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Class Information
Number: 438/747
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > With relative movement between substrate and confined pool of etchant
Description: Processes including the step of causing a relative motion between the semiconductor substrate being etched and the liquid phase etchant which is confined by a container.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
6333275 Etchant mixing system for edge bevel removal of copper from silicon wafers Dec. 25, 2001
6319846 Method for removing solder bodies from a semiconductor wafer Nov. 20, 2001
6313043 Manufacture of field emission element Nov. 6, 2001
6303514 Composition and method for selectively etching a silicon nitride film Oct. 16, 2001
6300156 Process for fabricating micromechanical devices Oct. 9, 2001
6294478 Fabrication process for a semiconductor substrate Sep. 25, 2001
6281130 Method for developing ultra-thin resist films Aug. 28, 2001
6265323 Substrate processing method and apparatus Jul. 24, 2001
6238590 Tribochemical polishing of ceramics and metals May. 29, 2001
6224713 Method and apparatus for ultrasonic wet etching of silicon May. 1, 2001
6221785 Method for forming shallow trench isolations Apr. 24, 2001
6211087 Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer Apr. 3, 2001
6171975 Wet-chemical treatment method, treatment method of semiconductor substrate, and manufacturing method of semiconductor device Jan. 9, 2001
6169038 Method for rough-etching a semiconductor surface Jan. 2, 2001
6162739 Process for wet etching of semiconductor wafers Dec. 19, 2000
6146924 Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process Nov. 14, 2000
6127281 Porous region removing method and semiconductor substrate manufacturing method Oct. 3, 2000
6127280 Photoelectrochemical capacitance-voltage measurements of wide bandgap semiconductors Oct. 3, 2000
6124207 Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries Sep. 26, 2000
6121147 Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance Sep. 19, 2000
6093658 Method for making reliable interconnect structures Jul. 25, 2000
6090720 Wet etching method for silicon semiconductor wafer Jul. 18, 2000
6083838 Method of planarizing a surface on a semiconductor wafer Jul. 4, 2000
6074950 Alignment strategy for asymmetrical alignment marks Jun. 13, 2000
6066571 Method of preparing semiconductor surface May. 23, 2000
6040110 Process and apparatus for the removal of resist Mar. 21, 2000
6033987 Method for mapping and adjusting pressure distribution of CMP processes Mar. 7, 2000
6010964 Wafer surface treatment methods and systems using electrocapillarity Jan. 4, 2000
6008119 Chemical-mechanical polishing of semiconductor wafers Dec. 28, 1999
5968849 Method for pre-shaping a semiconductor substrate for polishing and structure Oct. 19, 1999
5952243 Removal rate behavior of spin-on dielectrics with chemical mechanical polish Sep. 14, 1999
5945347 Apparatus and method for polishing a semiconductor wafer in an overhanging position Aug. 31, 1999
5942450 Method of fabricating semiconductor device Aug. 24, 1999
5942449 Method for removing an upper layer of material from a semiconductor wafer Aug. 24, 1999
5914281 Apparatus for etching wafer Jun. 22, 1999
5911889 Method of removing damaged crystal regions from silicon wafers Jun. 15, 1999
5904572 Wet etching station and a wet etching method adapted for utilizing the same May. 18, 1999
5899743 Method for fabricating semiconductor wafers May. 4, 1999
5883011 Method of removing an inorganic antireflective coating from a semiconductor substrate Mar. 16, 1999
5874365 Semiconductor wafer etching method Feb. 23, 1999
5866480 Method and apparatus for polishing semiconductor substrate Feb. 2, 1999
5855811 Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication Jan. 5, 1999
5851924 Method for fabricating semiconductor wafers Dec. 22, 1998
5849636 Method for fabricating a semiconductor wafer Dec. 15, 1998
5846374 Gas agitated liquid etcher Dec. 8, 1998
5840199 Method for purging a multi-layer sacrificial etched silicon substrate Nov. 24, 1998
5783497 Forced-flow wafer polisher Jul. 21, 1998
5736427 Polishing pad contour indicator for mechanical or chemical-mechanical planarization Apr. 7, 1998
5710069 Measuring slurry particle size during substrate polishing Jan. 20, 1998
5700379 Method for drying micromechanical components Dec. 23, 1997

1 2 3 4

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