, 2006 |
| 7001843 |
Methods of forming metal lines in semiconductor devices |
Feb. 21, 2006 |
| 6989312 |
Method for fabricating semiconductor optical device |
Jan. 24, 2006 |
| 6982208 |
Method for producing high throughput strained-Si channel MOSFETS |
Jan. 3, 2006 |
| 6979655 |
Substrate processing method and substrate processing apparatus |
Dec. 27, 2005 |
| 6924543 |
Method for making a semiconductor device having increased carrier mobility |
Aug. 2, 2005 |
| 6890865 |
Low k film application for interlevel dielectric and method of cleaning etched features |
May. 10, 2005 |
| 6887760 |
Fabrication process of a trench gate power MOS transistor with scaled channel |
May. 3, 2005 |
| 6864152 |
Fabrication of trenches with multiple depths on the same substrate |
Mar. 8, 2005 |
| 6861369 |
Method of forming silicidation blocking layer |
Mar. 1, 2005 |
| 6852641 |
Method of spiking mixed acid liquid in reactor |
Feb. 8, 2005 |
| 6852599 |
Method for fabricating MOS transistors |
Feb. 8, 2005 |
| 6831005 |
Electron beam process during damascene processing |
Dec. 14, 2004 |
| 6831014 |
Method of manufacturing a semiconductor apparatus using chemical mechanical polishing |
Dec. 14, 2004 |
| 6831015 |
Fabrication method of semiconductor device and abrasive liquid used therein |
Dec. 14, 2004 |
| 6821892 |
Intelligent wet etching tool as a function of chemical concentration, temperature and film loss |
Nov. 23, 2004 |
| 6821908 |
In-situ method for producing a hydrogen terminated hydrophobic surface on a silicon wafer |
Nov. 23, 2004 |
| 6815368 |
Semiconductor substrate cleaning |
Nov. 9, 2004 |
| 6809037 |
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SIMULTANEOUS FORMATION OF VIA-HOLE REACHING METAL WIRING AND CONCAVE GROOVE IN INTERLAYER FILM AND SEMICONDUCTOR INTEGRATED C |
Oct. 26, 2004 |
| 6809039 |
Method for forming a silicide layer |
Oct. 26, 2004 |
| 6803323 |
Method of forming a component overlying a semiconductor substrate |
Oct. 12, 2004 |
| 6782897 |
Method of protecting a passivation layer during solder bump formation |
Aug. 31, 2004 |
| 6780751 |
Method for eliminating voiding in plated solder |
Aug. 24, 2004 |
| 6762132 |
Compositions for dissolution of low-K dielectric films, and methods of use |
Jul. 13, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
| 6737334 |
Method of fabricating a shallow trench isolation structure |
May. 18, 2004 |
| 6727188 |
Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
Apr. 27, 2004 |
| 6706637 |
Dual damascene aperture formation method absent intermediate etch stop layer |
Mar. 16, 2004 |
| 6703320 |
Successful and easy method to remove polysilicon film |
Mar. 9, 2004 |
| 6693044 |
Semiconductor device and method of manufacturing the same |
Feb. 17, 2004 |
| 6693045 |
High density wafer production method |
Feb. 17, 2004 |
| 6677192 |
Method of fabricating a relaxed silicon germanium platform having planarizing for high speed CMOS electronics and high speed analog circuits |
Jan. 13, 2004 |
| 6677249 |
Method for manufacturing breakaway layers for detaching deposited layer systems |
Jan. 13, 2004 |
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