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Class Information
Number: 438/751
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate > Each etch step exposes surface of an adjacent layer
Description: Processes wherein a layer on the semiconductor substrate previously covered by a different layer is exposed by each liquid phase etching step.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618898 |
Method and apparatus for forming contact hole |
Nov. 17, 2009 |
| 7605006 |
Method of manufacturing a magnetic head |
Oct. 20, 2009 |
| 7579202 |
Method for fabricating light emitting diode element |
Aug. 25, 2009 |
| 7576011 |
Method of forming contact plug in semiconductor |
Aug. 18, 2009 |
| 7550758 |
Method for providing a nanoscale, high electron mobility transistor (HEMT) on insulator |
Jun. 23, 2009 |
| 7544520 |
Method for the application of a protective coating to a thermally stressed component |
Jun. 9, 2009 |
| 7528076 |
Method for manufacturing gate oxide layer with different thicknesses |
May. 5, 2009 |
| 7517810 |
Reduced metal design rules for power devices |
Apr. 14, 2009 |
| 7517710 |
Method of manufacturing field emission device |
Apr. 14, 2009 |
| 7465408 |
Solutions for controlled, selective etching of copper |
Dec. 16, 2008 |
| 7456113 |
Cleaning method and solution for cleaning a wafer in a single wafer process |
Nov. 25, 2008 |
| 7442652 |
Method for removing contamination and method for fabricating semiconductor device |
Oct. 28, 2008 |
| 7435683 |
Apparatus and method for selectively recessing spacers on multi-gate devices |
Oct. 14, 2008 |
| 7429534 |
Etching a nitride-based heterostructure |
Sep. 30, 2008 |
| 7410901 |
Submicron device fabrication |
Aug. 12, 2008 |
| 7371695 |
Use of TEOS oxides in integrated circuit fabrication processes |
May. 13, 2008 |
| 7344997 |
Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
Mar. 18, 2008 |
| 7338908 |
Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage |
Mar. 4, 2008 |
| 7319076 |
Low resistance T-shaped ridge structure |
Jan. 15, 2008 |
| 7303933 |
Process of manufacturing a semiconductor device |
Dec. 4, 2007 |
| 7303995 |
Method for reducing dimensions between patterns on a photoresist |
Dec. 4, 2007 |
| 7268065 |
Methods of manufacturing metal-silicide features |
Sep. 11, 2007 |
| 7259091 |
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer |
Aug. 21, 2007 |
| 7238620 |
System and method for providing a uniform oxide layer over a laser trimmed fuse with a differential wet etch stop technique |
Jul. 3, 2007 |
| 7189628 |
Fabrication of trenches with multiple depths on the same substrate |
Mar. 13, 2007 |
| 7172975 |
Process for the wet chemical treatment of semiconductor wafers |
Feb. 6, 2007 |
| 7119006 |
Via formation for damascene metal conductors in an integrated circuit |
Oct. 10, 2006 |
| 7087534 |
Semiconductor substrate cleaning |
Aug. 8, 2006 |
| 7071116 |
Semiconductor device and method for manufacturing same |
Jul. 4, 2006 |
| 7067389 |
Method for manufacturing semiconductor device |
Jun. 27, 2006 |
| 7030024 |
Dual-gate structure and method of fabricating integrated circuits having dual-gate structures |
Apr. 18, 2006 |
| 7001843 |
Methods of forming metal lines in semiconductor devices |
Feb. 21, 2006 |
| 6989312 |
Method for fabricating semiconductor optical device |
Jan. 24, 2006 |
| 6982208 |
Method for producing high throughput strained-Si channel MOSFETS |
Jan. 3, 2006 |
| 6979655 |
Substrate processing method and substrate processing apparatus |
Dec. 27, 2005 |
| 6924543 |
Method for making a semiconductor device having increased carrier mobility |
Aug. 2, 2005 |
| 6890865 |
Low k film application for interlevel dielectric and method of cleaning etched features |
May. 10, 2005 |
| 6887760 |
Fabrication process of a trench gate power MOS transistor with scaled channel |
May. 3, 2005 |
| 6864152 |
Fabrication of trenches with multiple depths on the same substrate |
Mar. 8, 2005 |
| 6861369 |
Method of forming silicidation blocking layer |
Mar. 1, 2005 |
| 6852641 |
Method of spiking mixed acid liquid in reactor |
Feb. 8, 2005 |
| 6852599 |
Method for fabricating MOS transistors |
Feb. 8, 2005 |
| 6831015 |
Fabrication method of semiconductor device and abrasive liquid used therein |
Dec. 14, 2004 |
| 6831005 |
Electron beam process during damascene processing |
Dec. 14, 2004 |
| 6831014 |
Method of manufacturing a semiconductor apparatus using chemical mechanical polishing |
Dec. 14, 2004 |
| 6821908 |
In-situ method for producing a hydrogen terminated hydrophobic surface on a silicon wafer |
Nov. 23, 2004 |
| 6821892 |
Intelligent wet etching tool as a function of chemical concentration, temperature and film loss |
Nov. 23, 2004 |
| 6815368 |
Semiconductor substrate cleaning |
Nov. 9, 2004 |
| 6809039 |
Method for forming a silicide layer |
Oct. 26, 2004 |
| 6809037 |
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SIMULTANEOUS FORMATION OF VIA-HOLE REACHING METAL WIRING AND CONCAVE GROOVE IN INTERLAYER FILM AND SEMICONDUCTOR INTEGRATED C |
Oct. 26, 2004 |
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