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Class Information
Number: 438/747
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching > With relative movement between substrate and confined pool of etchant
Description: Processes including the step of causing a relative motion between the semiconductor substrate being etched and the liquid phase etchant which is confined by a container.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6528425 |
Method and apparatus for processing substrate surface with striped ridge patterns |
Mar. 4, 2003 |
| 6495472 |
Method for avoiding erosion of conductor structure during removing etching residues |
Dec. 17, 2002 |
| 6489251 |
Method of forming a slope lateral structure |
Dec. 3, 2002 |
| 6482751 |
Titanium dioxide layer serving as a mask and its removed method |
Nov. 19, 2002 |
| 6458712 |
Method for regenerating semiconductor wafers |
Oct. 1, 2002 |
| 6440871 |
Gas assisted method for applying resist stripper and gas-resist stripper combinations |
Aug. 27, 2002 |
| 6413355 |
Apparatus for and method of cleaning objects to be processed |
Jul. 2, 2002 |
| 6403496 |
Method for forming shallow trench isolations |
Jun. 11, 2002 |
| 6399480 |
Methods and arrangements for insulating local interconnects for improved alignment tolerance and size reduction |
Jun. 4, 2002 |
| 6399517 |
Etching method and etching apparatus |
Jun. 4, 2002 |
| 6395646 |
Machine for etching the edge of a wafer and method of etching the edge of a wafer |
May. 28, 2002 |
| 6387822 |
Application of an ozonated DI water spray to resist residue removal processes |
May. 14, 2002 |
| 6387821 |
Method of manufacturing a semiconductor device |
May. 14, 2002 |
| 6380099 |
Porous region removing method and semiconductor substrate manufacturing method |
Apr. 30, 2002 |
| 6376390 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer |
Apr. 23, 2002 |
| 6361708 |
Method and apparatus for polishing a metal film |
Mar. 26, 2002 |
| 6358847 |
Method for enabling conventional wire bonding to copper-based bond pad features |
Mar. 19, 2002 |
| 6358861 |
Manufacturing method of silicon device |
Mar. 19, 2002 |
| 6333275 |
Etchant mixing system for edge bevel removal of copper from silicon wafers |
Dec. 25, 2001 |
| 6319846 |
Method for removing solder bodies from a semiconductor wafer |
Nov. 20, 2001 |
| 6313043 |
Manufacture of field emission element |
Nov. 6, 2001 |
| 6303514 |
Composition and method for selectively etching a silicon nitride film |
Oct. 16, 2001 |
| 6300156 |
Process for fabricating micromechanical devices |
Oct. 9, 2001 |
| 6294478 |
Fabrication process for a semiconductor substrate |
Sep. 25, 2001 |
| 6281130 |
Method for developing ultra-thin resist films |
Aug. 28, 2001 |
| 6265323 |
Substrate processing method and apparatus |
Jul. 24, 2001 |
| 6238590 |
Tribochemical polishing of ceramics and metals |
May. 29, 2001 |
| 6224713 |
Method and apparatus for ultrasonic wet etching of silicon |
May. 1, 2001 |
| 6221785 |
Method for forming shallow trench isolations |
Apr. 24, 2001 |
| 6211087 |
Chemical wet etch removal of underlayer material after performing chemical mechanical polishing on a primary layer |
Apr. 3, 2001 |
| 6171975 |
Wet-chemical treatment method, treatment method of semiconductor substrate, and manufacturing method of semiconductor device |
Jan. 9, 2001 |
| 6169038 |
Method for rough-etching a semiconductor surface |
Jan. 2, 2001 |
| 6162739 |
Process for wet etching of semiconductor wafers |
Dec. 19, 2000 |
| 6146924 |
Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process |
Nov. 14, 2000 |
| 6127281 |
Porous region removing method and semiconductor substrate manufacturing method |
Oct. 3, 2000 |
| 6127280 |
Photoelectrochemical capacitance-voltage measurements of wide bandgap semiconductors |
Oct. 3, 2000 |
| 6124207 |
Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries |
Sep. 26, 2000 |
| 6121147 |
Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance |
Sep. 19, 2000 |
| 6093658 |
Method for making reliable interconnect structures |
Jul. 25, 2000 |
| 6090720 |
Wet etching method for silicon semiconductor wafer |
Jul. 18, 2000 |
| 6083838 |
Method of planarizing a surface on a semiconductor wafer |
Jul. 4, 2000 |
| 6074950 |
Alignment strategy for asymmetrical alignment marks |
Jun. 13, 2000 |
| 6066571 |
Method of preparing semiconductor surface |
May. 23, 2000 |
| 6040110 |
Process and apparatus for the removal of resist |
Mar. 21, 2000 |
| 6033987 |
Method for mapping and adjusting pressure distribution of CMP processes |
Mar. 7, 2000 |
| 6010964 |
Wafer surface treatment methods and systems using electrocapillarity |
Jan. 4, 2000 |
| 6008119 |
Chemical-mechanical polishing of semiconductor wafers |
Dec. 28, 1999 |
| 5968849 |
Method for pre-shaping a semiconductor substrate for polishing and structure |
Oct. 19, 1999 |
| 5952243 |
Removal rate behavior of spin-on dielectrics with chemical mechanical polish |
Sep. 14, 1999 |
| 5945347 |
Apparatus and method for polishing a semiconductor wafer in an overhanging position |
Aug. 31, 1999 |
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