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Class Information
Number: 438/750
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant > To same side of substrate
Description: Processes wherein the sequential liquid phase etching steps are carried out on the same major surface of the semiconductor substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6602795 |
System and method for analyzing a semiconductor surface |
Aug. 5, 2003 |
| 6596640 |
Method of forming a raised contact for a substrate |
Jul. 22, 2003 |
| 6589882 |
Copper post-etch cleaning process |
Jul. 8, 2003 |
| 6586145 |
Method of fabricating semiconductor device and semiconductor device |
Jul. 1, 2003 |
| 6579810 |
Method of removing a photoresist layer on a semiconductor wafer |
Jun. 17, 2003 |
| 6576547 |
Residue-free contact openings and methods for fabricating same |
Jun. 10, 2003 |
| 6566258 |
Bi-layer etch stop for inter-level via |
May. 20, 2003 |
| 6566274 |
Lithography process for transparent substrates |
May. 20, 2003 |
| 6562726 |
Acid blend for removing etch residue |
May. 13, 2003 |
| 6554002 |
Method for removing etching residues |
Apr. 29, 2003 |
| 6551945 |
Process for manufacturing a semiconductor device |
Apr. 22, 2003 |
| 6530380 |
Method for selective oxide etching in pre-metal deposition |
Mar. 11, 2003 |
| 6528425 |
Method and apparatus for processing substrate surface with striped ridge patterns |
Mar. 4, 2003 |
| 6518197 |
Method for manufacturing semiconductor device |
Feb. 11, 2003 |
| 6489251 |
Method of forming a slope lateral structure |
Dec. 3, 2002 |
| 6489250 |
Method for cutting group III nitride semiconductor light emitting element |
Dec. 3, 2002 |
| 6486074 |
Methods of masking and etching a semiconductor substrate, and ion implant lithography methods of processing a semiconductor substrate |
Nov. 26, 2002 |
| 6465358 |
Post etch clean sequence for making a semiconductor device |
Oct. 15, 2002 |
| 6458494 |
Etching method |
Oct. 1, 2002 |
| 6455428 |
Method of forming a metal silicide layer |
Sep. 24, 2002 |
| 6453915 |
Post polycide gate etching cleaning method |
Sep. 24, 2002 |
| 6446641 |
Method of manufacturing semiconductor device, and semiconductor device manufactured thereby |
Sep. 10, 2002 |
| 6432826 |
Planarized Cu cleaning for reduced defects |
Aug. 13, 2002 |
| 6429144 |
Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch |
Aug. 6, 2002 |
| 6429134 |
Method of manufacturing semiconductor device |
Aug. 6, 2002 |
| 6428718 |
Selective back side wet etch |
Aug. 6, 2002 |
| 6420275 |
System and method for analyzing a semiconductor surface |
Jul. 16, 2002 |
| 6403496 |
Method for forming shallow trench isolations |
Jun. 11, 2002 |
| 6403439 |
Method of preparing for structural analysis a deep trench-type capacitor and method of structural analysis therefor |
Jun. 11, 2002 |
| 6399517 |
Etching method and etching apparatus |
Jun. 4, 2002 |
| 6395651 |
Simplified process for producing nanoporous silica |
May. 28, 2002 |
| 6391793 |
Compositions for etching silicon with high selectivity to oxides and methods of using same |
May. 21, 2002 |
| 6387289 |
Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
May. 14, 2002 |
| 6380097 |
Method for obtaining a sulfur-passivated semiconductor surface |
Apr. 30, 2002 |
| 6350696 |
Spacer etch method for semiconductor device |
Feb. 26, 2002 |
| 6337287 |
High speed, high bandwidth, high density nonvolatile memory system |
Jan. 8, 2002 |
| 6335292 |
Method of controlling striations and CD loss in contact oxide etch |
Jan. 1, 2002 |
| 6331478 |
Methods for manufacturing semiconductor devices having chamfered metal silicide layers |
Dec. 18, 2001 |
| 6329302 |
Removal of a top IC die from a bottom IC die of a multichip IC package with preservation of interconnect |
Dec. 11, 2001 |
| 6329301 |
Method and apparatus for selective removal of material from wafer alignment marks |
Dec. 11, 2001 |
| 6326314 |
Integrated inductor with filled etch |
Dec. 4, 2001 |
| 6323136 |
Method of producing samples of semiconductor substrate with quantified amount of contamination |
Nov. 27, 2001 |
| 6319845 |
Method of purifying alkaline solution and method of etching semiconductor wafers |
Nov. 20, 2001 |
| 6313043 |
Manufacture of field emission element |
Nov. 6, 2001 |
| 6303514 |
Composition and method for selectively etching a silicon nitride film |
Oct. 16, 2001 |
| 6284670 |
Method of etching silicon wafer and silicon wafer |
Sep. 4, 2001 |
| 6284671 |
Selective electrochemical process for creating semiconductor nano-and micro-patterns |
Sep. 4, 2001 |
| 6274504 |
Minimizing metal corrosion during post metal solvent clean |
Aug. 14, 2001 |
| 6270929 |
Damascene T-gate using a relacs flow |
Aug. 7, 2001 |
| 6261974 |
Growth method of a polymer film |
Jul. 17, 2001 |
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