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Class Information
Number: 438/750
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate
Description: Processes wherein the sequential liquid phase etching steps are carried out on the same major surface of the semiconductor substrate.

Sub-classes under this class:

Class Number Class Name Patents
438/751 Each etch step exposes surface of an adjacent layer 187

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7119026 Basic material for patterning and patterning method Oct. 10, 2006
7104267 Planarized copper cleaning for reduced defects Sep. 12, 2006
7091132 Ultrasonic assisted etch using corrosive liquids Aug. 15, 2006
7064069 Substrate thinning including planarization Jun. 20, 2006
7060630 Method of forming isolation film of semiconductor device Jun. 13, 2006
7052617 Simplified etching technique for producing multiple undercut profiles May. 30, 2006
7037849 Process for patterning high-k dielectric material May. 2, 2006
7037853 Wafer cleaning apparatus May. 2, 2006
7030034 Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum Apr. 18, 2006
7026254 Manufacture of masks and electronic parts Apr. 11, 2006
7026255 Method and device for photo-electrochemically etching a semiconductor sample, especially gallium nitride Apr. 11, 2006
7022610 Wet cleaning method to eliminate copper corrosion Apr. 4, 2006
7018936 Ion implant lithography method of processing a semiconductor substrate Mar. 28, 2006
7018939 Micellar technology for post-etch residues Mar. 28, 2006
7001784 Method to control spacer width Feb. 21, 2006
6995095 Methods of simultaneously fabricating isolation structures having varying dimensions Feb. 7, 2006
6989334 Manufacturing method of a semiconductor device Jan. 24, 2006
6984535 Selective etching of a protective layer to form a catalyst layer for an electron-emitting device Jan. 10, 2006
6979655 Substrate processing method and substrate processing apparatus Dec. 27, 2005
6979653 Semiconductor fabrication methods and apparatus Dec. 27, 2005
6974756 Methods of forming shallow trench isolation Dec. 13, 2005
6969684 Method of making a planarized semiconductor structure Nov. 29, 2005
6955994 Method of manufacturing semiconductor device and method of manufacturing optical wave guide Oct. 18, 2005
6903022 Method of forming contact hole Jun. 7, 2005
6875705 Method of high selectivity wet etching of salicides Apr. 5, 2005
6867148 Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions Mar. 15, 2005
6864152 Fabrication of trenches with multiple depths on the same substrate Mar. 8, 2005
6864177 Method for manufacturing metal line contact plug of semiconductor device Mar. 8, 2005
6861369 Method of forming silicidation blocking layer Mar. 1, 2005
6853076 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Feb. 8, 2005
6852643 Method for using ammonium fluoride solution in a photoelectrochemical etching process of a silicon wafer Feb. 8, 2005
6852641 Method of spiking mixed acid liquid in reactor Feb. 8, 2005
6849924 Wide band cross point switch using MEMS technology Feb. 1, 2005
6841452 Method of forming device isolation trench Jan. 11, 2005
6828228 Methods for fabricating residue-free contact openings Dec. 7, 2004
6825127 Micro-fluidic devices Nov. 30, 2004
6825128 Method for manufacturing semiconductor device Nov. 30, 2004
6821892 Intelligent wet etching tool as a function of chemical concentration, temperature and film loss Nov. 23, 2004
6821908 In-situ method for producing a hydrogen terminated hydrophobic surface on a silicon wafer Nov. 23, 2004
6812156 Method to reduce residual particulate contamination in CVD and PVD semiconductor wafer manufacturing Nov. 2, 2004
6809039 Method for forming a silicide layer Oct. 26, 2004
6803323 Method of forming a component overlying a semiconductor substrate Oct. 12, 2004
6802322 Method of fabricating a stringerless flash memory Oct. 12, 2004
6797632 Bonded wafer producing method and bonded wafer Sep. 28, 2004
6790785 Metal-assisted chemical etch porous silicon formation method Sep. 14, 2004
6783694 Composition for selectively etching against cobalt silicide Aug. 31, 2004
6783695 Acid blend for removing etch residue Aug. 31, 2004
6762134 Metal-assisted chemical etch to produce porous group III-V materials Jul. 13, 2004
6756317 Method for making a microstructure by surface micromachining Jun. 29, 2004
6750153 Process for producing macroscopic cavities beneath the surface of a silicon wafer Jun. 15, 2004

1 2 3 4 5 6 7

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