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Class Information
Number: 438/745
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching
Description: Processes wherein the chemical etchant is in a liquid state when brought into contact with the semiconductive substrate.


Sub-classes under this class:

Class Number Class Name Patents
438/754 Electrically conductive material (e.g., metal, conductive oxide, etc.) 390
438/752 Germanium 100
438/748 Projection of etchant against a moving substrate or controlling the angle or pattern of projected etchant 129
438/749 Sequential application of etchant 150
438/757 Silicon nitride 218
438/756 Silicon oxide 422
438/753 Silicon 427
438/746 Utilizing electromagnetic or wave energy 85
438/747 With relative movement between substrate and confined pool of etchant 143


Patents under this class:

Patent Number Title Of Patent Date Issued
6783694 Composition for selectively etching against cobalt silicide Aug. 31, 2004
6783695 Acid blend for removing etch residue Aug. 31, 2004
6784084 Method for fabricating semiconductor device capable of reducing seam generations Aug. 31, 2004
6779247 Method of producing suspended elements for electrical connection between two portions of a micromechanism which can move relative to one another Aug. 24, 2004
6780739 Bit line contact structure and method for forming the same Aug. 24, 2004
6780751 Method for eliminating voiding in plated solder Aug. 24, 2004
6780776 Nitride offset spacer to minimize silicon recess by using poly reoxidation layer as etch stop layer Aug. 24, 2004
6780780 Method for removing Si-needles of wafer Aug. 24, 2004
6780783 Method of wet etching low dielectric constant materials Aug. 24, 2004
6780784 Etchant and array substrate having copper lines etched by the etchant Aug. 24, 2004
6780785 Self-aligned structure with unique erasing gate in split gate flash Aug. 24, 2004
6780786 Method for producing a porous silicon film Aug. 24, 2004
6776919 Method and apparatus for etching ruthenium films Aug. 17, 2004
6777299 Method for removal of a spacer Aug. 17, 2004
6777334 Method for protecting a wafer backside from etching damage Aug. 17, 2004
6774047 Method of manufacturing a semiconductor integrated circuit device Aug. 10, 2004
6770564 Method of etching metallic thin film on thin film resistor Aug. 3, 2004
6770565 System for planarizing metal conductive layers Aug. 3, 2004
6767751 Integrated driver process flow Jul. 27, 2004
6767840 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method Jul. 27, 2004
6767841 Process for producing a semiconductor wafer Jul. 27, 2004
6762132 Compositions for dissolution of low-K dielectric films, and methods of use Jul. 13, 2004
6762133 System and method for control of hardmask etch to prevent pattern collapse of ultra-thin resists Jul. 13, 2004
6762134 Metal-assisted chemical etch to produce porous group III-V materials Jul. 13, 2004
6759343 Method and composition for selectively etching against cobalt silicide Jul. 6, 2004
6755989 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Jun. 29, 2004
6756284 Method for forming a sublithographic opening in a semiconductor process Jun. 29, 2004
6756316 Semiconductor pressure transducer structures and methods for making the same Jun. 29, 2004
6756317 Method for making a microstructure by surface micromachining Jun. 29, 2004
6753237 Method of shallow trench isolation fill-in without generation of void Jun. 22, 2004
6750148 Method of manufacturing wireless suspension blank Jun. 15, 2004
6750153 Process for producing macroscopic cavities beneath the surface of a silicon wafer Jun. 15, 2004
6750154 Gas assisted method for applying resist stripper and gas-resist stripper combinations Jun. 15, 2004
6746621 Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board Jun. 8, 2004
6746959 Liquid crystal display and method Jun. 8, 2004
6746963 Method for processing coating film and method for manufacturing semiconductor element with use of the same method Jun. 8, 2004
6743697 Thin silicon circuits and method for making the same Jun. 1, 2004
6740252 Ruthenium silicide wet etch May. 25, 2004
6740411 Embedding resin, wiring substrate using same and process for producing wiring substrate using same May. 25, 2004
6740595 Etch process for recessing polysilicon in trench structures May. 25, 2004
6737334 Method of fabricating a shallow trench isolation structure May. 18, 2004
6737356 Method of fabricating a semiconductor work object May. 18, 2004
6737359 Method of forming a shallow trench isolation using a sion anti-reflective coating which eliminates water spot defects May. 18, 2004
6737360 Controlled potential anodic etching process for the selective removal of conductive thin films May. 18, 2004
6734112 Divided pressure vessel apparatus for carbon dioxide based systems and methods of using same May. 11, 2004
6730239 Cleaning agent for semiconductor device & method of fabricating semiconductor device May. 4, 2004
6730602 Method for forming aluminum bumps by sputtering and chemical mechanical polishing May. 4, 2004
6730605 Redistribution of copper deposited films May. 4, 2004
6730612 Spray member and method for using the same May. 4, 2004
6726848 Apparatus and method for single substrate processing Apr. 27, 2004



 
 
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