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Class Information
Number: 438/747
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > With relative movement between substrate and confined pool of etchant
Description: Processes including the step of causing a relative motion between the semiconductor substrate being etched and the liquid phase etchant which is confined by a container.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
5645675 Selective planarization apparatus Jul. 8, 1997
5593538 Method for etching a dielectric layer on a semiconductor Jan. 14, 1997
5516399 Contactless real-time in-situ monitoring of a chemical etching May. 14, 1996
5500081 Dynamic semiconductor wafer processing using homogeneous chemical vapors Mar. 19, 1996
5489361 Measuring film etching uniformity during a chemical etching process Feb. 6, 1996
5474644 Method and apparatus for high-flatness etching of wafer Dec. 12, 1995
5468338 Methods for selectively wet etching substrates Nov. 21, 1995
5445706 Wet treatment adapted for mirror etching ZnSe Aug. 29, 1995
5437733 Method and apparatus for treating a substrate Aug. 1, 1995
5374325 Liquid agitation and purification system Dec. 20, 1994
5340437 Process and apparatus for etching semiconductor wafers Aug. 23, 1994
5282923 Liquid agitation and purification system Feb. 1, 1994
4943540 Method for selectively wet etching aluminum gallium arsenide Jul. 24, 1990
4840701 Etching apparatus and method Jun. 20, 1989
4734151 Non-contact polishing of semiconductor materials Mar. 29, 1988
4417945 Apparatus for chemical etching of a wafer material Nov. 29, 1983
4339297 Apparatus for etching of oxide film on semiconductor wafer Jul. 13, 1982
4323422 Method for preparing optically flat damage-free surfaces Apr. 6, 1982
4251317 Method of preventing etch masking during wafer etching Feb. 17, 1981
4021278 Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers May. 3, 1977
3977926 Methods for treating articles Aug. 31, 1976
3953265 Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers Apr. 27, 1976
3951728 Method of treating semiconductor wafers Apr. 20, 1976
3930914 THINNING SEMICONDUCTIVE SUBSTRATES Jan. 6, 1976

1 2 3 4










 
 
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