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Class Information
Number: 438/745
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching
Description: Processes wherein the chemical etchant is in a liquid state when brought into contact with the semiconductive substrate.


Sub-classes under this class:

Class Number Class Name Patents
438/754 Electrically conductive material (e.g., metal, conductive oxide, etc.) 390
438/752 Germanium 100
438/748 Projection of etchant against a moving substrate or controlling the angle or pattern of projected etchant 129
438/749 Sequential application of etchant 150
438/757 Silicon nitride 218
438/756 Silicon oxide 422
438/753 Silicon 427
438/746 Utilizing electromagnetic or wave energy 85
438/747 With relative movement between substrate and confined pool of etchant 143


Patents under this class:

Patent Number Title Of Patent Date Issued
6046112 Chemical mechanical polishing slurry Apr. 4, 2000
6046113 Combined dry and wet etch for improved silicide formation Apr. 4, 2000
6046117 Process for etching semiconductor wafers Apr. 4, 2000
6042736 Method for preparing samples for microscopic examination Mar. 28, 2000
6043154 Method for manufacturing charge storage electrode Mar. 28, 2000
6037269 Etching methods of silicon nitride films employed in microelectronic devices Mar. 14, 2000
6032682 Method for sulfuric acid resist stripping Mar. 7, 2000
6033989 Device for and method of concentrating chemical substances for semiconductor fabrication Mar. 7, 2000
6033993 Process for removing residues from a semiconductor substrate Mar. 7, 2000
6028010 Style gas ring with a guard extension Feb. 22, 2000
6028011 Method of forming electric pad of semiconductor device and method of forming solder bump Feb. 22, 2000
6025278 Methods for manufacturing semiconductive wafers and semiconductive material stencil masks Feb. 15, 2000
6017827 System and method for mixing a gas into a solvent used in semiconductor processing Jan. 25, 2000
6001216 Apparatus and methods for rerecirculating etching solution during semiconductor wafer processing Dec. 14, 1999
6001743 Method for fabricating a self-aligned contact Dec. 14, 1999
6001744 Method of cleaning a surface of a compound semiconductor crystal of group II-VI elements of periodic table Dec. 14, 1999
5999235 Liquid crystal displaying apparatus and method of manufacturing TFT array Dec. 7, 1999
5994239 Manufacturing process to eliminate polystringers in high density nand-type flash memory devices Nov. 30, 1999
5989952 Method for fabricating a crown-type capacitor of a DRAM cell Nov. 23, 1999
5990021 Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture Nov. 23, 1999
5980633 Process for producing a semiconductor substrate Nov. 9, 1999
5981400 Compliant universal substrate for epitaxial growth Nov. 9, 1999
5981401 Method for selective etching of anitreflective coatings Nov. 9, 1999
5976983 Method of cleaning semiconductor wafers after lapping Nov. 2, 1999
5976988 Etching material and etching method Nov. 2, 1999
5968848 Process for treating a lithographic substrate and a rinse solution for the treatment Oct. 19, 1999
5970315 Microelectromechanical structure and process of making same Oct. 19, 1999
5965465 Etching of silicon nitride Oct. 12, 1999
5958797 Planarization of a patterned structure on a substrate using an ion implantation-assisted wet chemical etch Sep. 28, 1999
5952242 Method and device for removing a semiconductor wafer from a flat substrate Sep. 14, 1999
5949123 Solar cell including multi-crystalline silicon and a method of texturizing the surface of p-type multi-crystalline silicon Sep. 7, 1999
5945351 Method for etching damaged zones on an edge of a semiconductor substrate, and etching system Aug. 31, 1999
5942131 Treatment of a surface having an expose silicon/silica interface Aug. 24, 1999
5942448 Method of making contacts on an integrated circuit Aug. 24, 1999
5942449 Method for removing an upper layer of material from a semiconductor wafer Aug. 24, 1999
5939336 Aqueous solutions of ammonium fluoride in propylene glycol and their use in the removal of etch residues from silicon substrates Aug. 17, 1999
5935869 Method of planarizing semiconductor wafers Aug. 10, 1999
5932493 Method to minimize watermarks on silicon substrates Aug. 3, 1999
5928968 Semiconductor pressure transducer structures and methods for making the same Jul. 27, 1999
5930676 Multilayered interconnection substrate and process for fabricating the same Jul. 27, 1999
5925213 Wet processing apparatus with movable partitioning plate between two processing chambers Jul. 20, 1999
5919715 Method for cleaning a semiconductor surface Jul. 6, 1999
5914052 Wet etch method and apparatus Jun. 22, 1999
5910257 Process for producing a semiconductor device using purified phosphoric acid Jun. 8, 1999
5904156 Dry film resist removal in the presence of electroplated C4's May. 18, 1999
5904572 Wet etching station and a wet etching method adapted for utilizing the same May. 18, 1999
5885901 Rinsing solution after resist stripping process and method for manufacturing semiconductor device Mar. 23, 1999
5882950 Fabrication method for horizontal direction semiconductor PN junction array Mar. 16, 1999
5883012 Method of etching a trench into a semiconductor substrate Mar. 16, 1999
5879572 Method of protecting silicon wafers during wet chemical etching Mar. 9, 1999



 
 
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