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Class Information
Number: 438/748
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > Projection of etchant against a moving substrate or controlling the angle or pattern of projected etchant
Description: Processes wherein the chemical etchant is sprayed upon the moving semiconductor substrate or sprayed upon the semiconductor substrate in a specific angle or pattern.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6579382 |
Chemical liquid processing apparatus for processing a substrate and the method thereof |
Jun. 17, 2003 |
| 6579810 |
Method of removing a photoresist layer on a semiconductor wafer |
Jun. 17, 2003 |
| 6559072 |
Develop processing method of a resist surface of a substrate for reduced processing time and reduced defect density |
May. 6, 2003 |
| 6551945 |
Process for manufacturing a semiconductor device |
Apr. 22, 2003 |
| 6528425 |
Method and apparatus for processing substrate surface with striped ridge patterns |
Mar. 4, 2003 |
| 6494219 |
Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits |
Dec. 17, 2002 |
| 6444589 |
Method and apparatus for etching silicon |
Sep. 3, 2002 |
| 6436809 |
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices made using this method |
Aug. 20, 2002 |
| 6413436 |
Selective treatment of the surface of a microelectronic workpiece |
Jul. 2, 2002 |
| 6410442 |
Mask-less differential etching and planarization of copper films |
Jun. 25, 2002 |
| 6376390 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer |
Apr. 23, 2002 |
| 6376155 |
Patterning method in semiconductor device fabricating process |
Apr. 23, 2002 |
| 6365526 |
Optical illumination system and projection apparatus |
Apr. 2, 2002 |
| 6340628 |
Method to deposit SiOCH films with dielectric constant below 3.0 |
Jan. 22, 2002 |
| 6337027 |
Microelectromechanical device manufacturing process |
Jan. 8, 2002 |
| 6333275 |
Etchant mixing system for edge bevel removal of copper from silicon wafers |
Dec. 25, 2001 |
| 6323134 |
Plasma processing methods and apparatus |
Nov. 27, 2001 |
| 6319861 |
Method of improving deposition |
Nov. 20, 2001 |
| 6309981 |
Edge bevel removal of copper from silicon wafers |
Oct. 30, 2001 |
| 6290865 |
Spin-rinse-drying process for electroplated semiconductor wafers |
Sep. 18, 2001 |
| 6274505 |
Etching method, etching apparatus and analyzing method |
Aug. 14, 2001 |
| 6274506 |
Apparatus and method for dispensing processing fluid toward a substrate surface |
Aug. 14, 2001 |
| 6265323 |
Substrate processing method and apparatus |
Jul. 24, 2001 |
| 6245678 |
Method for manufacturing semiconductor wafers |
Jun. 12, 2001 |
| 6240933 |
Methods for cleaning semiconductor surfaces |
Jun. 5, 2001 |
| 6235641 |
Method and system to control the concentration of dissolved gas in a liquid |
May. 22, 2001 |
| 6232228 |
Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the method |
May. 15, 2001 |
| 6225235 |
Method and device for cleaning and etching individual wafers using wet chemistry |
May. 1, 2001 |
| 6162739 |
Process for wet etching of semiconductor wafers |
Dec. 19, 2000 |
| 6156126 |
Method for reducing or avoiding the formation of a silicon recess in SDE junction regions |
Dec. 5, 2000 |
| 6153532 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer |
Nov. 28, 2000 |
| 6146924 |
Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process |
Nov. 14, 2000 |
| 6140233 |
Method of manufacturing semiconductor devices, etching compositions for manufacturing semiconductor devices, and semiconductor devices thereby |
Oct. 31, 2000 |
| 6136724 |
Multiple stage wet processing chamber |
Oct. 24, 2000 |
| 6099662 |
Process for cleaning a semiconductor substrate after chemical-mechanical polishing |
Aug. 8, 2000 |
| 6096233 |
Method for wet etching of thin film |
Aug. 1, 2000 |
| 6090720 |
Wet etching method for silicon semiconductor wafer |
Jul. 18, 2000 |
| 6090721 |
Aqueous solutions of ammonium fluoride in propylene glycol and their use in the removal of etch residues from silicon substrates |
Jul. 18, 2000 |
| 6063712 |
Oxide etch and method of etching |
May. 16, 2000 |
| 6033988 |
Film forming methods |
Mar. 7, 2000 |
| 6028010 |
Style gas ring with a guard extension |
Feb. 22, 2000 |
| 6010964 |
Wafer surface treatment methods and systems using electrocapillarity |
Jan. 4, 2000 |
| 5932493 |
Method to minimize watermarks on silicon substrates |
Aug. 3, 1999 |
| 5925259 |
Lithographic surface or thin layer modification |
Jul. 20, 1999 |
| 5914281 |
Apparatus for etching wafer |
Jun. 22, 1999 |
| 5897379 |
Low temperature system and method for CVD copper removal |
Apr. 27, 1999 |
| 5893983 |
Technique for removing defects from a layer of metal |
Apr. 13, 1999 |
| 5883012 |
Method of etching a trench into a semiconductor substrate |
Mar. 16, 1999 |
| 5879577 |
Process for wafer peripheral edge defect reduction |
Mar. 9, 1999 |
| 5874366 |
Method for etching a semiconductor substrate and etching system |
Feb. 23, 1999 |
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