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Class Information
Number: 438/749
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Sequential application of etchant
Description: Processes wherein plural liquid phase etching steps are carried out on the semiconductor substrate in succession to one another.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6746965 |
Manufacturing method of semiconductor device |
Jun. 8, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
| 6737359 |
Method of forming a shallow trench isolation using a sion anti-reflective coating which eliminates water spot defects |
May. 18, 2004 |
| 6737334 |
Method of fabricating a shallow trench isolation structure |
May. 18, 2004 |
| 6727188 |
Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
Apr. 27, 2004 |
| 6723644 |
Method of fabricating a semiconductor device using two chemical mechanical polishing processes to polish regions having different conductive pattern densities |
Apr. 20, 2004 |
| 6713341 |
Method of forming a bottle-shaped trench in a semiconductor substrate |
Mar. 30, 2004 |
| 6706642 |
Method for fabricating semiconductor capacitors |
Mar. 16, 2004 |
| 6699773 |
Shallow trench isolation type semiconductor device and method of forming the same |
Mar. 2, 2004 |
| 6699795 |
Gate etch process |
Mar. 2, 2004 |
| 6686297 |
Method of manufacturing a semiconductor device and apparatus to be used therefore |
Feb. 3, 2004 |
| 6656852 |
Method for the selective removal of high-k dielectrics |
Dec. 2, 2003 |
| 6653178 |
Thin film transistor and method for manufacturing the same |
Nov. 25, 2003 |
| 6645875 |
Method of processing metal and method of manufacturing semiconductor device using the metal |
Nov. 11, 2003 |
| 6624078 |
Methods for analyzing the effectiveness of wafer backside cleaning |
Sep. 23, 2003 |
| 6617258 |
Method of forming a gate insulation layer for a semiconductor device by controlling the duration of an etch process, and system for accomplishing same |
Sep. 9, 2003 |
| 6593239 |
Chemical mechanical polishing method useful for copper substrates |
Jul. 15, 2003 |
| 6579798 |
Processes for chemical-mechanical polishing of a semiconductor wafer |
Jun. 17, 2003 |
| 6579810 |
Method of removing a photoresist layer on a semiconductor wafer |
Jun. 17, 2003 |
| 6576547 |
Residue-free contact openings and methods for fabricating same |
Jun. 10, 2003 |
| 6562728 |
Surface treatment method of germanium-containing semiconductor substrate that includes immersion of the substrate in chemical solutions to remove foreign matter |
May. 13, 2003 |
| 6559067 |
Method for patterning an organic antireflection layer |
May. 6, 2003 |
| 6559064 |
Method and apparatus for removing photoresist on semiconductor wafer |
May. 6, 2003 |
| 6555477 |
Method for preventing Cu CMP corrosion |
Apr. 29, 2003 |
| 6541390 |
Method and composition for selectively etching against cobalt silicide |
Apr. 1, 2003 |
| 6531405 |
Process for producing a light-emitting and/or a light-receiving semiconductor body |
Mar. 11, 2003 |
| 6528395 |
Method of fabricating compound semiconductor device and apparatus for fabricating compound semiconductor device |
Mar. 4, 2003 |
| 6518197 |
Method for manufacturing semiconductor device |
Feb. 11, 2003 |
| 6509275 |
Method of manufacturing thin film and pretreating method thereof |
Jan. 21, 2003 |
| 6495472 |
Method for avoiding erosion of conductor structure during removing etching residues |
Dec. 17, 2002 |
| 6479400 |
Manufacturing method of system-on-chip and manufacturing method of semiconductor device |
Nov. 12, 2002 |
| 6458712 |
Method for regenerating semiconductor wafers |
Oct. 1, 2002 |
| 6451707 |
Method of removing reaction product due to plasma ashing of a resist pattern |
Sep. 17, 2002 |
| 6432837 |
Semiconductor wafer processing method and semiconductor wafers produced by the same |
Aug. 13, 2002 |
| 6410416 |
Article comprising a high-resolution pattern on a non-planar surface and method of making the same |
Jun. 25, 2002 |
| 6399503 |
Method of preventing dishing phenomenon atop a dual damascene structure |
Jun. 4, 2002 |
| 6399517 |
Etching method and etching apparatus |
Jun. 4, 2002 |
| 6391793 |
Compositions for etching silicon with high selectivity to oxides and methods of using same |
May. 21, 2002 |
| 6383946 |
Method of increasing selectivity in silicon nitride deposition |
May. 7, 2002 |
| 6361929 |
Method of removing a photo-resist layer on a semiconductor wafer |
Mar. 26, 2002 |
| 6354309 |
Process for treating a semiconductor substrate |
Mar. 12, 2002 |
| 6346485 |
Semiconductor wafer processing method and semiconductor wafers produced by the same |
Feb. 12, 2002 |
| 6344417 |
Method for micro-mechanical structures |
Feb. 5, 2002 |
| 6337272 |
Method of manufacturing a semiconductor device |
Jan. 8, 2002 |
| 6335294 |
Wet cleans for cobalt disilicide processing |
Jan. 1, 2002 |
| 6335285 |
Method for manufacturing a globally planarized semiconductor device |
Jan. 1, 2002 |
| 6335292 |
Method of controlling striations and CD loss in contact oxide etch |
Jan. 1, 2002 |
| 6329301 |
Method and apparatus for selective removal of material from wafer alignment marks |
Dec. 11, 2001 |
| 6329302 |
Removal of a top IC die from a bottom IC die of a multichip IC package with preservation of interconnect |
Dec. 11, 2001 |
| 6326313 |
Method and apparatus for partial drain during a nitride strip process step |
Dec. 4, 2001 |
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