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Class Information
Number: 438/750
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate
Description: Processes wherein the sequential liquid phase etching steps are carried out on the same major surface of the semiconductor substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6258286 |
Making ink jet nozzle plates using bore liners |
Jul. 10, 2001 |
| 6239039 |
Semiconductor wafers processing method and semiconductor wafers produced by the same |
May. 29, 2001 |
| 6235638 |
Simplified etching technique for producing multiple undercut profiles |
May. 22, 2001 |
| 6232240 |
Method for fabricating a capacitor |
May. 15, 2001 |
| 6228771 |
Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
May. 8, 2001 |
| 6221785 |
Method for forming shallow trench isolations |
Apr. 24, 2001 |
| 6221786 |
Methods for isolating interconnects |
Apr. 24, 2001 |
| 6194326 |
Low temperature rinse of etching agents |
Feb. 27, 2001 |
| 6192899 |
Etch residue clean with aqueous HF/organic solution |
Feb. 27, 2001 |
| 6180536 |
Suspended moving channels and channel actuators for microfluidic applications and method for making |
Jan. 30, 2001 |
| 6162739 |
Process for wet etching of semiconductor wafers |
Dec. 19, 2000 |
| 6153531 |
Method for preventing electrochemical erosion of interconnect structures |
Nov. 28, 2000 |
| 6127280 |
Photoelectrochemical capacitance-voltage measurements of wide bandgap semiconductors |
Oct. 3, 2000 |
| 6107202 |
Passivation photoresist stripping method to eliminate photoresist extrusion after alloy |
Aug. 22, 2000 |
| 6103636 |
Method and apparatus for selective removal of material from wafer alignment marks |
Aug. 15, 2000 |
| 6087271 |
Methods for removal of an anti-reflective coating following a resist protect etching process |
Jul. 11, 2000 |
| 6083838 |
Method of planarizing a surface on a semiconductor wafer |
Jul. 4, 2000 |
| 6068000 |
Substrate treatment method |
May. 30, 2000 |
| 6044851 |
Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication |
Apr. 4, 2000 |
| 6033995 |
Inverted layer epitaxial liftoff process |
Mar. 7, 2000 |
| 6025270 |
Planarization process using tailored etchback and CMP |
Feb. 15, 2000 |
| 6015757 |
Method of oxide etching with high selectivity to silicon nitride by using polysilicon layer |
Jan. 18, 2000 |
| 6012469 |
Etch residue clean |
Jan. 11, 2000 |
| 6008068 |
Process for etching a semiconductor lead frame |
Dec. 28, 1999 |
| 6004881 |
Digital wet etching of semiconductor materials |
Dec. 21, 1999 |
| 5990022 |
Method of evaluating a silicon wafer |
Nov. 23, 1999 |
| 5981402 |
Method of fabricating shallow trench isolation |
Nov. 9, 1999 |
| 5972123 |
Methods for treating semiconductor wafers |
Oct. 26, 1999 |
| 5904154 |
Method for removing fluorinated photoresist layers from semiconductor substrates |
May. 18, 1999 |
| 5897379 |
Low temperature system and method for CVD copper removal |
Apr. 27, 1999 |
| 5882425 |
Composition and method for passivation of a metallization layer of a semiconductor circuit after metallization etching |
Mar. 16, 1999 |
| 5858861 |
Reducing nitride residue by changing the nitride film surface property |
Jan. 12, 1999 |
| 5858257 |
Method for wet etching and device used therein |
Jan. 12, 1999 |
| 5853604 |
Method of planarizing an insulating layer in a semiconductor device |
Dec. 29, 1998 |
| 5840205 |
Method of fabricating specimen for analyzing defects of semiconductor device |
Nov. 24, 1998 |
| 5827784 |
Method for improving contact openings during the manufacture of an integrated circuit |
Oct. 27, 1998 |
| 5811345 |
Planarization of shallow- trench- isolation without chemical mechanical polishing |
Sep. 22, 1998 |
| 5695661 |
Silicon dioxide etch process which protects metal |
Dec. 9, 1997 |
| 5665612 |
Method for fabricating a planar buried heterostructure laser diode |
Sep. 9, 1997 |
| 5630905 |
Method of fabricating quantum bridges by selective etching of superlattice structures |
May. 20, 1997 |
| 5593538 |
Method for etching a dielectric layer on a semiconductor |
Jan. 14, 1997 |
| 5571376 |
Quantum device and method of making such a device |
Nov. 5, 1996 |
| 5556797 |
Method of fabricating a self-aligned double recess gate profile |
Sep. 17, 1996 |
| 5547896 |
Direct etch for thin film resistor using a hard mask |
Aug. 20, 1996 |
| 5525192 |
Method for forming a submicron resist pattern |
Jun. 11, 1996 |
| 5498578 |
Method for selectively forming semiconductor regions |
Mar. 12, 1996 |
| 5486266 |
Method for improving the adhesion of a deposited metal layer |
Jan. 23, 1996 |
| 5478438 |
Method of etching semiconductor substrate |
Dec. 26, 1995 |
| 5454915 |
Method of fabricating porous silicon carbide (SiC) |
Oct. 3, 1995 |
| 5454901 |
Process for treating semiconductor substrates |
Oct. 3, 1995 |
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