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Class Information
Number: 438/745
Name: Semiconductor device manufacturing: process > Chemical etching > Liquid phase etching
Description: Processes wherein the chemical etchant is in a liquid state when brought into contact with the semiconductive substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6429144 |
Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch |
Aug. 6, 2002 |
| 6429145 |
Method of determining electrical properties of silicon-on-insulator wafers |
Aug. 6, 2002 |
| 6426295 |
Reduction of surface roughness during chemical mechanical planarization(CMP) |
Jul. 30, 2002 |
| 6426296 |
Method and apparatus for obtaining a precision thickness in semiconductor and other wafers |
Jul. 30, 2002 |
| 6423641 |
Method of making self-aligned bit-lines |
Jul. 23, 2002 |
| 6420275 |
System and method for analyzing a semiconductor surface |
Jul. 16, 2002 |
| 6413355 |
Apparatus for and method of cleaning objects to be processed |
Jul. 2, 2002 |
| 6413872 |
Method op optimizing vias between conductive layers in an integrated circuit structure |
Jul. 2, 2002 |
| 6413873 |
System for chemical mechanical planarization |
Jul. 2, 2002 |
| 6413878 |
Method of manufacturing electronic components |
Jul. 2, 2002 |
| 6413923 |
Non-corrosive cleaning composition for removing plasma etching residues |
Jul. 2, 2002 |
| 6410416 |
Article comprising a high-resolution pattern on a non-planar surface and method of making the same |
Jun. 25, 2002 |
| 6410436 |
Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
Jun. 25, 2002 |
| 6410442 |
Mask-less differential etching and planarization of copper films |
Jun. 25, 2002 |
| 6410494 |
Cleaning agent |
Jun. 25, 2002 |
| 6406998 |
Formation of silicided contact by ion implantation |
Jun. 18, 2002 |
| 6407005 |
Method for forming semiconductor device to prevent electric field concentration from being generated at corner of active region |
Jun. 18, 2002 |
| 6403385 |
Method of inspecting a semiconductor wafer for defects |
Jun. 11, 2002 |
| 6403484 |
Method to achieve STI planarization |
Jun. 11, 2002 |
| 6403496 |
Method for forming shallow trench isolations |
Jun. 11, 2002 |
| 6399499 |
Method for fabricating an electrode of a plasma chamber |
Jun. 4, 2002 |
| 6399502 |
Process for fabricating a planar heterostructure |
Jun. 4, 2002 |
| 6399517 |
Etching method and etching apparatus |
Jun. 4, 2002 |
| 6395572 |
Method of producing semiconductor light-emitting element |
May. 28, 2002 |
| 6395626 |
Method of forming bonding projecting electrodes |
May. 28, 2002 |
| 6395638 |
Method for producing a micromembrane pump body |
May. 28, 2002 |
| 6395640 |
Apparatus and method for selectivity restricting process fluid flow in semiconductor processing |
May. 28, 2002 |
| 6395645 |
Anisotropic wet etching |
May. 28, 2002 |
| 6395646 |
Machine for etching the edge of a wafer and method of etching the edge of a wafer |
May. 28, 2002 |
| 6391782 |
Process for forming multiple active lines and gate-all-around MOSFET |
May. 21, 2002 |
| 6391793 |
Compositions for etching silicon with high selectivity to oxides and methods of using same |
May. 21, 2002 |
| 6391794 |
Composition and method for cleaning residual debris from semiconductor surfaces |
May. 21, 2002 |
| 6387813 |
Method for stripping a low dielectric film with high carbon content |
May. 14, 2002 |
| 6387821 |
Method of manufacturing a semiconductor device |
May. 14, 2002 |
| 6387822 |
Application of an ozonated DI water spray to resist residue removal processes |
May. 14, 2002 |
| 6383410 |
Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent |
May. 7, 2002 |
| 6383931 |
Convertible hot edge ring to improve low-K dielectric etch |
May. 7, 2002 |
| 6383933 |
Method of using organic material to enhance STI planarization or other planarization processes |
May. 7, 2002 |
| 6383934 |
Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
May. 7, 2002 |
| 6379980 |
Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination |
Apr. 30, 2002 |
| 6379990 |
Method of fabricating a micromechanical semiconductor configuration |
Apr. 30, 2002 |
| 6380089 |
Method of manufacturing semiconductor device |
Apr. 30, 2002 |
| 6380097 |
Method for obtaining a sulfur-passivated semiconductor surface |
Apr. 30, 2002 |
| 6380098 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Apr. 30, 2002 |
| 6375792 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer |
Apr. 23, 2002 |
| 6376353 |
Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects |
Apr. 23, 2002 |
| 6376372 |
Approaches for mitigating the narrow poly-line effect in silicide formation |
Apr. 23, 2002 |
| 6376380 |
Method of forming memory circuitry and method of forming memory circuitry comprising a buried bit line array of memory cells |
Apr. 23, 2002 |
| 6376390 |
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer |
Apr. 23, 2002 |
| 6372081 |
Process to prevent copper contamination of semiconductor fabs |
Apr. 16, 2002 |
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